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NTB0101GF

NXP Semiconductors

NTB0101GF by NXP Semiconductors

NTB0101GF by NXP Semiconductors is a compact line transceiver designed for automotive applications. It operates b/w 1.2V and 5.5V, with a max transmit/receive delay of 14.2 ns, ensuring fast data communication. Its small outline package allows for efficient surface mounting in space-constrained designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 8,620 parts In-Stock

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8,620

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Digiode

USA . 3,204 parts In-Stock

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3,204

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Vyrian

USA . 1,042 parts In-Stock

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1,042

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Anansix

USA . 714 parts In-Stock

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714

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 350 parts In-Stock

1+ parts

$28.500

100+ parts

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350

$28.500

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A-Z Elektronik GmbH

Germany . 11,543 parts In-Stock

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11,543

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Perfect Parts

USA . 11,200 parts In-Stock

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11,200

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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Corphita

USA . 744 parts In-Stock

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744

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UNI Independent Distributors

Spain . 142 parts In-Stock

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142

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Overview

Unlock unparalleled performance with the NTB0101GF from NXP Semiconductors, a leader in innovative electronics. This cutting-edge line driver and receiver is perfect for automotive applications, delivering reliability even in extreme conditions. With its compact design and energy-efficient operation, this component enhances signal integrity while minimizing power consumption. Trust in NXP's quality to elevate your projects and experience seamless connectivity like never before!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight, making it suitable for various applications.

Surface Mount: YES

Allows for efficient use of PCB space and enables automated assembly.

Maximum Supply Voltage: 3.6 V

Provides flexibility in powering the device within safe limits.

Package Shape: SQUARE

Optimizes space and simplifies PCB layout.

Maximum Transmit Delay: 14.2 ns

Enables high-speed data transmission, enhancing performance.

Maximum Supply Voltage-1: 5.5 V

Supports a wide range of voltages for various applications.

No. of Terminals: 6

Offers a compact design while providing essential connectivity.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE

Ideal for space-constrained applications, enhancing design versatility.

Minimum Supply Voltage-1: 1.65 V

Allows for operation in low-power applications, optimizing energy consumption.

Minimum Supply Voltage: 1.2 V

Facilitates low-voltage operation, making it ideal for battery-powered devices.

Maximum Operating Temperature: 125 °C

Ensures reliable performance in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for harsh conditions, providing versatility in extreme climates.

Terminal Finish: TIN

Offers good solderability and ensures reliable connections.

Terminal Position: DUAL

Enhances PCB layout options, allowing for more versatile designs.

Maximum Seated Height: 0.5 mm

Minimizes height, enabling thin design profiles in compact applications.

Width: 1 mm

A narrow width that is ideal for space-saving designs.

Length: 1 mm

Compact dimensions contribute to efficient integration into different devices.

Temperature Grade: AUTOMOTIVE

Meets stringent automotive requirements, ensuring reliability in automotive applications.

Maximum Receive Delay: 14.2 ns

Supports high-speed data reception, enhancing overall system responsiveness.

Terminal Form: NO LEAD

Reduces environmental impact and enables new design possibilities.

Input Characteristics: SCHMITT TRIGGER

Improves noise immunity and ensures reliable logic-level switching.

Nominal Supply Voltage: 1.5 V

Optimizes energy efficiency, particularly in battery-operated devices.

Terminal Pitch: 0.35 mm

Allows for closely spaced connections, enhancing PCB design flexibility.

Nominal Supply Voltage-1: 1.8 V

Provides additional flexibility for various power requirements.

Interface IC Type: LINE TRANSCEIVER

Specifically designed for data transmission, ensuring optimized performance in communication applications.

Technical Specifications

Line Drivers & Receivers NTB0101GF attributes and parameters. Explore more Line Drivers & Receivers devices from NXP Semiconductors

Specs

Differential Output:

NO

Driver No. of Bits:

1

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

Interface Standard:

GENERAL PURPOSE

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Length:

1 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Receive Delay:

14.2 ns

Receiver No. of Bits:

1

Maximum Seated Height:

.5 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.2 V

Nominal Supply Voltage:

1.5 V

Maximum Supply Voltage-1:

5.5 V

Minimum Supply Voltage-1:

1.65 V

Nominal Supply Voltage-1:

1.8 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Maximum Transmit Delay:

14.2 ns

Width:

1 mm

Trade Compliance

NTB0101GF Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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