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NCX2200GF3,132

NXP Semiconductors

NCX2200GF3,132 by NXP Semiconductors

COMPARATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: SQUARE;

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 280,000 parts In-Stock

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280,000

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Vyrian

USA . 8,333 parts In-Stock

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8,333

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Digiode

USA . 4,667 parts In-Stock

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4,667

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Anansix

USA . 1,472 parts In-Stock

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1,472

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Prism Electronics

USA . 19 parts In-Stock

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19

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 427 parts In-Stock

1+ parts

$2.525

100+ parts

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427

$2.525

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One Stop Electronics

USA . 965 parts In-Stock

1+ parts

$7.410

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965

$7.410

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Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$8.052

100+ parts

$7.327

1k+ parts

$6.603

10k+ parts

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500

$8.052

$7.327

$6.603

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AZTECH Wire

Italy . 122 parts In-Stock

1+ parts

$16.540

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122

$16.540

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Perfect Parts

USA . 54,184 parts In-Stock

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54,184

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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UNI Independent Distributors

Spain . 7,757 parts In-Stock

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7,757

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Corphita

USA . 1,001 parts In-Stock

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1,001

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Technical Specifications

Comparators NCX2200GF3,132 attributes and parameters. Explore more Comparators devices from NXP Semiconductors

Amplifier Characteristics

Amplifier Type:

Power Supply:

1.6/5.5 V

Total Functions:

1

Sub-Category:

Comparators

Output Type:

Push-Pull

Performance Specifications

Maximum Input Offset Voltage:

30 mV

Operational Characteristics

Maximum Supply Current:

9 μA

Nominal Supply Voltage:

1.6 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Reflow Peak Time Limit:

30 s

Peak Reflow Temperature:

260 °C (500 °F)

Nominal Response Time:

800 ns

Physical Characteristics

Length:

0.039 in (1 mm)

Width:

0.039 in (1 mm)

Maximum Seated Height:

0.02 in (0.5 mm)

Total Terminals:

6

Terminal Pitch:

0.014 in (0.35 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

S-PDSO-N6

JESD-609 Code:

e3

Packaging and Shipping

Packing Method:

Tape And Reel, 7 Inch

Package Code:

Package Shape:

Package Type:

Small Outline, Very Think Profile

Package Equivalence Code:

SOLCC8,.04,14

Trade Compliance

NCX2200GF3,132 Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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