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NX3L2267GM,132

NXP Semiconductors

NX3L2267GM,132 by NXP Semiconductors

NX3L2267GM,132 from NXP Semiconductors is a CMOS multiplexer with a max operating temp of 125 °C and operates b/w 1.4V to 4.3V. It features low on-state resistance (4.1Ω) and fast switch-on time (90ns). Ideal for automotive applications requiring reliable signal routing.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,710 parts In-Stock

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3,710

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Digiode

USA . 2,618 parts In-Stock

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2,618

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Anansix

USA . 1,710 parts In-Stock

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1,710

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Distributors (Availability)

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One Stop Electronics

USA . 1,203 parts In-Stock

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$4.500

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AZTECH Wire

Italy . 1,146 parts In-Stock

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$22.110

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QUARKTWIN TECHNOLOGY LTD

USA . 10,713 parts In-Stock

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10,713

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Corphita

USA . 4,835 parts In-Stock

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UNI Independent Distributors

Spain . 4,780 parts In-Stock

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Microchip USA

USA . 3,576 parts In-Stock

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Overview

Unlock unparalleled performance with the NX3L2267GM,132 from NXP Semiconductors. Renowned for their innovative solutions, NXP delivers high-quality multiplexers designed for reliability in demanding environments. This versatile component excels in automotive applications, offering quick switching and low resistance to enhance efficiency. Trust in a leader that prioritizes quality and performance, ensuring your designs achieve optimal results every time.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material contributes to the device's long lifespan and reliability in various environments.

Surface Mount: YES

Surface mount technology (SMT) enhances the device's compactness and allows for high-density circuit board designs.

No. of Functions: 2

Offering dual functionality allows for more versatile applications, making the product suitable for various operational needs.

Package Shape: RECTANGULAR

The rectangular shape enables efficient space utilization on circuit boards for optimal layout.

Power Supplies (V): 1.4/4.3

The capability to operate within a wide voltage range offers flexibility for various power supply configurations.

No. of Terminals: 10

With ten terminals, this product provides ample connectivity options, ideal for more complex designs.

Package Style (Meter): CHIP CARRIER

Chip carrier packaging helps in efficient thermal management and signal integrity, crucial for high-performance applications.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature indicates robustness, making it suitable for challenging automotive environments.

Minimum Operating Temperature: -40 °C

The ability to function in extremely low temperatures enhances the reliability of the product in outdoor and harsh conditions.

Terminal Finish: MATTE TIN

The matte tin finish provides better solderability and corrosion resistance, ensuring durable connections.

Terminal Position: QUAD

Quad terminal positioning ensures excellent connectivity and helps in efficient routing on PCB layouts.

Output (V): SEPARATE OUTPUT

Separate output capability allows for better control and isolation in multi-functional applications.

Maximum On-state Resistance (Ron): 4.1 Ω

A low on-state resistance minimizes power loss and heat generation, maximizing efficiency in operations.

Maximum Switch-on Time: 90 ns

Fast switch-on time enhances the performance and responsiveness of applications, critical for high-speed operations.

Temperature Grade: AUTOMOTIVE

Specifically graded for automotive applications, ensuring reliability and safety in vehicles.

Technology: CMOS

CMOS technology offers lower power consumption and higher integration, beneficial for modern electronic systems.

Terminal Form: NO LEAD

Lead-free design not only complies with environmental regulations but also improves manufacturing efficiency.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for tighter placements on PCBs, crucial for space-constrained designs.

Switching (V): BREAK-BEFORE-MAKE

The break-before-make switching prevents short circuits, ensuring stable transitions in signal routing.

Technical Specifications

Multiplexers & Switches NX3L2267GM,132 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PQCC-N10

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

10

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC10,.06X.08,20

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Trade Compliance

NX3L2267GM,132 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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