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LPC55S16JBD100E

NXP Semiconductors

LPC55S16JBD100E by NXP Semiconductors

NXP Semiconductors' LPC55S16JBD100E is a 32-bit microcontroller with Cortex-M33 CPU, offering 262144 ROM words and 98304 RAM bytes. It features 10-Ch 16-Bit ADC channels, PWM channels, and connectivity options like I2C, CAN, SPI, UART, USART, USB. Ideal for applications requiring high-speed processing up to 32 MHz in industrial automation and IoT devices.

Median Price

$7.090

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 38 parts In-Stock

1+ parts

$5.930

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38

$5.930

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Mouser Electronics

USA . 680 parts In-Stock

1+ parts

$7.090

100+ parts

$4.630

1k+ parts

$4.480

10k+ parts

$4.040

680

$7.090

$4.630

$4.480

$4.040

DigiKey

USA . 98 parts In-Stock

1+ parts

$7.090

100+ parts

$4.634

1k+ parts

$4.158

10k+ parts

$4.048

98

$7.090

$4.634

$4.158

$4.048

Newark

USA . 60 parts In-Stock

1+ parts

$7.160

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$4.890

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$4.320

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60

$7.160

$4.890

$4.320

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Verical

USA . 9,990 parts In-Stock

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$4.085

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$4.085

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EBV Elektronik

Germany . 720 parts In-Stock

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Distributors (In-Stock)

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Digiode

USA . 969 parts In-Stock

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$5.947

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Nova Conductors

Japan . 46 parts In-Stock

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$6.210

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Vyrian

USA . 6,015 parts In-Stock

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Anansix

USA . 2,144 parts In-Stock

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Flip Electronics

USA . 120 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 128 parts In-Stock

1+ parts

$2.930

100+ parts

$2.857

1k+ parts

$2.842

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128

$2.930

$2.857

$2.842

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Ampacity Inc.

Singapore . 188 parts In-Stock

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$5.040

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Corphita

USA . 4,692 parts In-Stock

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$5.634

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4,692

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Continental Prestige Electronics

USA . 2,468 parts In-Stock

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$6.210

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$6.086

2,468

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$6.086

Netroflash

USA . 100 parts In-Stock

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$6.210

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Aztec Data Supply Inc.

USA . 2,791 parts In-Stock

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$24.830

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Microchip USA

USA . 1,121 parts In-Stock

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$25.564

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Corohmni

South Africa . 5 parts In-Stock

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$33.598

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$33.598

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$50.664

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$48.130

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$48.130

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2,000

$50.664

$48.130

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Lixinc

USA . 16,664 parts In-Stock

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iodParts Technologies Inc.

India . 6,000 parts In-Stock

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Infinite Electronics LLP (Excess)

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Argo Parts USA

USA . 4,253 parts In-Stock

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UNI Independent Distributors

Spain . 144 parts In-Stock

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Overview

Discover the LPC55S16JBD100E by NXP Semiconductors, a top-of-the-line microcontroller that offers unparalleled performance and reliability. With cutting-edge technology and superior manufacturing standards, NXP Semiconductors delivers a product that exceeds expectations. This microcontroller is perfect for a wide range of applications, from IoT devices to industrial automation. Unlock endless possibilities with the LPC55S16JBD100E and experience the value, benefits, and advantages it brings to your projects. Elevate your designs with NXP Semiconductors today.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Maximum Supply Voltage: 3.6 V

Offers flexibility in power supply options and compatibility with a wide range of applications.

Package Shape: SQUARE

Square package shape allows for efficient use of PCB space and easy placement on the board.

Bit Size: 32

32-bit architecture enables faster processing speeds and handling of larger data sets.

No. of Terminals: 100

Sufficient number of terminals for connecting to various peripheral devices, interfaces, and sensors.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Flatpack, low profile, and fine pitch package style ensures efficient heat dissipation and compact design.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for efficient power consumption and operation in low-power modes.

Maximum Operating Temperature: 105 °C

Wide operating temperature range makes the microcontroller suitable for industrial and automotive applications.

CPU Family: CORTEX-M33

Cortex-M33 architecture offers high performance, energy efficiency, and security features for embedded applications.

Minimum Operating Temperature: -40 °C

Can operate in extreme low-temperature conditions, suitable for outdoor or harsh environments.

Terminal Finish: TIN

Tin terminal finish provides good electrical conductivity and solderability for reliable connections.

ADC Channels: YES

Built-in analog-to-digital converters enable the microcontroller to interface with analog sensors and signals.

DMA Channels: YES

Direct Memory Access (DMA) channels improve data transfer efficiency and reduce CPU workload.

Terminal Position: QUAD

Quad terminal position allows for easy routing of connections and efficient PCB layout.

ROM Words: 262144

Large ROM capacity enables storage of program code, firmware, and data for complex applications.

Width: 14 mm

Compact width size for space-constrained designs and integration into small form factor devices.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Rich set of peripherals enhance the functionality and versatility of the microcontroller for diverse applications.

Maximum Clock Frequency: 32 MHz

High clock frequency supports fast processing speeds and real-time operation of connected devices.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient duration during assembly processes.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures secure solder joints and reliability in harsh operating conditions.

Length: 14 mm

Compact length size suitable for integration into small footprint devices and systems.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC-based microcontroller design offers high performance, low power consumption, and efficient code execution.

RAM Bytes: 98304

Large RAM capacity for data storage, variable handling, and multitasking capabilities in embedded applications.

Terminal Form: GULL WING

Gull wing terminal form provides reliable solder joints and easy PCB assembly during manufacturing.

Analog To Digital Convertors: 10-Ch 16-Bit

Multiple 16-bit analog-to-digital converters enable accurate and high-resolution conversion of analog signals.

Nominal Supply Voltage: 3 V

Stable and common nominal supply voltage for compatibility with standard power sources and circuits.

PWM Channels: YES

Pulse Width Modulation (PWM) channels support precise control of connected devices such as motors and LEDs.

Connectivity: I2C, I2S, CAN, SPI, UART, USART, USB

Versatile connectivity options for interfacing with a wide range of devices, sensors, and communication protocols.

ROM Programmability: FLASH

Flash programmable ROM allows for easy updating of firmware, code modifications, and customization of applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables compact design, high pin density, and efficient signal routing on PCBs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level 3 indicates that the microcontroller requires standard handling and storage procedures.

Speed: 150 rpm

Operating at 150 rpm ensures efficient data processing, real-time response, and smooth operation of connected systems.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits allows for efficient program execution, storage, and retrieval within the microcontroller.

No. of I/O Lines: 64

Sufficient number of input/output lines for connecting to external peripherals, sensors, displays, and communication interfaces.

Technical Specifications

Microcontrollers LPC55S16JBD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC55S16JBD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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