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M86201G12

NXP Semiconductors

M86201G12 by NXP Semiconductors

Multifunction Peripherals; Temperature Grade: COMMERCIAL; Terminal Form: BALL; No. of Terminals: 625; Package Code: FBGA; Package Shape: SQUARE;

Median Price

$51.510

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 60 parts In-Stock

1+ parts

$33.720

100+ parts

$33.050

1k+ parts

$32.370

10k+ parts

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60

$33.720

$33.050

$32.370

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Flip Electronics (Authorized)

USA . 2,351 parts In-Stock

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DigiKey

USA . 1,451 parts In-Stock

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1,451

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Verical

USA . 1,440 parts In-Stock

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$69.300

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1,440

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$69.300

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Distributors (In-Stock)

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Digiode

USA . 2,310 parts In-Stock

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$32.034

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$32.034

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Vyrian

USA . 3,946 parts In-Stock

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$33.720

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Flip Electronics

USA . 2,351 parts In-Stock

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Anansix

USA . 1,797 parts In-Stock

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DigiKey Marketplace

USA . 1,451 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,177 parts In-Stock

1+ parts

$30.348

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3,177

$30.348

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Microchip USA

USA . 474 parts In-Stock

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$35.289

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474

$35.289

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Corohmni

South Africa . 1,958 parts In-Stock

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$71.940

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1,958

$71.940

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A-Z Elektronik GmbH

Germany . 4,608 parts In-Stock

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4,608

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UNI Independent Distributors

Spain . 4,143 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,072 parts In-Stock

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Kepictronics

USA . 143 parts In-Stock

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ChipstoGo Electronic ltd

UK . 120 parts In-Stock

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120

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Technical Specifications

Multi-functional Peripherals M86201G12 attributes and parameters. Explore more Multi-functional Peripherals devices from NXP Semiconductors

Specs

Address Bus Width:

26

Boundary Scan:

YES

Bus Compatibility:

I2C, PCI, SPI, UART, USB

Maximum Clock Frequency:

1200 MHz

External Data Bus Width:

32

JESD-30 Code:

S-PBGA-B625

Length:

21 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

625

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-10 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, FINE PITCH

Peak Reflow Temperature (C):

250

RAM Words:

32768

Maximum Seated Height:

2.67 mm

Maximum Supply Voltage:

1.164 V

Minimum Supply Voltage:

1.096 V

Nominal Supply Voltage:

1.13 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

21 mm

Trade Compliance

M86201G12 Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A002.A.1

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

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