Loading...

MM908E624ACPEWR2

NXP Semiconductors

MM908E624ACPEWR2 by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 54; Package Code: SSOP; Package Shape: RECTANGULAR;

Median Price

$6.200

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

MM908E624ACPEWR2 by NXP Semiconductors
Compare Share

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7,000 parts In-Stock

1+ parts

$4.970

100+ parts

$4.870

1k+ parts

$4.770

10k+ parts

-

7,000

$4.970

$4.870

$4.770

-

Verical

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$7.429

10k+ parts

-

10,000

-

-

$7.429

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,318 parts In-Stock

1+ parts

$4.722

100+ parts

-

1k+ parts

-

10k+ parts

-

1,318

$4.722

-

-

-

Vyrian

USA . 3,139 parts In-Stock

1+ parts

$4.970

100+ parts

-

1k+ parts

-

10k+ parts

-

3,139

$4.970

-

-

-

Anansix

USA . 1,886 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,886

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 6,798 parts In-Stock

1+ parts

$4.220

100+ parts

-

1k+ parts

-

10k+ parts

-

6,798

$4.220

-

-

-

Corphita

USA . 3,269 parts In-Stock

1+ parts

$4.473

100+ parts

-

1k+ parts

-

10k+ parts

-

3,269

$4.473

-

-

-

Microchip USA

USA . 2,182 parts In-Stock

1+ parts

$21.570

100+ parts

$21.270

1k+ parts

$21.110

10k+ parts

$20.960

2,182

$21.570

$21.270

$21.110

$20.960

UNI Independent Distributors

Spain . 6,454 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,454

-

-

-

-

A-Z Elektronik GmbH

Germany . 5,325 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,325

-

-

-

-

Authorized Procurement Solutions

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Futuretech Components

Singapore . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Technical Specifications

Microcontrollers MM908E624ACPEWR2 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

68HC08

Maximum Clock Frequency:

9.8304 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

16

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP54,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

9/16

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2.65 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

5.5 V

Nominal Supply Voltage:

9 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

MM908E624ACPEWR2 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20