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MC9S08PL4CTJ

NXP Semiconductors

MC9S08PL4CTJ by NXP Semiconductors

MC9S08PL4CTJ by NXP is an 8-bit microcontroller with a max clock frequency of 20 MHz. It features 18 I/O lines, PWM channels, and ADC channels. Ideal for applications requiring small outline packages and low power consumption at a supply voltage range of 2.7V to 5.5V.

Median Price

$0.881

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 141 parts In-Stock

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$1.540

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$0.927

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Verical

USA . 9,000 parts In-Stock

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$0.618

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$0.618

Rochester

USA . 76 parts In-Stock

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$0.881

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$0.732

10k+ parts

$0.652

76

-

$0.881

$0.732

$0.652

Distributors (In-Stock)

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Digiode

USA . 194 parts In-Stock

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$0.571

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Vyrian

USA . 5,703 parts In-Stock

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Flip Electronics

USA . 1,514 parts In-Stock

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Anansix

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Corphita

USA . 3,345 parts In-Stock

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$0.541

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$0.541

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Microchip USA

USA . 1,988 parts In-Stock

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$11.180

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Lixinc

USA . 5,586 parts In-Stock

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5,586

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Authorized Procurement Solutions

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UNI Independent Distributors

Spain . 1,268 parts In-Stock

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Overview

Elevate your projects with the MC9S08PL4CTJ microcontroller by NXP Semiconductors. Designed with precision and expertise, this versatile component offers a wide range of applications in various industries. With its high-quality manufacturing and advanced features, this microcontroller provides unmatched value, efficiency, and performance to customers. Unlock endless possibilities and streamline your projects with the MC9S08PL4CTJ.

Feature Benefit Bullets

Surface Mount: YES

Ease of installation and removal, suitable for automated assembly processes.

Maximum Supply Voltage: 5.5 V

Can handle higher voltage applications, providing flexibility in design.

Package Shape: RECTANGULAR

Space-efficient design, easy to integrate into compact electronic devices.

Bit Size: 8

Suitable for handling basic processing tasks efficiently.

No. of Terminals: 20

Sufficient number of terminals for connecting various external components.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact design for space-constrained applications, suitable for high-density designs.

Minimum Supply Voltage: 2.7 V

Operates at low voltages, suitable for battery-powered devices.

Terminal Finish: TIN

Provides good electrical conductivity and corrosion resistance.

ADC Channels: YES

Ability to convert analog signals to digital data for accurate measurements.

Terminal Position: DUAL

Enhanced stability and reliability of connections.

Width: 4.4 mm

Slim profile, ideal for space-saving designs.

Maximum Clock Frequency: 20 MHz

High clock frequency for fast processing speeds.

Maximum Time At Peak Reflow Temperature (s): 40

Allows for proper reflow soldering during manufacturing.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures for manufacturing processes.

Length: 6.5 mm

Compact size, suitable for small electronic devices.

Peripheral IC Type: MICROCONTROLLER

Integrated peripheral circuits for enhanced functionality.

Terminal Form: GULL WING

Secure soldering connection and easy inspection during assembly.

Nominal Supply Voltage: 3 V

Stable supply voltage for reliable operation.

PWM Channels: YES

Ability to generate PWM signals for controlling various applications.

Terminal Pitch: 0.65 mm

Fine pitch for compact layout and increased terminal density.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering and moisture-sensitive environments.

Speed: 20 rpm

Can handle processing tasks at a speed of 20 rotations per minute.

No. of I/O Lines: 18

Sufficient number of I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MC9S08PL4CTJ attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

8

Maximum Clock Frequency:

20 MHz

DMA Channels:

NO

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

6.5 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

18

No. of Terminals:

20

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Speed:

20 rpm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Peripheral IC Type:

Trade Compliance

MC9S08PL4CTJ Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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