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NTSX2102GU8H

NXP Semiconductors

NTSX2102GU8H by NXP Semiconductors

NTSX2102GU8H by NXP Semiconductors is a 2-bit bus driver with a propagation delay of 12ns. It operates b/w -40 to 85°C, suitable for industrial applications. The chip carrier package has a very thin profile and features open-drain output characteristics.

Median Price

$0.397

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 8,000 parts In-Stock

1+ parts

$0.382

100+ parts

-

1k+ parts

-

10k+ parts

$0.300

8,000

$0.382

-

-

$0.300

DigiKey

USA . 8,090 parts In-Stock

1+ parts

$0.930

100+ parts

$0.530

1k+ parts

$0.459

10k+ parts

$0.430

8,090

$0.930

$0.530

$0.459

$0.430

Mouser Electronics

USA . 13,482 parts In-Stock

1+ parts

$0.950

100+ parts

$0.540

1k+ parts

$0.466

10k+ parts

$0.439

13,482

$0.950

$0.540

$0.466

$0.439

Verical

USA . 8,000 parts In-Stock

1+ parts

-

100+ parts

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$0.300

8,000

-

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$0.300

Avnet

USA . 4,000 parts In-Stock

1+ parts

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$0.397

4,000

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$0.397

Chip1Stop

Japan . 2,425 parts In-Stock

1+ parts

-

100+ parts

$0.344

1k+ parts

$0.337

10k+ parts

$0.282

2,425

-

$0.344

$0.337

$0.282

Rochester

USA . 546 parts In-Stock

1+ parts

-

100+ parts

$0.509

1k+ parts

$0.423

10k+ parts

$0.377

546

-

$0.509

$0.423

$0.377

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,177 parts In-Stock

1+ parts

$0.330

100+ parts

-

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4,177

$0.330

-

-

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Nova Conductors

Japan . 79 parts In-Stock

1+ parts

$0.390

100+ parts

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79

$0.390

-

-

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Maritex

Poland . 3,783 parts In-Stock

1+ parts

$1.037

100+ parts

$0.602

1k+ parts

$0.525

10k+ parts

-

3,783

$1.037

$0.602

$0.525

-

Chip Stock

USA . 39,249 parts In-Stock

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39,249

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TME

Poland . 11,880 parts In-Stock

1+ parts

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$0.425

11,880

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$0.425

Vyrian

USA . 11,594 parts In-Stock

1+ parts

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11,594

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VRG Components

USA . 4,000 parts In-Stock

1+ parts

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4,000

-

-

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Cyclops Electronics Ltd

UK . 1,569 parts In-Stock

1+ parts

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1,569

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Anansix

USA . 333 parts In-Stock

1+ parts

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333

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Avant Electronics Limited

UK . 306 parts In-Stock

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306

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Distributors (Availability)

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Ampacity Inc.

Singapore . 11,430 parts In-Stock

1+ parts

$0.258

100+ parts

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11,430

$0.258

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Corphita

USA . 4,720 parts In-Stock

1+ parts

$0.312

100+ parts

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4,720

$0.312

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Microchip USA

USA . 2,501 parts In-Stock

1+ parts

$2.343

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2,501

$2.343

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Andel Nordic

Denmark . 3,667 parts In-Stock

1+ parts

$7.654

100+ parts

-

1k+ parts

$7.348

10k+ parts

$7.348

3,667

$7.654

-

$7.348

$7.348

Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$34.817

100+ parts

$31.683

1k+ parts

$28.550

10k+ parts

-

3,000

$34.817

$31.683

$28.550

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Perfect Parts

USA . 16,908 parts In-Stock

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16,908

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Lixinc

USA . 15,276 parts In-Stock

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15,276

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 9,435 parts In-Stock

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9,435

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A-Z Elektronik GmbH

Germany . 6,926 parts In-Stock

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6,926

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Formix International (Excess)

India . 3,985 parts In-Stock

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3,985

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UNI Independent Distributors

Spain . 3,092 parts In-Stock

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3,092

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Kepictronics

USA . 1,241 parts In-Stock

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1,241

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Netroflash

USA . 500 parts In-Stock

1+ parts

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100+ parts

$0.382

1k+ parts

$0.371

10k+ parts

$0.363

500

-

$0.382

$0.371

$0.363

Overview

Experience top-notch quality and performance with the NTSX2102GU8H by industry leader NXP Semiconductors. This bus driver & transceiver chip offers unmatched reliability and versatility for a wide range of applications. With a compact design and advanced features, this product provides exceptional value and benefits to customers looking for efficient solutions. Trust NXP Semiconductors to deliver cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - Provides durability and lightweight design.

Surface Mount

YES - Allows for easy and secure installation on circuit boards.

Package Shape

RECTANGULAR - Saves space and allows for efficient placement on PCB.

No. of Bits

2 - Provides reliable data transmission.

Nominal Supply Voltage / Vsup (V)

1.8 - Ensures compatibility with various power sources.

No. of Terminals

8 - Offers multiple connection options for flexibility in circuit design.

Package Style (Meter)

CHIP CARRIER, VERY THIN PROFILE - Enables compact and low-profile installations.

Propagation Delay (tpd)

12 ns - Ensures fast and efficient signal transmission.

Maximum Operating Temperature

85 °C - Makes it suitable for use in a wide range of environments.

Output Characteristics

OPEN-DRAIN - Provides versatility in signal output options.

Minimum Operating Temperature

40 °C - Ensures reliable performance in extreme temperature conditions.

Terminal Finish

NICKEL PALLADIUM GOLD - Prevents corrosion and ensures long-term reliability.

Terminal Position

QUAD - Facilitates easy connection to other components on the PCB.

No. of Ports

2 - Allows for simultaneous data transmission on multiple channels.

Maximum Seated Height

0.5 mm - Ensures a low-profile design for space-constrained applications.

Width

1.2 mm - Provides a compact footprint for efficient board layout.

Output Polarity

TRUE - Ensures accurate signal transmission without distortion.

Minimum Supply Voltage (Vsup)

1.65 V - Allows for operation in low-power situations.

Maximum Time At Peak Reflow Temperature (s)

30 - Ensures reliable solder connections during assembly.

Peak Reflow Temperature °C

260 - Ensures proper solder melting for secure connections.

Length

1.4 mm - Contributes to a compact and efficient design.

Temperature Grade

INDUSTRIAL - Suitable for use in industrial settings with varying temperature ranges.

Terminal Form

NO LEAD - Provides a lead-free option for environmentally friendly applications.

Packing Method

TR, 7 INCH - Facilitates easy storage and handling during assembly.

Terminal Pitch

0.4 mm - Allows for precise connections on a small grid.

Maximum Supply Voltage (Vsup)

5.5 V - Provides compatibility with a wide range of power sources.

Technical Specifications

Bus Driver & Transceivers NTSX2102GU8H attributes and parameters. Explore more Bus Driver & Transceivers devices from NXP Semiconductors

Specs

Family:

NTSX2102

JESD-30 Code:

R-PQCC-N8

JESD-609 Code:

e4

Length:

1.4 mm

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Bits:

2

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

OPEN-DRAIN

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR, 7 INCH

Peak Reflow Temperature (C):

260

Propagation Delay (tpd):

12 ns

Maximum Seated Height:

.5 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

1.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.2 mm

Trade Compliance

NTSX2102GU8H Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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