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MM908E625ACPEK

NXP Semiconductors

MM908E625ACPEK by NXP Semiconductors

NXP Semiconductors' MM908E625ACPEK microcontroller features 8-bit CPU, 512B RAM, and 16384 ROM words. With a max clock frequency of 9.8304MHz, it's ideal for industrial applications requiring PWM channels and ADC functionality. This CMOS technology chip operates b/w -40°C to 85°C with a supply voltage range of 8-18V.

Median Price

$7.260

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 30 parts In-Stock

1+ parts

-

100+ parts

$7.260

1k+ parts

$6.490

10k+ parts

$6.110

30

-

$7.260

$6.490

$6.110

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 527 parts In-Stock

1+ parts

$7.676

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527

$7.676

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Anansix

USA . 1,416 parts In-Stock

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1,416

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Vyrian

USA . 493 parts In-Stock

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493

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Distributors (Availability)

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AZTECH Wire

Italy . 493 parts In-Stock

1+ parts

$5.334

100+ parts

-

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493

$5.334

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One Stop Electronics

USA . 30 parts In-Stock

1+ parts

$6.870

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30

$6.870

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Ampacity Inc.

Singapore . 30 parts In-Stock

1+ parts

$6.870

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30

$6.870

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Corphita

USA . 269 parts In-Stock

1+ parts

$7.272

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269

$7.272

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Aztec Data Supply Inc.

USA . 3,175 parts In-Stock

1+ parts

$48.930

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3,175

$48.930

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A-Z Elektronik GmbH

Germany . 6,476 parts In-Stock

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6,476

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UNI Independent Distributors

Spain . 5,287 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Continental Prestige Electronics

USA . 3,788 parts In-Stock

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3,788

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Argo Parts USA

USA . 1,541 parts In-Stock

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Microchip USA

USA . 1,118 parts In-Stock

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Bastille Electronics

Australia . 49 parts In-Stock

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Overview

Discover the power of the MM908E625ACPEK microcontroller by NXP Semiconductors, a versatile and reliable solution for a wide range of applications. With advanced technology and high-quality manufacturing, this product offers unmatched performance and efficiency. Whether you're looking to enhance automation systems, improve energy management, or optimize sensor networks, this microcontroller delivers exceptional value and benefits. Trust NXP Semiconductors to provide cutting-edge solutions for your electronic projects.

Feature Benefit Bullets

Package Body Material

PLASTIC/EPOXY - This material provides durability and protection for the microcontroller, making it a reliable choice.

Surface Mount

YES - This feature allows for easy installation and space-saving design in electronic components.

Maximum Supply Voltage

18 V - With a high maximum supply voltage, this microcontroller can handle a wide range of power sources, increasing its versatility.

Package Shape

RECTANGULAR - The rectangular shape allows for easier integration into circuit designs and PCB layouts.

Bit Size

8 - The 8-bit size provides a good balance between performance and cost for various applications.

Power Supplies (V)

9/16 - This microcontroller can operate efficiently with power supplies ranging from 9V to 16V, providing flexibility in different setups.

No. of Terminals

54 - The ample number of terminals allows for multiple connections and interfaces, enhancing the functionality of the microcontroller.

Package Style (Meter)

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH - This package style offers efficient heat dissipation and compact design for space-constrained applications.

Minimum Supply Voltage

8 V - The low minimum supply voltage ensures that this microcontroller remains operational even with lower power sources.

Maximum Operating Temperature

85 °C - With a high maximum operating temperature, this microcontroller can withstand challenging environmental conditions, making it suitable for industrial use.

CPU Family

68HC08 - The 68HC08 CPU family is well-known for its reliability and performance, ensuring the microcontroller's effectiveness in various applications.

Technical Specifications

Microcontrollers MM908E625ACPEK attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

68HC08

Maximum Clock Frequency:

9.8304 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

R-PDSO-G54

JESD-609 Code:

e3

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

13

No. of Terminals:

54

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP54,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

9/16

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

16384

ROM Programmability:

FLASH

Maximum Seated Height:

2.45 mm

Speed:

32 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

7.5 mm

Peripheral IC Type:

Trade Compliance

MM908E625ACPEK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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