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MC3361D

NXP Semiconductors

MC3361D by NXP Semiconductors

MC3361D by NXP Semiconductors is an FM audio demodulator with a compact 16-terminal design, operating b/w -30 °C and 75 °C. It supports a supply voltage range of 2V to 8V and consumes a max current of 9mA. Ideal for various receiver applications, it ensures efficient signal processing in small devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 3,151 parts In-Stock

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ECAB

Sweden . 2,265 parts In-Stock

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2,265

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Vyrian

USA . 1,320 parts In-Stock

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1,320

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Anansix

USA . 1,133 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 36 parts In-Stock

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One Stop Electronics

USA . 1,379 parts In-Stock

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$13.800

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UNI Independent Distributors

Spain . 6,881 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,577 parts In-Stock

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Corphita

USA . 3,182 parts In-Stock

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Kepictronics

USA . 1,001 parts In-Stock

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Overview

Unlock the power of seamless audio with the MC3361D from NXP Semiconductors, a leader in innovative solutions. This compact receiver IC delivers exceptional performance and reliability, making it perfect for a range of applications from consumer electronics to automotive systems. With its robust design and superior quality, the MC3361D ensures crystal-clear audio demodulation while minimizing power consumption, providing unparalleled value and efficiency for your projects. Experience the advantage of choosing NXP—where technology meets excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making the product suitable for various applications.

Surface Mount: YES

Surface mount capability allows for compact designs and efficient use of PCB space, making it ideal for modern electronic devices.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on the circuit board and facilitates easier integration into various designs.

General IC Type: AUDIO DEMODULATOR

Being an audio demodulator, it effectively processes audio signals, making it essential for audio applications.

No. of Terminals: 16

Having 16 terminals provides sufficient connectivity for various signal and power requirements, enhancing its versatility.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for easy handling and placement on PCBs, catering to space-constrained designs.

Maximum Operating Temperature: 75 °C

A maximum operating temperature of 75 °C ensures reliable performance in a range of environments, suitable for consumer and commercial applications.

Minimum Operating Temperature: -30 °C

The ability to operate at temperatures as low as -30 °C demonstrates robustness and reliability in harsh conditions.

Terminal Position: DUAL

Dual terminal position improves signal integrity and simplifies the circuit design, leading to enhanced overall performance.

Maximum Seated Height: 1.75 mm

The low seated height supports low-profile designs, enabling use in compact electronic devices.

Width: 3.9 mm

A narrow width allows for efficient space management on PCBs, facilitating use in miniaturized applications.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage makes this product compatible with a wide range of power sources, ensuring versatility in various setups.

Length: 9.9 mm

The moderate length aids in effective PCB layout, allowing for optimal trace routing without compromising performance.

Demodulation Type: FM

FM demodulation capability makes this IC suitable for applications requiring high-quality audio signal processing.

Temperature Grade: COMMERCIAL EXTENDED

The commercial extended temperature grade indicates reliability and performance in a broader range of operating conditions.

Terminal Form: GULL WING

Gull wing terminals facilitate easier soldering and assembly, improving manufacturing efficiency.

Maximum Supply Current: 9 mA

With a maximum supply current of 9 mA, this IC is power-efficient, making it a great choice for battery-operated devices.

Nominal Output Voltage (FM): 150 mV

A nominal output voltage of 150 mV ensures strong signal transmission for clear audio reproduction, enhancing user experience.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm provides a good balance between density and ease of soldering, making it user-friendly.

Maximum Supply Voltage (Vsup): 8 V

The maximum supply voltage of 8 V allows flexibility in design, accommodating various power supply configurations.

Technical Specifications

Receiver ICs MC3361D attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

JESD-30 Code:

R-PDSO-G16

Length:

9.9 mm

No. of Terminals:

16

Maximum Operating Temperature:

75 Cel

Minimum Operating Temperature:

-30 Cel

Nominal Output Voltage (FM):

150 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Current:

9 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC3361D General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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