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MC3361BD

NXP Semiconductors

MC3361BD by NXP Semiconductors

MC3361BD by NXP Semiconductors is an audio single chip receiver with FM demodulation. It operates at temperatures from -30 to 70°C, with a low harmonic distortion of 0.86%. This IC has 16 terminals and requires a supply voltage of 2-8V, making it ideal for compact audio applications.

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Digiode

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Nova Conductors

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Ashlea Components Ltd

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Fibra_Brandt Electronic GMBH

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LittleDiode

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Ampacity Inc.

Singapore . 1,421 parts In-Stock

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One Stop Electronics

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AZTECH Wire

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Continental Prestige Electronics

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Overview

Elevate your audio experience with the MC3361BD from NXP Semiconductors. This high-quality receiver IC delivers crystal clear sound and reliable performance, thanks to NXP's reputation for excellence in semiconductor manufacturing. Perfect for a wide range of applications, this audio single chip receiver offers unparalleled value and benefits to customers seeking top-notch audio quality. Upgrade your audio system today with the MC3361BD and immerse yourself in the ultimate listening experience.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and lightweight, which is ideal for portable or handheld devices.

Surface Mount: YES

Surface mount technology simplifies PCB assembly and saves space, making the product suitable for compact designs.

Harmonic Distortion: 0.86%

Low harmonic distortion ensures high-quality audio output with minimal interference or distortion.

Power Supplies (V): 4

Operating at 4V allows for compatibility with a wide range of power sources, increasing versatility.

No. of Terminals: 16

Having 16 terminals provides flexibility for connecting various components and peripherals, enhancing functionality.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature ensures reliability and stability under varying environmental conditions.

Demodulation Type: FM

The FM demodulation type is suitable for audio applications, providing clear and accurate signal reception.

Technology: BIPOLAR

Utilizing bipolar technology offers high performance and efficiency, making the product reliable and effective.

Technical Specifications

Receiver ICs MC3361BD attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.86 %

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e0

Length:

9.9 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Nominal Output Voltage (FM):

160 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

4

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Receiver ICs

Maximum Supply Current:

6.4 mA

Maximum Supply Voltage (Vsup):

8 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

MC3361BD General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-556-0980, 5962015560980

NIIN

015560980

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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