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NX3L1T384GM,115

NXP Semiconductors

NX3L1T384GM,115 by NXP Semiconductors

NX3L1T384GM,115 from NXP Semiconductors is a compact CMOS multiplexer designed for automotive applications. It operates b/w 1.4V and 4.3V with a max on-state resistance of 4.1Ω and can withstand temperatures from -40 °C to 125 °C. Its dual terminal design ensures efficient switching with a fast response time of 90ns.

Median Price

$0.430

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

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DigiKey

USA . 1 parts In-Stock

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Digiode

USA . 215 parts In-Stock

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$0.390

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Vyrian

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Anansix

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Vigor

Singapore . 63,707 parts In-Stock

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Ampacity Inc.

Singapore . 1 parts In-Stock

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Corphita

USA . 678 parts In-Stock

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$0.369

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Component Stockers USA

USA . 4 parts In-Stock

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$0.520

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Microchip USA

USA . 114 parts In-Stock

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Perfect Parts

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Overview

Unlock unparalleled performance with the NX3L1T384GM,115 from NXP Semiconductors—a trusted leader in innovation. This compact multiplexer seamlessly integrates into automotive applications, offering robust reliability from -40 °C to 125 °C. Its advanced CMOS technology ensures minimal resistance and rapid switching for superior efficiency. Choose NXP for quality you can count on and give your designs the competitive edge they deserve!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures the component can withstand challenging environments, contributing to its reliability.

Surface Mount: YES

Surface mount technology allows for compact design and is suitable for automated manufacturing processes, enhancing production efficiency.

Package Shape: RECTANGULAR

The rectangular shape provides an efficient footprint for PCB space utilization.

Power Supplies (V): 1.4/4.3

Wide supply voltage range makes the product versatile for various applications and power management requirements.

No. of Terminals: 6

Having 6 terminals enhances connectivity options, making it suitable for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for space-constrained applications, enabling high-density circuit layouts.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature ensures the component can function in demanding thermal environments without failure.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature makes this device suitable for use in harsh environments, including automotive applications.

Terminal Finish: Tin (Sn)

Tin finish offers good solderability and corrosion resistance, ensuring reliable connections.

Terminal Position: DUAL

Dual terminal positioning allows for flexible circuit design and easier integration into existing layouts.

Maximum Time At Peak Reflow Temperature: 30 seconds

The short maximum time at peak reflow temperature minimizes thermal stress on the device during soldering.

Peak Reflow Temperature: 260 °C

The high peak reflow temperature capability supports compatibility with various soldering methods, ensuring robust assembly.

Maximum On-state Resistance (Ron): 4.1 ohm

Low on-state resistance enhances signal integrity and minimizes power loss, which is crucial for efficient performance.

Maximum Switch-on Time: 90 ns

Fast switch-on time enables effective high-speed signal switching, suitable for fast applications.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive standards, ensuring reliability in automotive applications where performance is critical.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for efficient operation.

Terminal Form: NO LEAD

No lead design minimizes footprint and helps in meeting environmental regulations by reducing lead content.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for high-density layouts, accommodating more functionality in a smaller area.

Switching: BREAK-BEFORE-MAKE

Break-before-make switching ensures that there is no electrical short during transitions, enhancing circuit safety and reliability.

Technical Specifications

Multiplexers & Switches NX3L1T384GM,115 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum On-state Resistance (Ron):

4.1 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SON

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.4/4.3

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Maximum Switch-on Time:

90 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NX3L1T384GM,115 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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