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NCX2222DPH

NXP Semiconductors

NCX2222DPH by NXP Semiconductors

NCX2222DPH by NXP Semiconductors is a dual comparator in a thin, rectangular package suitable for industrial applications. It operates b/w -40 °C to 85 °C with a max input offset voltage of 30mV and supply current of just 14µA. Ideal for low-power signal processing tasks.

Median Price

$0.628

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Freelance Electronics

USA . 10 parts In-Stock

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Vyrian

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Microchip USA

USA . 488 parts In-Stock

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One Stop Electronics

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AZTECH Wire

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Component Stockers USA

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QUARKTWIN TECHNOLOGY LTD

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Authorized Procurement Solutions

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Overview

Unlock the power of precision with the NCX2222DPH from NXP Semiconductors! This high-quality comparator delivers exceptional performance in a compact design, making it perfect for industrial applications. With its robust temperature range and low power consumption, it ensures reliability in demanding environments. Trust NXP's expertise to elevate your projects—experience enhanced accuracy and efficiency that drives innovation and success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material enhances durability and resistance to environmental factors, making it suitable for various applications.

Maximum Input Offset Voltage: 30000 uV

A low maximum input offset voltage ensures higher accuracy and performance in precision applications.

Surface Mount: YES

Being surface mount allows for compact designs and facilitates automated assembly processes, reducing manufacturing costs.

No. of Functions: 2

Dual functionality increases versatility for circuit designs, allowing for more complex operations within a single component.

Package Shape: RECTANGULAR

The rectangular package shape optimally fits in tight spaces on circuit boards, aiding in efficient layout design.

Power Supplies (V): 1.6/5.5

The wide voltage supply range provides flexibility in various applications, accommodating both low and higher power needs.

No. of Terminals: 8

With 8 terminals, it facilitates multiple connection options, thus enhancing integration in different circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile contribute to space savings in designs, making it ideal for compact electronic devices.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in a range of environments, especially in industrial applications.

Minimum Operating Temperature: -40 °C

Operating effectively at -40 °C makes this product suitable for harsh environments, expanding its application range.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in board layout design and simplifies routing for better signal integrity.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance indicates compatibility with modern soldering techniques, ensuring reliability of connections.

Temperature Grade: INDUSTRIAL

Designed for industrial temperature ranges, this product ensures robustness and durability in demanding applications.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering contact and are easier to inspect visually, contributing to reliable assembly.

Amplifier Type: COMPARATOR

The comparator type offers a straightforward method for comparing voltage levels, crucial for signal processing applications.

Maximum Supply Current: 0.014 mA

The low supply current helps reduce power consumption, making it ideal for battery-operated devices or power-sensitive applications.

Terminal Pitch: 0.635 mm

A terminal pitch of 0.635 mm allows for a compact design, facilitating denser circuit configurations and efficient use of PCB space.

Technical Specifications

Comparators NCX2222DPH attributes and parameters. Explore more Comparators devices from NXP Semiconductors

Amplifier Characteristics

Amplifier Type:

Power Supply:

1.6/5.5 V

Total Functions:

2

Sub-Category:

Comparators

Performance Specifications

Maximum Input Offset Voltage:

30 mV

Operational Characteristics

Maximum Supply Current:

14 μA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Total Terminals:

8

Terminal Pitch:

0.025 in (0.635 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.16

Trade Compliance

NCX2222DPH Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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