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MFRC52201HN1/TRAYBM

NXP Semiconductors

MFRC52201HN1/TRAYBM by NXP Semiconductors

MFRC52201HN1/TRAYBM by NXP Semiconductors is a versatile interface IC designed for RFID applications. It operates b/w 2.5V and 3.6V, with a max temp of 85 °C and features a compact 5mm x 5mm square package. Ideal for space-constrained designs, it supports surface mount technology.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,432 parts In-Stock

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1,432

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Anansix

USA . 1,331 parts In-Stock

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1,331

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Digiode

USA . 599 parts In-Stock

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599

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,277 parts In-Stock

1+ parts

$18.500

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$18.500

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UNI Independent Distributors

Spain . 4,223 parts In-Stock

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Corphita

USA . 1,737 parts In-Stock

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Overview

Unlock seamless connectivity and elevate your projects with the MFRC52201HN1/TRAYBM by NXP Semiconductors. Renowned for their industry-leading quality, NXP delivers a compact and efficient interface IC designed for versatile applications, from RFID systems to IoT devices. With its robust performance across a wide temperature range and minimal power consumption, this component ensures reliability and enhances your designs, empowering you to innovate without limits.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection against environmental factors, making this product reliable in various applications.

Surface Mount: YES

Being a surface mount device allows for efficient use of PCB space and enables automated assembly processes, making it suitable for compact designs.

Maximum Supply Voltage: 3.6 V

With a maximum supply voltage of 3.6 V, this IC can be used in low-voltage applications, enhancing efficiency and safety.

Package Shape: SQUARE

The square package shape provides a uniform footprint which aids in better thermal management and layout flexibility on PCBs.

No. of Terminals: 32

Having 32 terminals allows for versatile connectivity options, accommodating complex circuit designs and various interfacing needs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and heat sink capability make this product ideal for applications where thermal performance and space are critical.

Minimum Supply Voltage: 2.5 V

The capability to operate down to 2.5 V allows for compatibility with a wider range of power sources, enhancing its usability.

Maximum Operating Temperature: 85 °C

Operating at temperatures up to 85 °C makes this IC suitable for a variety of applications including those exposed to higher ambient conditions.

Minimum Operating Temperature: -25 °C

A minimum operating temperature of -25 °C means this IC is suitable for use in cold environments, expanding its application range.

Terminal Position: QUAD

The quad terminal position allows for easier placement and routing on PCBs, simplifying circuit design and assembly.

Maximum Seated Height: 1 mm

A maximum seated height of 1 mm contributes to low-profile designs, making it suitable for applications with space constraints.

Width: 5 mm

A width of 5 mm offers a compact footprint, crucial for modern electronic designs that prioritize space efficiency.

Length: 5 mm

The length of 5 mm complements the square shape and keeps the overall size minimal, ideal for dense circuit layouts.

Terminal Form: NO LEAD

The no-lead terminal form helps in improving solder joint reliability, enhancing overall product performance and stability.

Nominal Supply Voltage: 3.3 V

With a nominal supply voltage of 3.3 V, this IC is perfectly suited for most digital circuits that require stable performance.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for higher density packaging, which is critical for compact electronic designs.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit type IC, it is designed to facilitate communication between components, making it essential for integrated systems.

Technical Specifications

Other Function Interface ICs MFRC52201HN1/TRAYBM attributes and parameters. Explore more Other Function Interface ICs devices from NXP Semiconductors

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N32

Length:

5 mm

No. of Functions:

1

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-25 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.5 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

5 mm

Trade Compliance

MFRC52201HN1/TRAYBM Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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