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MC9S08LL64CLK

NXP Semiconductors

MC9S08LL64CLK by NXP Semiconductors

MC9S08LL64CLK by NXP is an 8-bit microcontroller with 40 MHz clock frequency, 80 terminals, and 65536 ROM words. Ideal for industrial applications, it features PWM channels, ADC support, and operates in a temperature range of -40 to 85°C.

Median Price

$7.446

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

MC9S08LL64CLK by NXP Semiconductors
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Distrelec

Netherlands . 1,330 parts In-Stock

1+ parts

$7.303

100+ parts

$6.458

1k+ parts

$5.136

10k+ parts

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1,330

$7.303

$6.458

$5.136

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Arrow

USA . 26 parts In-Stock

1+ parts

$7.446

100+ parts

$5.823

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26

$7.446

$5.823

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Chip1Stop

Japan . 821 parts In-Stock

1+ parts

$9.687

100+ parts

$4.776

1k+ parts

$4.655

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821

$9.687

$4.776

$4.655

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DigiKey

USA . 883 parts In-Stock

1+ parts

$10.360

100+ parts

$6.900

1k+ parts

$6.647

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883

$10.360

$6.900

$6.647

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Mouser Electronics

USA . 753 parts In-Stock

1+ parts

$10.940

100+ parts

$7.650

1k+ parts

$6.580

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753

$10.940

$7.650

$6.580

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EBV Elektronik

Germany . 1,620 parts In-Stock

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1,620

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Rochester

USA . 74 parts In-Stock

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$5.730

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$5.130

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$4.820

74

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$5.730

$5.130

$4.820

Flip Electronics (Authorized)

USA . 50 parts In-Stock

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Verical

USA . 26 parts In-Stock

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$5.823

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26

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$5.823

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Distributors (In-Stock)

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Vyrian

USA . 150 parts In-Stock

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$2.100

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$2.100

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Digiode

USA . 536 parts In-Stock

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$6.938

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Chip Stock

USA . 3,390 parts In-Stock

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Anansix

USA . 1,252 parts In-Stock

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Pegasus Components GmbH

Germany . 235 parts In-Stock

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235

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Nova Conductors

Japan . 83 parts In-Stock

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Flip Electronics

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Lantek

USA . 29 parts In-Stock

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PC Components Company LLC

USA . 18 parts In-Stock

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Bristol Electronics

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Distributors (Availability)

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Ampacity Inc.

Singapore . 342 parts In-Stock

1+ parts

$4.450

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342

$4.450

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Corphita

USA . 4,643 parts In-Stock

1+ parts

$6.573

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4,643

$6.573

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Corohmni

South Africa . 9 parts In-Stock

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$28.973

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9

$28.973

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Microchip USA

USA . 1,353 parts In-Stock

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$30.990

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$30.990

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$30.990

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$30.990

1,353

$30.990

$30.990

$30.990

$30.990

Perfect Parts

USA . 20,362 parts In-Stock

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A-Z Elektronik GmbH

Germany . 8,100 parts In-Stock

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GreenTree Electronics

Israel . 2,870 parts In-Stock

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UNI Independent Distributors

Spain . 2,770 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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Argo Parts USA

USA . 1,277 parts In-Stock

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Continental Prestige Electronics

USA . 1,066 parts In-Stock

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Authorized Procurement Solutions

USA . 400 parts In-Stock

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Overview

Unleash the power of innovation with the MC9S08LL64CLK microcontroller from NXP Semiconductors. Designed with cutting-edge technology and unparalleled quality, this microcontroller is perfect for a wide range of applications. Whether you're working on IoT projects, automation systems, or smart devices, this product offers superior performance, value, and reliability. Elevate your designs with the MC9S08LL64CLK and experience the difference that NXP Semiconductors brings to the table.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the microcontroller easy to handle and resistant to damage.

Surface Mount: YES

Surface mount design allows for easy installation on circuit boards, saving space and facilitating mass production.

