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NX3L2267GM-Q100X

NXP Semiconductors

NX3L2267GM-Q100X by NXP Semiconductors

NX3L2267GM-Q100X by NXP Semiconductors is a CMOS SPDT multiplexer designed for automotive applications. It features a max operating temp of 125 °C, low on-state resistance of 4.1Ω, and operates with power supplies from 1.4V to 4.3V. Ideal for compact, reliable switching in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 2,837 parts In-Stock

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Digiode

USA . 2,666 parts In-Stock

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Anansix

USA . 100 parts In-Stock

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One Stop Electronics

USA . 1,216 parts In-Stock

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$0.500

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AZTECH Wire

Italy . 80 parts In-Stock

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$20.490

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$24.152

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$21.978

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$19.805

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QUARKTWIN TECHNOLOGY LTD

USA . 10,723 parts In-Stock

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Microchip USA

USA . 4,290 parts In-Stock

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Corphita

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UNI Independent Distributors

Spain . 939 parts In-Stock

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Overview

Elevate your designs with the NX3L2267GM-Q100X from NXP Semiconductors, a leader in high-quality automotive solutions. This versatile multiplexer offers exceptional reliability and performance across demanding applications, ensuring seamless operation even in extreme temperatures. With its compact design and rapid switching capabilities, it delivers unmatched efficiency and precision, empowering engineers to innovate confidently while reducing time-to-market. Choose NXP for trusted excellence in every connection.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and lightweight characteristics, making it suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easier and more efficient integration into compact circuit designs.

No. of Functions: 2

Having two functions in one device provides flexibility and reduces the need for multiple components, saving space and costs.

Screening Level: AEC-Q100

AEC-Q100 certification indicates high reliability in automotive applications, ensuring consistent performance under harsh conditions.

Package Shape: RECTANGULAR

The rectangular shape allows for a compact footprint, ideal for fitting into space-constrained designs.

Power Supplies (V): 1.4/4.3

Wide power supply range makes this product versatile, suitable for various operating environments.

No. of Terminals: 10

With 10 terminals, it allows for multiple connections, providing flexibility in circuit design.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging facilitates efficient heat dissipation and robust connection methods.

Maximum Operating Temperature: 125 °C

High max operating temperature enhances reliability in extreme thermal conditions.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures operational stability in cold environments, making it suitable for automotive use.

Terminal Position: QUAD

Quad terminal positioning optimizes layout options and simplifies routing in PCB designs.

Output (V): SEPARATE OUTPUT

Separate output capabilities support various functionalities, allowing for individual control of outputs.

Other IC type: SPDT

Single-pole double-throw (SPDT) configuration provides versatility in switching applications.

Maximum On-state Resistance (Ron): 4.1 ohm

Low on-state resistance minimizes power loss and heat generation, enhancing energy efficiency.

Maximum Switch-on Time: 90 ns

Fast switch-on times improve responsiveness in electronic systems, making it suitable for high-speed applications.

Temperature Grade: AUTOMOTIVE

Designed specifically for automotive applications, ensuring reliability under varying temperature conditions.

Technology: CMOS

CMOS technology ensures low power consumption while achieving high performance, ideal for battery-operated devices.

Terminal Form: NO LEAD

No lead design reduces size and allows for more compact PCB layouts, improving space efficiency.

Terminal Pitch: 0.5 mm

Small terminal pitch enables tighter spacing on PCBs, ideal for modern electronic designs.

Switching (V): BREAK-BEFORE-MAKE

Break-before-make switching architecture prevents shorts and potential damage during transitions, enhancing circuit reliability.

Technical Specifications

Multiplexers & Switches NX3L2267GM-Q100X attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PQCC-N10

No. of Functions:

2

No. of Terminals:

10

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.08,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Screening Level:

AEC-Q100

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NX3L2267GM-Q100X Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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