Loading...

NTB0101GM

NXP Semiconductors

NTB0101GM by NXP Semiconductors

NTB0101GM by NXP Semiconductors is a compact line transceiver designed for automotive applications, featuring a max supply voltage of 5.5V and operating temp range from -40 °C to 125 °C. It offers fast transmit/receive delays of 14.2 ns. Its small outline package ensures efficient space utilization in electronic designs.

Median Price

-

Lifecycle Status

EOL

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,846 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,846

-

-

-

-

Digiode

USA . 2,608 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,608

-

-

-

-

Vyrian

USA . 2,240 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,240

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 837 parts In-Stock

1+ parts

$21.500

100+ parts

-

1k+ parts

-

10k+ parts

-

837

$21.500

-

-

-

Kepictronics

USA . 35,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

35,000

-

-

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 9,249 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

9,249

-

-

-

-

UNI Independent Distributors

Spain . 3,597 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,597

-

-

-

-

Corphita

USA . 246 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

246

-

-

-

-

Overview

Elevate your designs with the NTB0101GM from NXP Semiconductors, a premier choice in line drivers and receivers. This robust component promises exceptional performance with minimal delay, perfect for automotive applications where reliability is paramount. With NXP's renowned quality assurance, you gain peace of mind knowing your projects are backed by industry excellence. Experience seamless integration and superior functionality that drives innovation forward!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and resistance to environmental factors, making this product suitable for various applications.

Surface Mount: YES

Surface mount technology contributes to a smaller footprint, allowing for more compact circuit designs.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V enables compatibility with a wide range of low-power systems.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient use of PCB space and simplifies assembly.

Maximum Transmit Delay: 14.2 ns

With a low maximum transmit delay, this product enhances data transmission speed and improves overall system performance.

Maximum Supply Voltage-1: 5.5 V

This additional supply voltage range offers flexibility in powering the device, accommodating diverse applications.

No. of Terminals: 6

Having six terminals provides multiple connection options, increasing the versatility of the device.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

The very thin profile is ideal for space-constrained applications, ensuring efficient design layout.

Minimum Supply Voltage-1: 1.65 V

A minimum supply voltage of 1.65 V supports low-power applications while maintaining reliable performance.

Minimum Supply Voltage: 1.2 V

This low minimum supply voltage enhances energy efficiency, making it a suitable choice for battery-operated devices.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature allows this product to function reliably in demanding environments.

Minimum Operating Temperature: -40 °C

A wide operating temperature range ensures performance in extreme conditions, increasing product reliability.

Terminal Finish: TIN

The tin terminal finish provides good solderability and minimizes corrosion, enhancing connectivity.

Terminal Position: DUAL

Dual terminal positioning allows for flexible connection options, accommodating various PCB layouts.

Maximum Seated Height: 0.5 mm

A low seated height contributes to reduced overall component height, suitable for compact designs.

Width: 1 mm

A narrow width allows for greater density in component placement on PCBs.

Length: 1.45 mm

The compact length helps in efficient space utilization, ideal for miniaturized electronics.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, this product meets rigorous standards for reliability in harsh conditions.

Maximum Receive Delay: 14.2 ns

With a low maximum receive delay, it ensures quick and efficient signal processing, enhancing communication reliability.

Terminal Form: NO LEAD

The no-lead design is beneficial for reducing the footprint on the PCB and supporting environmentally friendly designs.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger inputs provide excellent noise immunity, ensuring reliable signal transitions and improved overall performance.

Nominal Supply Voltage: 1.5 V

The nominal supply voltage of 1.5 V is suitable for low-power applications, contributing to energy efficiency.

Terminal Pitch: 0.5 mm

A small terminal pitch allows for higher density designs, perfect for compact circuit layouts.

Nominal Supply Voltage-1: 1.8 V

Offering a nominal supply voltage of 1.8 V, this product can cater to additional low-power applications and further enhances versatility.

Interface IC Type: LINE TRANSCEIVER

As a line transceiver, this IC is specialized for data communication, providing reliable performance in transmitting and receiving signals.

Technical Specifications

Line Drivers & Receivers NTB0101GM attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-N6

JESD-609 Code:

e3

Length:

1.45 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Receive Delay:

14.2 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.65 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

14.2 ns

Width:

1 mm

Trade Compliance

NTB0101GM Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19