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MRF21125R3

NXP Semiconductors

MRF21125R3 by NXP Semiconductors

NXP's MRF21125R3 is an N-CHANNEL RF Power FET with 65V DS Breakdown Voltage, ideal for S BAND applications. It features a max power dissipation of 330W and operates in enhancement mode up to 200°C. The ceramic, metal-sealed co-fired package with flange mount style ensures reliable performance in amplifier circuits.

Median Price

$105.410

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 59 parts In-Stock

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$105.410

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$94.320

10k+ parts

$88.770

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$88.770

DigiKey

USA . 59 parts In-Stock

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59

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Digiode

USA . 3,691 parts In-Stock

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$111.540

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Vyrian

USA . 8,276 parts In-Stock

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Anansix

USA . 2,894 parts In-Stock

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Tectiva GmbH

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One Stop Electronics

USA . 207 parts In-Stock

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$99.800

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Corphita

USA . 2,806 parts In-Stock

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$105.669

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$105.669

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Continental Prestige Electronics

USA . 809 parts In-Stock

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$140.900

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QUARKTWIN TECHNOLOGY LTD

USA . 13,668 parts In-Stock

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Microchip USA

USA . 7,040 parts In-Stock

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UNI Independent Distributors

Spain . 4,146 parts In-Stock

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Authorized Procurement Solutions

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Kepictronics

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Overview

Experience the power of NXP Semiconductors with the MRF21125R3 RF Power Field Effect Transistor. This high-quality product offers unparalleled performance in amplifier applications, making it the ideal choice for your S Band projects. With a maximum power dissipation of 330W and a minimum DS breakdown voltage of 65V, this enhancement mode transistor delivers reliability and efficiency. Trust NXP Semiconductors to provide cutting-edge technology and exceptional value, ensuring your success in the world of RF power electronics.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides excellent thermal conductivity and high reliability, ensuring stable performance even under high temperatures.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance characteristics compared to P-channel FETs, making this product a good choice for amplifier applications.

Configuration: SINGLE

Single configuration simplifies the circuit design and offers ease of use, making it ideal for amplifier applications.

Transistor Application: AMPLIFIER

Specifically designed for amplifier applications, ensuring optimal performance and efficiency in amplification tasks.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and facilitating mass production.

Minimum DS Breakdown Voltage: 65 V

With a high breakdown voltage, this FET can handle higher power levels without risk of damage, ensuring reliability in operation.

Highest Frequency Band: S BAND

Optimized for S Band frequencies, providing efficient and reliable performance in communication and radar applications within this frequency range.

Maximum Power Dissipation (Abs): 330 W

High power dissipation capability enables this FET to handle high power levels, making it suitable for demanding amplifier applications.

Maximum Operating Temperature: 200 °C

With a high maximum operating temperature, this FET can operate reliably even in high-temperature environments, ensuring consistent performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, providing stable and efficient amplification performance.

Technical Specifications

RF Power Field Effect Transistors (FET) MRF21125R3 attributes and parameters. Explore more RF Power Field Effect Transistors (FET) devices from NXP Semiconductors

Specs

Case Connection:

SOURCE

Configuration:

Minimum DS Breakdown Voltage:

65 V

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Highest Frequency Band:

S BAND

JESD-30 Code:

R-CDFM-F2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

200 Cel

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

AMPLIFIER

Transistor Element Material:

SILICON

Trade Compliance

MRF21125R3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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