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NTSX2102GDH

NXP Semiconductors

NTSX2102GDH by NXP Semiconductors

NTSX2102GDH by NXP Semiconductors is a bus driver & transceiver with 2 bits, 8 terminals, and a propagation delay of 12 ns. It is used in industrial applications for open-drain output characteristics.

Median Price

$0.416

Lifecycle Status

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9

In-Stock Inventory

1k+

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Nova Conductors

Japan . 300 parts In-Stock

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$0.383

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Chip Stock

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Vyrian

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DigiKey Marketplace

USA . 1,891 parts In-Stock

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Digiode

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Prism Electronics

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Netroflash

USA . 100 parts In-Stock

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$0.383

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$0.363

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$0.356

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Vigor

Singapore . 173 parts In-Stock

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$0.800

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Andel Nordic

Denmark . 3,940 parts In-Stock

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$2.596

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$2.492

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Microchip USA

USA . 232 parts In-Stock

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$3.240

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$3.240

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One Stop Electronics

USA . 279 parts In-Stock

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$8.000

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AZTECH Wire

Italy . 856 parts In-Stock

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Ampacity Inc.

Singapore . 196 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Corphita

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Authorized Procurement Solutions

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UNI Independent Distributors

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Perfect Parts

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Overview

Discover the NTSX2102GDH by NXP Semiconductors, a high-quality bus driver and transceiver that offers unmatched performance and reliability. Manufactured by NXP Semiconductors, a renowned industry leader, this product is designed to meet the needs of various applications. With its compact and durable design, it provides customers with exceptional value and benefits. Experience seamless communication and efficient data transfer with the NTSX2102GDH. Trust in NXP Semiconductors for top-notch technology solutions that enhance your projects and drive success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides increased durability and resistance, making this product suitable for various environmental conditions.

Surface Mount: YES

The surface mount capability allows for easy integration onto circuit boards, ensuring efficient assembly and space-saving design.

No. of Functions: 1

With its single function, this bus driver & transceiver simplifies circuitry and enhances overall reliability.

Package Shape: RECTANGULAR

The rectangular package shape enables efficient utilization of space on circuit boards, optimizing layout and facilitating seamless integration.

No. of Bits: 2

With a 2-bit capacity, this bus driver & transceiver enables effective data transmission and processing for versatile applications.

Nominal Supply Voltage / Vsup (V): 1.8

Operating at a low nominal supply voltage of 1.8V minimizes power consumption and enhances energy efficiency.

No. of Terminals: 8

The 8-terminal configuration provides ample connectivity options, ensuring compatibility across different systems and circuits.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The small outline and thin profile of this package style contribute to compact designs, making it an ideal choice for space-constrained applications.

Propagation Delay (tpd): 12 ns

With a propagation delay of only 12 ns, this bus driver & transceiver ensures fast and efficient data transmission, reducing latency and enhancing system performance.

Maximum Operating Temperature: 85 °C

The product's capability to operate at high temperatures up to 85°C ensures reliability and stability even in demanding environments.

Output Characteristics: OPEN-DRAIN

The open-drain output characteristics allow for flexible connection configurations and compatibility with various devices, maximizing versatility.

Minimum Operating Temperature: -40 °C

Operating in temperatures as low as -40°C ensures reliable performance even in harsh conditions or cold environments.

Terminal Position: DUAL

The dual terminal position facilitates easy and secure connections, ensuring stable and efficient signal transmission.

No. of Ports: 2

With dual ports, this bus driver & transceiver enables simultaneous communication between multiple devices, increasing flexibility and system efficiency.

Maximum Seated Height: 0.5 mm

The extremely low maximum seated height of 0.5 mm allows for compact and streamlined design layouts, optimizing space utilization in electronic systems.

Width: 2 mm

With a narrow width of 2 mm, this bus driver & transceiver can fit into tight spaces, providing designers with more flexibility in their circuit board layouts.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission, enabling seamless integration with a wide range of systems and devices.

Minimum Supply Voltage (Vsup): 1.65 V

The low minimum supply voltage requirement of 1.65V allows the product to operate in power-constrained environments or with lower voltage power sources.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance of 260°C ensures reliable soldering during assembly processes, contributing to overall product quality and durability.

Length: 3 mm

The compact length of 3 mm offers space-saving advantages, allowing for efficient board design and maximizing layout flexibility.

Temperature Grade: INDUSTRIAL

The industrial temperature grade designation indicates that this product is specifically designed to withstand harsh industrial environments, ensuring long-term reliability and durability.

Terminal Form: NO LEAD

The no-lead terminal form simplifies assembly processes and enhances mechanical and electrical stability, improving product reliability and performance.

Packing Method: TR, 7 INCH

The use of tape and reel (TR) packing method with a 7-inch size provides convenience during manufacturing, storage, and handling processes.

Terminal Pitch: 0.5 mm

The narrow terminal pitch of 0.5 mm enables high-density mounting, accommodating more components in a limited space and improving overall circuit integration.

Moisture Sensitivity Level (MSL): 1

With an MSL rating of 1, this product exhibits excellent moisture resistance, ensuring consistent performance in humid or damp environments.

Maximum Supply Voltage (Vsup): 5.5 V

The high maximum supply voltage of 5.5V allows for compatibility with a wide range of power sources, enhancing the product's versatility and applicability.

Technical Specifications

Bus Driver & Transceivers NTSX2102GDH attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Additional Features:

SEATED HGT-NOM

Family:

NTSX2102

JESD-30 Code:

R-PDSO-N8

Length:

3 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

12 ns

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Trade Compliance

NTSX2102GDH Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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