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NX3L1T3157GM,132

NXP Semiconductors

NX3L1T3157GM,132 by NXP Semiconductors

SPDT; Temperature Grade: AUTOMOTIVE; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR; Surface Mount: YES;

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 25,000 parts In-Stock

1+ parts

$0.090

100+ parts

$0.090

1k+ parts

$0.090

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-

25,000

$0.090

$0.090

$0.090

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,758 parts In-Stock

1+ parts

$0.086

100+ parts

-

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-

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4,758

$0.086

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Vyrian

USA . 7,616 parts In-Stock

1+ parts

-

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-

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7,616

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Anansix

USA . 169 parts In-Stock

1+ parts

-

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169

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,015 parts In-Stock

1+ parts

$0.081

100+ parts

-

1k+ parts

-

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2,015

$0.081

-

-

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Vigor

Singapore . 23,690 parts In-Stock

1+ parts

$0.100

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23,690

$0.100

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AZTECH Wire

Italy . 244 parts In-Stock

1+ parts

$9.180

100+ parts

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244

$9.180

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$23.468

100+ parts

$21.356

1k+ parts

$19.244

10k+ parts

-

3,000

$23.468

$21.356

$19.244

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Component Stockers USA

USA . 275 parts In-Stock

1+ parts

$99.990

100+ parts

-

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275

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 11,353 parts In-Stock

1+ parts

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11,353

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Microchip USA

USA . 3,989 parts In-Stock

1+ parts

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3,989

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UNI Independent Distributors

Spain . 269 parts In-Stock

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269

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Technical Specifications

Multiplexers & Switches NX3L1T3157GM,132 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

90 dB

Nominal On-state Resistance Match:

.04 ohm

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

90 ns

Maximum Switch-on Time:

120 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1 mm

Trade Compliance

NX3L1T3157GM,132 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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