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NCX2220DP,125

NXP Semiconductors

NCX2220DP,125 by NXP Semiconductors

NCX2220DP,125 by NXP Semiconductors is a comparator with 2 functions and max input offset voltage of 30000 uV. It operates in industrial temperature range (-40 to 85 °C) and has low supply current (0.007 mA). Ideal for applications requiring precise voltage comparison in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,114 parts In-Stock

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4,114

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Flip Electronics

USA . 3,000 parts In-Stock

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3,000

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Vyrian

USA . 2,025 parts In-Stock

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2,025

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Anansix

USA . 1,305 parts In-Stock

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1,305

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Nova Conductors

Japan . 400 parts In-Stock

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400

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Distributors (Availability)

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Corohmni

South Africa . 94 parts In-Stock

1+ parts

$1.918

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94

$1.918

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Aztec Data Supply Inc.

USA . 340 parts In-Stock

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$4.120

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340

$4.120

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Semicontronic

India . 1,595 parts In-Stock

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$4.410

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$4.300

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$4.278

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1,595

$4.410

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One Stop Electronics

USA . 467 parts In-Stock

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$5.410

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467

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Ampacity Inc.

Singapore . 1,155 parts In-Stock

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$9.410

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$9.410

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AZTECH Wire

Italy . 852 parts In-Stock

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$11.923

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$11.923

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Microchip USA

USA . 390 parts In-Stock

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$48.720

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QUARKTWIN TECHNOLOGY LTD

USA . 21,832 parts In-Stock

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Corphita

USA . 4,569 parts In-Stock

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UNI Independent Distributors

Spain . 4,463 parts In-Stock

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Continental Prestige Electronics

USA . 4,312 parts In-Stock

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Argo Parts USA

USA . 3,062 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Lixinc

USA . 2,476 parts In-Stock

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Bastille Electronics

Australia . 800 parts In-Stock

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800

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Overview

Discover the NCX2220DP,125 by NXP Semiconductors, a high-quality comparator designed to meet your needs. With a compact design and industrial-grade temperature range, this product offers reliability and efficiency for various applications. Whether you're looking for precision voltage comparison or power management solutions, this dual-function device provides superior performance and value. Trust NXP Semiconductors to deliver innovative technology that simplifies your designs and enhances your projects. Elevate your electronics with the NCX2220DP,125 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ideal for portable and rugged applications.

Maximum Input Offset Voltage: 30000 uV

High maximum input offset voltage allows for precise measurements and accurate comparisons.

Surface Mount: YES

Surface mount capability simplifies the assembly process and saves space on the PCB.

No. of Functions: 2

Having 2 functions in one component increases efficiency and saves board space.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and integration into various circuit designs.

Power Supplies (V): 1.6/5.5

Wide range of power supply voltages allows flexibility in different operating conditions.

No. of Terminals: 8

Ample number of terminals enables easy connection and interfacing with other components.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style with thin profile and shrink pitch saves space on the PCB and enhances overall design aesthetics.

Maximum Operating Temperature: 85 °C

High maximum operating temperature ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for use in extreme cold environments without performance degradation.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and facilitates easy connection.

Maximum Time At Peak Reflow Temperature (s): 30

Extended time at peak reflow temperature ensures proper soldering and reliable connections during manufacturing.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper soldering and lasting connections.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable and stable performance in harsh industrial environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and secure connection.

Amplifier Type: COMPARATOR

Being a comparator amplifier type, this product is suitable for applications requiring accurate comparison of voltage levels.

Maximum Supply Current: 0.007 mA

Low maximum supply current consumption ensures energy efficiency and extends battery life in portable devices.

Packing Method: TR, 7 INCH

Tape and reel packing method with 7-inch size allows for easy handling and automated assembly.

Terminal Pitch: 0.635 mm

Fine terminal pitch of 0.635mm enables precise and compact PCB design.

Technical Specifications

Comparators NCX2220DP,125 attributes and parameters. Explore more Comparators devices from NXP Semiconductors

Amplifier Characteristics

Amplifier Type:

Power Supply:

1.6/5.5 V

Total Functions:

2

Sub-Category:

Comparators

Performance Specifications

Maximum Input Offset Voltage:

30 mV

Operational Characteristics

Maximum Supply Current:

7 μA

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Physical Characteristics

Total Terminals:

8

Terminal Pitch:

0.025 in (0.635 mm)

Terminal Position:

Dual

Terminal Form:

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-G8

Packaging and Shipping

Packing Method:

Tape And Reel, 7 Inch

Package Code:

Package Shape:

Package Type:

Small Outline, Thin Profile, Shrink Pitch

Package Equivalence Code:

TSSOP8,.16

Trade Compliance

NCX2220DP,125 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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