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NCX2200GM

NXP Semiconductors

NCX2200GM by NXP Semiconductors

COMPARATOR; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 6; Package Code: VSON; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 26,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

26,399

-

-

-

-

Freddi Giovanni

Italy . 20,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

20,000

-

-

-

-

Chip Stock

USA . 14,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

14,613

-

-

-

-

Digiode

USA . 725 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

725

-

-

-

-

Anansix

USA . 686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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686

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-

-

-

Vyrian

USA . 350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

350

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 409 parts In-Stock

1+ parts

$1.410

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$1.410

-

-

-

Kepictronics

USA . 13,582 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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13,582

-

-

-

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A-Z Elektronik GmbH

Germany . 6,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,686

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-

-

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Perfect Parts

USA . 5,600 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,600

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UNI Independent Distributors

Spain . 4,374 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,374

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Corphita

USA . 3,774 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,774

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Technical Specifications

Comparators NCX2200GM attributes and parameters. Explore more Comparators devices from NXP Semiconductors

Amplifier Characteristics

Amplifier Type:

Total Functions:

1

Sub-Category:

Comparators

Performance Specifications

Maximum Input Offset Voltage:

30 mV

Operational Characteristics

Nominal Supply Voltage:

3 V

Maximum Supply Voltage:

7 V

Lowest Operating Temperature:

-40 °C (-40 °F)

Maximum Operating Temperature:

85 °C (185 °F)

Nominal Response Time:

800 ns

Physical Characteristics

Length:

0.057 in (1.45 mm)

Width:

0.039 in (1 mm)

Maximum Seated Height:

0.02 in (0.5 mm)

Total Terminals:

6

Terminal Pitch:

0.02 in (0.5 mm)

Terminal Position:

Dual

Terminal Form:

Terminal Finish:

Pure Tin

Package Body Material:

Plastic/Epoxy

Surface Mount:

Yes

Manufacturing and Reliability

Moisture Sensitivity Level (MSL):

1

Temperature Grade:

Qualified:

No

Standards

JESD-30 Code:

R-PDSO-N6

Packaging and Shipping

Package Code:

Package Shape:

Package Type:

Small Outline, Very Think Profile

Trade Compliance

NCX2200GM Amplifiers trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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