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MM908E626AVPEK

NXP Semiconductors

MM908E626AVPEK by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 54; Package Code: HSSOP; Package Shape: RECTANGULAR;

Median Price

$9.790

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 18,358 parts In-Stock

1+ parts

-

100+ parts

$8.300

1k+ parts

$7.430

10k+ parts

$6.990

18,358

-

$8.300

$7.430

$6.990

Farnell

UK . 18,358 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$11.280

18,358

-

-

-

$11.280

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,798 parts In-Stock

1+ parts

$8.788

100+ parts

-

1k+ parts

-

10k+ parts

-

3,798

$8.788

-

-

-

Vyrian

USA . 3,176 parts In-Stock

1+ parts

$9.250

100+ parts

-

1k+ parts

-

10k+ parts

-

3,176

$9.250

-

-

-

Anansix

USA . 1,466 parts In-Stock

1+ parts

-

100+ parts

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-

10k+ parts

-

1,466

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 18,252 parts In-Stock

1+ parts

$7.860

100+ parts

-

1k+ parts

-

10k+ parts

-

18,252

$7.860

-

-

-

Corphita

USA . 3,043 parts In-Stock

1+ parts

$8.325

100+ parts

-

1k+ parts

-

10k+ parts

-

3,043

$8.325

-

-

-

Component Stockers USA

USA . 10,946 parts In-Stock

1+ parts

$9.320

100+ parts

$8.770

1k+ parts

$7.920

10k+ parts

$7.920

10,946

$9.320

$8.770

$7.920

$7.920

Microchip USA

USA . 1,063 parts In-Stock

1+ parts

$15.610

100+ parts

-

1k+ parts

-

10k+ parts

-

1,063

$15.610

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

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10,000

-

-

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A-Z Elektronik GmbH

Germany . 6,855 parts In-Stock

1+ parts

-

100+ parts

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6,855

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-

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Assy Fe

Spain . 1,040 parts In-Stock

1+ parts

-

100+ parts

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1,040

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UNI Independent Distributors

Spain . 503 parts In-Stock

1+ parts

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503

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Technical Specifications

Microcontrollers MM908E626AVPEK attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Maximum Clock Frequency:

9.8304 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

13

No. of Terminals:

54

Maximum Operating Temperature:

115 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

32 rpm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

MM908E626AVPEK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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