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MC912DT128AVPV

NXP Semiconductors

MC912DT128AVPV by NXP Semiconductors

MC912DT128AVPV by NXP Semiconductors is a microcontroller with 16-bit address bus, 8-bit on-chip data RAM, and 128K ROM words. It operates at up to 16 MHz, has 112 terminals, and offers low power mode. Ideal for industrial applications requiring CAN, I2C, SCI, SPI connectivity and features like PWM(4) and timers.

Median Price

$21.280

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 144 parts In-Stock

1+ parts

$21.280

100+ parts

$20.850

1k+ parts

$20.430

10k+ parts

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144

$21.280

$20.850

$20.430

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Distributors (In-Stock)

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ComSIT Distribution GmbH

Germany . 5,522 parts In-Stock

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5,522

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ComSIT USA

USA . 4,000 parts In-Stock

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4,000

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Digiode

USA . 3,981 parts In-Stock

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Vyrian

USA . 870 parts In-Stock

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870

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ACDS - Activité Composants Distribution Service

France . 195 parts In-Stock

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Anansix

USA . 114 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 870 parts In-Stock

1+ parts

$10.580

100+ parts

$10.160

1k+ parts

$9.960

10k+ parts

$9.760

870

$10.580

$10.160

$9.960

$9.760

Semicontronic

India . 1,568 parts In-Stock

1+ parts

$22.000

100+ parts

$21.450

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$21.340

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1,568

$22.000

$21.450

$21.340

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Vigor

Singapore . 144 parts In-Stock

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$23.160

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144

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Ampacity Inc.

Singapore . 850 parts In-Stock

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$30.000

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850

$30.000

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One Stop Electronics

USA . 2,168 parts In-Stock

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$31.000

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$31.000

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UNI Independent Distributors

Spain . 5,322 parts In-Stock

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Microchip USA

USA . 5,248 parts In-Stock

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Argo Parts USA

USA . 3,829 parts In-Stock

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Corphita

USA . 3,231 parts In-Stock

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Continental Prestige Electronics

USA . 548 parts In-Stock

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548

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Aranea Global

USA . 500 parts In-Stock

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500

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Perfect Parts

USA . 330 parts In-Stock

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330

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Glotronic Ltd.

UK . 156 parts In-Stock

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156

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Cyclops Electronics Ltd (Excess)

UK . 135 parts In-Stock

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135

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Overview

Discover the power of the MC912DT128AVPV microcontroller by NXP Semiconductors, designed to elevate your projects to new heights. With a robust design and industrial-grade technology, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From automotive systems to consumer electronics, the MC912DT128AVPV delivers exceptional value with its low power mode, high-speed connectivity options, and extensive peripheral support. Trust in NXP Semiconductors to provide cutting-edge solutions that empower your innovations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and protection for the microcontroller, making it suitable for various environments.

Maximum Supply Voltage: 5.5 V

A higher maximum supply voltage allows for more flexibility in power supply options and compatibility with different systems.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to efficiently convert analog signals to digital data, expanding its range of applications.

PWM Channels: YES

PWM channels provide the ability to control the speed and intensity of connected devices, making the microcontroller versatile for various tasks.

Connectivity: CAN(2), I2C, SCI(2), SPI

Multiple connectivity options such as CAN, I2C, SCI, and SPI enhance the communication capabilities of the microcontroller, allowing for seamless integration into different systems.

ROM Programmability: FLASH

Flash ROM programmability offers the flexibility to reprogram the microcontroller, enabling firmware updates and customization as per the requirements.

Low Power Mode: YES

The low power mode feature helps in conserving energy and reducing power consumption, making the microcontroller energy-efficient and suitable for battery-operated devices.

Technical Specifications

Microcontrollers MC912DT128AVPV attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

16

Bit Size:

16

Boundary Scan:

NO

CPU Family:

HC12 D

Maximum Clock Frequency:

16 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

16

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PQFP-G112

Length:

20 mm

Low Power Mode:

YES

No. of I/O Lines:

67

No. of Terminals:

112

On Chip Data RAM Width:

8

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP112,.79SQ

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE

Peak Reflow Temperature (C):

220

RAM Bytes:

8192

ROM Words:

128K

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

8 rpm

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

20 mm

Peripheral IC Type:

Data EEPROM Size:

2K

Connectivity:

CAN(2), I2C, SCI(2), SPI

Peripherals:

POR, PWM(4), TIMER

Analog To Digital Convertors:

8-Ch 10-Bit (2)

Trade Compliance

MC912DT128AVPV Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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