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NX3L1G66GM,132

NXP Semiconductors

NX3L1G66GM,132 by NXP Semiconductors

NXP Semiconductors' NX3L1G66GM,132 is a SPST switch with 6 terminals and CMOS technology. It operates at -40 to 125 °C with Vsup ranging from 1.4V to 4.3V. With a max on-state resistance of 1.7 ohm, it's ideal for automotive applications requiring fast switching times and high isolation levels up to 90 dB.

Median Price

$0.090

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 100,000 parts In-Stock

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$0.090

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$0.090

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$0.090

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$0.090

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Digiode

USA . 98 parts In-Stock

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$0.086

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98

$0.086

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Vyrian

USA . 4,206 parts In-Stock

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Anansix

USA . 2,619 parts In-Stock

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Nova Conductors

Japan . 26 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,370 parts In-Stock

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$0.081

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Vigor

Singapore . 100,000 parts In-Stock

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$0.100

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Microchip USA

USA . 114 parts In-Stock

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$0.598

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114

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AZTECH Wire

Italy . 598 parts In-Stock

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$15.600

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Perfect Parts

USA . 22,400 parts In-Stock

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UNI Independent Distributors

Spain . 4,284 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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Overview

Discover the innovative NX3L1G66GM,132 by NXP Semiconductors, a high-quality multiplexer and switch designed to meet your electronics needs. With NXP Semiconductors' reputation for excellence in manufacturing, this product offers reliable performance and versatility. Perfect for automotive applications, this small outline, very thin profile switch provides separate outputs and fast switching times, ensuring seamless operation. Upgrade your projects with the NX3L1G66GM,132 and experience the value and benefits that only NXP Semiconductors can deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material ensures durability and protection for the internal components of the multiplexer or switch.

Surface Mount: YES

Being surface mountable makes it easy to integrate the multiplexer or switch onto a PCB, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 1.65 V

The low nominal supply voltage of 1.65 V makes this product suitable for low-power applications, reducing energy consumption.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand higher temperatures, making it suitable for a wide range of environments.

Technology: CMOS

The CMOS technology used in this product ensures high speed and low power consumption, making it a reliable and efficient choice for multiplexing or switching applications.

Technical Specifications

Multiplexers & Switches NX3L1G66GM,132 attributes and parameters. Explore more Multiplexers & Switches devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

6

Nominal Off-state Isolation:

90 dB

Maximum On-state Resistance (Ron):

1.7 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.5/3.3

Qualification:

Not Qualified

Maximum Seated Height:

.5 mm

Sub-Category:

Multiplexer or Switches

Maximum Supply Voltage (Vsup):

4.3 V

Minimum Supply Voltage (Vsup):

1.4 V

Nominal Supply Voltage (Vsup):

1.65 V

Surface Mount:

YES

Maximum Switch-off Time:

21 ns

Maximum Switch-on Time:

48 ns

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Tin (Sn)

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

1 mm

Trade Compliance

NX3L1G66GM,132 Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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