Maximum Supply Voltage: 3.6 V

Supports a higher supply voltage range, providing flexibility in power source selection.

Package Shape: SQUARE

Square shape is compact and efficient for fitting in tight spaces on a PCB.

Bit Size: 8

8-bit architecture is suitable for many low to mid-range computing applications.

Power Supplies (V): 2/3.3

Support for dual power supplies allows for versatile power options and compatibility with different systems.

No. of Terminals: 80

More terminals provide greater connectivity options for peripherals and external devices.

Package Style (Meter): FLATPACK, LOW PROFILE

Low profile design saves space in electronic assemblies and promotes efficient heat dissipation.

Minimum Supply Voltage: 2.1 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High operating temperature range allows the microcontroller to function reliably in various environmental conditions.

CPU Family: HCS08

Part of the highly regarded HCS08 CPU family, known for its performance and efficiency in embedded systems.

Minimum Operating Temperature: -40 °C

Extreme low operating temperature ensures the microcontroller can withstand harsh cold environments.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

Built-in Analog-to-Digital Converter (ADC) channels enable the microcontroller to interface with analog sensors and signals.

Terminal Position: QUAD

Quad terminal position facilitates easy soldering and ensures stable connection in the circuit.

ROM Words: 65536

Large ROM capacity allows for storing a significant amount of program data and instructions.

Maximum Seated Height: 1.6 mm

Low profile design with a maximum seated height of 1.6 mm facilitates compact PCB layouts and thin electronic devices.

Width: 14 mm

Compact width of 14 mm enables space-saving integration in electronic assemblies.

Maximum Clock Frequency: 40 MHz

High maximum clock frequency of 40 MHz allows for fast processing speeds and real-time operation in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 40

Can withstand peak reflow temperature for 40 seconds, ensuring reliable soldering during manufacturing processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures proper soldering and robust connections in assembly processes.

Length: 14 mm

Compact length of 14 mm contributes to the microcontroller's overall small form factor and space-efficient design.

Temperature Grade: INDUSTRIAL

Designed to withstand industrial temperature conditions, ensuring reliable operation in rugged environments.

Peripheral IC Type: MICROCONTROLLER

Being a microcontroller, it is an all-in-one device that integrates CPU, memory, and I/O interfaces, suitable for embedded system applications.

RAM Bytes: 4000

Sufficient RAM capacity of 4000 bytes to store and manipulate data during program execution.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making the microcontroller energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

Gull wing terminal form facilitates easy soldering and assembly on PCBs, ensuring secure connections.

Maximum Supply Current: 17.9 mA

Low maximum supply current of 17.9 mA helps in conserving power consumption and extending battery life in portable devices.

Nominal Supply Voltage: 3 V

Standard nominal supply voltage of 3 V for compatibility with common power sources and ease of integration.

PWM Channels: YES

Support for Pulse Width Modulation (PWM) channels allows for precise control of output signals and motor speed regulation.

ROM Programmability: FLASH

Flash ROM programmability enables easy updating of firmware and efficient reprogramming of the microcontroller.

Terminal Pitch: 0.65 mm

Fine terminal pitch of 0.65 mm ensures high-density mounting on PCBs and precise soldering in electronic assemblies.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions during manufacturing.

Speed: 40 rpm

Operating speed of 40 rpm ensures efficient task execution and responsive performance in real-time applications.

No. of I/O Lines: 39

A high number of I/O lines (Input/Output) provide ample connectivity options for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers MC9S08LL64CLK attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

OPERATES AT 1.8 V MINIMUM SUPPLY AT 20 MHZ

Address Bus Width:

0

Bit Size:

8

CPU Family:

HCS08

Maximum Clock Frequency:

40 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G80

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

39

No. of Terminals:

80

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP80,.64SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/3.3

Qualification:

Not Qualified

RAM Bytes:

4000

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

40 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

17.9 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.1 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

40

Width:

14 mm

Peripheral IC Type:

Trade Compliance

MC9S08LL64CLK Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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