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MC3371P

NXP Semiconductors

MC3371P by NXP Semiconductors

MC3371P by NXP Semiconductors is an audio single chip receiver with 16 terminals. It operates b/w -30 to 70 °C and has a harmonic distortion of 0.6%. With a supply voltage range of 2-9V, it offers FM demodulation and nominal output voltage of 200mV, making it ideal for audio applications.

Median Price

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Lifecycle Status

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10

In-Stock Inventory

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LWI Electronics Inc

India . 3,058 parts In-Stock

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Vyrian

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Digiode

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Infinite Electronics LLP

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Ashlea Components Ltd

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Anansix

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Nova Conductors

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LittleDiode

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Fibra_Brandt Electronic GMBH

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Ampacity Inc.

Singapore . 1,225 parts In-Stock

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One Stop Electronics

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Argo Parts USA

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Epart123

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Overview

Experience crystal-clear sound quality like never before with the MC3371P by NXP Semiconductors. As a leading manufacturer in the industry, NXP Semiconductors delivers top-notch receiver ICs that are perfect for a wide range of applications. This audio single chip receiver boasts a low harmonic distortion of 0.6%, ensuring premium audio performance. With a compact design and easy installation, the MC3371P offers customers unparalleled value and benefits. Upgrade your audio experience today with the MC3371P from NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and resistance to environmental factors, making the product reliable for long-term use.

Harmonic Distortion: 0.6%

Low harmonic distortion ensures high-quality audio output, providing clear and crisp sound without any interference.

Power Supplies (V): 4

Operating at a lower power supply of 4V, the receiver ICs can help save energy and reduce overall power consumption.

Nominal Output Voltage (FM): 200 mV

With a nominal output voltage of 200mV, the receiver ICs can deliver a strong and stable audio signal for better performance.

Maximum Operating Temperature: 70 °C

With a high maximum operating temperature of 70°C, the receiver ICs can withstand extreme heat conditions, ensuring reliable operation in various environments.

Technical Specifications

Receiver ICs MC3371P attributes and parameters. Explore more Receiver ICs devices from NXP Semiconductors

Specs

General IC Type:

Demodulation Type:

FM

Harmonic Distortion:

.6 %

JESD-30 Code:

R-PDIP-T16

JESD-609 Code:

e0

Length:

19.175 mm

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-30 Cel

Nominal Output Voltage (FM):

200 mV

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

4

Qualification:

Not Qualified

Maximum Seated Height:

4.44 mm

Nominal Signal to Noise Ratio (FM):

67 dB

Sub-Category:

Receiver ICs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

9 V

Minimum Supply Voltage (Vsup):

2 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

MC3371P General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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