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MC912DG128ACPV

NXP Semiconductors

MC912DG128ACPV by NXP Semiconductors

MC912DG128ACPV by NXP Semiconductors is a microcontroller with 16-bit address bus, 128K ROM words, and 8 PWM channels. Ideal for industrial applications, it features CAN(3), I2C, SCI(2), SPI connectivity and operates at up to 16 MHz clock frequency.

Median Price

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Lifecycle Status

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Anansix

USA . 1,341 parts In-Stock

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Nova Conductors

Japan . 900 parts In-Stock

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Digiode

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Vyrian

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PC Components Company LLC

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Bristol Electronics

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Q Components

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LittleDiode

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One Stop Electronics

USA . 1,807 parts In-Stock

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AZTECH Wire

Italy . 238 parts In-Stock

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$13.940

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Ampacity Inc.

Singapore . 1,283 parts In-Stock

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A-Z Elektronik GmbH

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Argo Parts USA

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Microchip USA

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Glotronic Ltd.

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Continental Prestige Electronics

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Authorized Procurement Solutions

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Corphita

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UNI Independent Distributors

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Bastille Electronics

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Kepictronics

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Perfect Parts

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Overview

Upgrade your electronic designs with the MC912DG128ACPV microcontroller from NXP Semiconductors. Known for their high-quality products, NXP Semiconductors delivers reliable solutions that meet the demands of various applications in the industry. This microcontroller offers a range of features including ADC channels, PWM channels, connectivity options like CAN, I2C, SCI, and SPI, as well as low power mode for energy efficiency. With its versatile capabilities and advanced technology, the MC912DG128ACPV provides unmatched value and performance to customers looking to elevate their projects. Experience innovation at its finest with this top-of-the-line microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this microcontroller lightweight and durable, ideal for portable or rugged applications.

Surface Mount: YES

With surface mount capabilities, this microcontroller can easily be integrated onto compact circuit boards, saving space in electronic designs.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage allows for flexibility in power input options, making this microcontroller adaptable to various voltage levels.

On Chip Data RAM Width: 8

The 8-bit data RAM width provides efficient data processing capabilities, enhancing the overall performance of the microcontroller.

Address Bus Width: 16

The 16-bit address bus width allows for a larger memory address space, enabling the microcontroller to handle more complex algorithms and tasks.

Package Shape: SQUARE

The square package shape offers a uniform footprint for easier PCB layout and assembly, ensuring a streamlined design process.

Bit Size: 16

The 16-bit architecture of this microcontroller allows for faster data processing, making it suitable for high-speed applications that require quick response times.

No. of Terminals: 112

With 112 terminals, this microcontroller offers a wide range of I/O options, enabling connectivity to various external devices and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE

The flatpack, low profile package style allows for a compact and space-saving design, ideal for applications with limited space constraints.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures that the microcontroller can operate efficiently even in low-power scenarios, making it energy-efficient.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature range of 85°C ensures that this microcontroller can withstand harsh environmental conditions, making it reliable in extreme temperature settings.

CPU Family: HC12 D

Being part of the HC12 D CPU family, this microcontroller offers advanced features and performance capabilities, making it a versatile choice for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C allows this microcontroller to function in cold environments, making it suitable for outdoor or industrial applications.

Technical Specifications

Microcontrollers MC912DG128ACPV attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

NO

CPU Family:

HC12 D

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G112

Length:

20 mm

Low Power Mode:

YES

No. of I/O Lines:

69

No. of Terminals:

112

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP112,.79SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

220

RAM Bytes:

8192

ROM Words:

128K

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(3), I2C, SCI(2), SPI

Peripherals:

POR, PWM(4), TIMER

Analog To Digital Convertors:

8-Ch 10-Bit (2)

Trade Compliance

MC912DG128ACPV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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