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MC9S08QE8CFM

NXP Semiconductors

MC9S08QE8CFM by NXP Semiconductors

MICROCONTROLLER; Temperature Grade: INDUSTRIAL; Terminal Form: NO LEAD; No. of Terminals: 32; Package Code: HVQCCN; Package Shape: SQUARE;

Median Price

$4.735

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

MC9S08QE8CFM by NXP Semiconductors
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Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,450 parts In-Stock

1+ parts

$6.040

100+ parts

$3.882

1k+ parts

$3.495

10k+ parts

-

2,450

$6.040

$3.882

$3.495

-

Rochester

USA . 980 parts In-Stock

1+ parts

-

100+ parts

$3.430

1k+ parts

$3.070

10k+ parts

$2.890

980

-

$3.430

$3.070

$2.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,911 parts In-Stock

1+ parts

$2.632

100+ parts

-

1k+ parts

-

10k+ parts

-

4,911

$2.632

-

-

-

Vyrian

USA . 4,760 parts In-Stock

1+ parts

$2.770

100+ parts

-

1k+ parts

-

10k+ parts

-

4,760

$2.770

-

-

-

Flip Electronics

USA . 2,940 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,940

-

-

-

-

Anansix

USA . 2,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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2,489

-

-

-

-

DigiKey Marketplace

USA . 110 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

110

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 961 parts In-Stock

1+ parts

$2.350

100+ parts

-

1k+ parts

-

10k+ parts

-

961

$2.350

-

-

-

Corphita

USA . 4,382 parts In-Stock

1+ parts

$2.493

100+ parts

-

1k+ parts

-

10k+ parts

-

4,382

$2.493

-

-

-

Component Stockers USA

USA . 161 parts In-Stock

1+ parts

$3.680

100+ parts

$3.460

1k+ parts

-

10k+ parts

-

161

$3.680

$3.460

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 21,532 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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21,532

-

-

-

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Microchip USA

USA . 6,032 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,032

-

-

-

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UNI Independent Distributors

Spain . 4,095 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,095

-

-

-

-

Perfect Parts

USA . 1,646 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,646

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-

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Technical Specifications

Microcontrollers MC9S08QE8CFM attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

CPU Family:

HCS08

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-XQCC-N32

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

28

No. of Terminals:

32

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC32,.16SQ,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/3.6

Qualification:

Not Qualified

RAM Bytes:

512

ROM Words:

8192

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

20 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4 mm

Peripheral IC Type:

Trade Compliance

MC9S08QE8CFM Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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