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NTB0101GW

NXP Semiconductors

NTB0101GW by NXP Semiconductors

NTB0101GW by NXP Semiconductors is a versatile line transceiver designed for automotive applications. It operates b/w 1.2V and 5.5V, features a max transmit/receive delay of 14.2 ns, and supports temperatures from -40 °C to 125 °C. Its compact SOIC package ensures efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 165,600 parts In-Stock

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Digiode

USA . 4,841 parts In-Stock

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4,841

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Anansix

USA . 2,493 parts In-Stock

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Vyrian

USA . 1,202 parts In-Stock

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Sensible Micro Corp

USA . 78 parts In-Stock

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78

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,385 parts In-Stock

1+ parts

$4.500

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1,385

$4.500

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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25,000

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Kepictronics

USA . 24,399 parts In-Stock

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24,399

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A-Z Elektronik GmbH

Germany . 8,580 parts In-Stock

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8,580

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UNI Independent Distributors

Spain . 6,279 parts In-Stock

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Corphita

USA . 3,369 parts In-Stock

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3,369

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Futuretech Components

Singapore . 512 parts In-Stock

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512

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Perfect Parts

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Overview

Experience superior performance with the NTB0101GW from NXP Semiconductors, a leader in innovative solutions. This robust line driver and receiver is designed for automotive applications, ensuring reliability under extreme temperatures. With its compact profile and impressive speed, it enhances signal integrity, making it ideal for modern electronics. Trust NXP's commitment to quality and elevate your designs with unmatched efficiency and advanced capabilities.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials enhance longevity and reliability in various applications.

Surface Mount: YES

Surface mount technology allows for automated assembly and saves space on PCBs.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage applications, making it versatile for different designs.

Package Shape: RECTANGULAR

Rectangular shape is easily integrable into compact layouts, ideal for space-constrained designs.

Maximum Transmit Delay: 14.2 ns

Fast transmit delay enhances the overall speed of data transmission, suitable for high-performance applications.

Maximum Supply Voltage-1: 5.5 V

Allows flexibility in circuit design, accommodating a variety of operating conditions.

No. of Terminals: 6

Provides sufficient connectivity options for effective integration into various circuit configurations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design helps in reducing PCB space while maintaining performance.

Minimum Supply Voltage-1: 1.65 V

Enables operation in low power applications, contributing to energy efficiency.

Minimum Supply Voltage: 1.2 V

Facilitates operation in low-voltage environments, enhancing safety and performance.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes it suitable for automotive and industrial applications.

Minimum Operating Temperature: -40 °C

Wide operating temperature range ensures reliability in extreme conditions, ideal for automotive applications.

Terminal Finish: PURE TIN

Provides good solderability and corrosion resistance, enhancing the longevity of connections.

Terminal Position: DUAL

Dual terminal position enhances layout flexibility in various circuit designs.

Maximum Seated Height: 1.1 mm

Low profile design allows for compatibility with slim devices and reduces obstruction on PCBs.

Width: 1.25 mm

Compact width is suitable for minimizing board space usage while maintaining functionality.

Length: 2 mm

Short length contributes to the space-saving design, making this component ideal for small devices.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, ensuring reliability and performance under rigorous conditions.

Maximum Receive Delay: 14.2 ns

Fast receive delay complements high-speed data transfer, ensuring timely communication.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and are easy to solder.

Input Characteristics: SCHMITT TRIGGER

Schmitt trigger input characteristics ensure clean switching and reduced noise susceptibility.

Nominal Supply Voltage: 1.5 V

Optimized for low-power applications, enhancing battery life in portable devices.

Terminal Pitch: 0.65 mm

Small terminal pitch facilitates high-density interconnections, perfect for compact electronic devices.

Nominal Supply Voltage-1: 1.8 V

Allows operation in a range of low-voltage systems, providing flexibility in design choices.

Interface IC Type: LINE TRANSCEIVER

Specialized design for line communication enhances performance in data transmission applications.

Technical Specifications

Line Drivers & Receivers NTB0101GW attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

R-PDSO-G6

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Qualification:

Not Qualified

Maximum Receive Delay:

14.2 ns

Receiver No. of Bits:

1

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.65 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

PURE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

14.2 ns

Width:

1.25 mm

Trade Compliance

NTB0101GW Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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