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MFRC52201HN1/TRAYB

NXP Semiconductors

MFRC52201HN1/TRAYB by NXP Semiconductors

MFRC52201HN1/TRAYB by NXP Semiconductors is a versatile interface IC designed for RFID applications. It operates b/w 2.5V and 3.6V, with a max temp of 85 °C and features a compact 5mm x 5mm square package. Ideal for space-constrained designs, it supports surface mount technology.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,597 parts In-Stock

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3,597

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Vyrian

USA . 1,155 parts In-Stock

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1,155

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Anansix

USA . 1,074 parts In-Stock

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1,074

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 992 parts In-Stock

1+ parts

$4.500

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992

$4.500

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UNI Independent Distributors

Spain . 3,988 parts In-Stock

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3,988

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Corphita

USA . 3,879 parts In-Stock

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3,879

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Overview

Elevate your projects with the MFRC52201HN1/TRAYB from NXP Semiconductors, a trusted leader in innovation. This versatile interface IC combines outstanding quality with unparalleled reliability, perfect for applications in RFID, contactless communication, and automation. Enjoy seamless integration, reduced power consumption, and robust performance, ensuring your designs stand out. Choose NXP and experience the benefits of superior technology that drives your success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy materials enhances durability and ensures reliability in various operating conditions.

Surface Mount: YES

Being surface mount compatible means it can be easily integrated into compact designs, saving PCB space.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with a wide range of low-voltage systems.

Package Shape: SQUARE

The square shape of the package promotes efficient routing on the PCB without requiring significant layout adjustments.

No. of Terminals: 32

With 32 terminals, this product accommodates a variety of connections, making it versatile for different applications.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The very thin profile is ideal for space-constrained applications while ensuring effective heat dissipation.

Minimum Supply Voltage: 2.5 V

A low minimum supply voltage of 2.5 V enhances compatibility with battery-operated devices.

Maximum Operating Temperature: 85 °C

Able to operate at temperatures up to 85 °C, this product is suitable for use in demanding environments.

Minimum Operating Temperature: -25 °C

The ability to function at -25 °C expands the product's usability in cold environments.

Terminal Position: QUAD

Quad terminal positioning allows for efficient interconnections and improved routing on the PCB.

Maximum Seated Height: 1 mm

A low seated height allows for slim and compact design solutions, adapting well to modern device trends.

Width: 5 mm

A compact width of 5 mm makes it ideal for tight spaces in electronic devices.

Length: 5 mm

Similar to its width, the 5 mm length supports miniaturization efforts in product design.

Terminal Form: NO LEAD

No lead terminal form promotes a higher density of connections while minimizing the footprint.

Nominal Supply Voltage: 3.3 V

The nominal supply voltage of 3.3 V is a widely adopted standard, enhancing system compatibility.

Terminal Pitch: 0.5 mm

The 0.5 mm terminal pitch allows for greater pin density, making it well-suited for intricate layouts.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, it effectively facilitates communication between components, enhancing overall system performance.

Technical Specifications

Other Function Interface ICs MFRC52201HN1/TRAYB attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MFRC52201HN1/TRAYB Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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