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LPC55S14JBD64K

NXP Semiconductors

LPC55S14JBD64K by NXP Semiconductors

NXP Semiconductors' LPC55S14JBD64K is a 32-bit microcontroller with 131072 ROM words and 81920 RAM bytes. Featuring Cortex-M33 CPU family, it offers 10-Ch 16-Bit ADC channels and PWM channels for applications requiring I2C, CAN, SPI connectivity at a max clock frequency of 32 MHz.

Median Price

$4.409

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 800 parts In-Stock

1+ parts

$5.850

100+ parts

$3.752

1k+ parts

$3.401

10k+ parts

$3.322

800

$5.850

$3.752

$3.401

$3.322

Verical

USA . 9,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$2.968

10k+ parts

-

9,600

-

-

$2.968

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,993 parts In-Stock

1+ parts

$4.693

100+ parts

-

1k+ parts

-

10k+ parts

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4,993

$4.693

-

-

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Vyrian

USA . 4,846 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,846

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-

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Anansix

USA . 1,112 parts In-Stock

1+ parts

-

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1,112

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Nova Conductors

Japan . 44 parts In-Stock

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44

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 375 parts In-Stock

1+ parts

$3.820

100+ parts

-

1k+ parts

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375

$3.820

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Corphita

USA . 2,594 parts In-Stock

1+ parts

$4.446

100+ parts

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1k+ parts

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10k+ parts

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2,594

$4.446

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AZTECH Wire

Italy . 813 parts In-Stock

1+ parts

$5.298

100+ parts

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1k+ parts

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813

$5.298

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Microchip USA

USA . 5,941 parts In-Stock

1+ parts

$23.638

100+ parts

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5,941

$23.638

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Aztec Data Supply Inc.

USA . 142 parts In-Stock

1+ parts

$58.830

100+ parts

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142

$58.830

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Corohmni

South Africa . 268 parts In-Stock

1+ parts

$66.052

100+ parts

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268

$66.052

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UNI Independent Distributors

Spain . 5,891 parts In-Stock

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5,891

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Continental Prestige Electronics

USA . 5,098 parts In-Stock

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5,098

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Argo Parts USA

USA . 2,398 parts In-Stock

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2,398

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Aranea Global

USA . 2,000 parts In-Stock

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2,000

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Overview

Unlock the power of innovation with the LPC55S14JBD64K by NXP Semiconductors. As a leader in microcontroller technology, NXP delivers cutting-edge solutions that revolutionize industries. This versatile microcontroller offers unparalleled performance and reliability, making it ideal for a wide range of applications. From IoT devices to smart home automation, the LPC55S14JBD64K provides the perfect balance of efficiency and functionality. Experience the next level of connectivity and performance with NXP Semiconductors.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and efficient assembly onto printed circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Provides flexibility in power supply options without risking damage to the microcontroller.

Package Shape: SQUARE

Enables compact and space-efficient design layouts for electronic devices.

Bit Size: 32

Offers high processing power and capability for various complex tasks and calculations.

No. of Terminals: 64

Sufficient number of terminals for connectivity with other components and peripherals in the system.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Ideal package style for space-constrained applications and enhanced PCB layout.

Minimum Supply Voltage: 1.8 V

Allows for operation in low-power scenarios and extends battery life in portable devices.

Maximum Operating Temperature: 105 °C

Ensures reliable performance even in high-temperature environments or applications.

CPU Family: CORTEX-M33

Belongs to a powerful and efficient CPU family known for performance and energy efficiency.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions or industrial environments with low temperatures.

Terminal Finish: TIN

Provides good solderability for effective and reliable connections during assembly.

ADC Channels: YES

Enables analog-to-digital conversion for sensor interfacing and data acquisition in real-world applications.

DMA Channels: YES

Facilitates efficient data transfer between peripherals, reducing CPU workload and enhancing system performance.

Terminal Position: QUAD

Quad terminal configuration ensures secure and stable connections on the PCB, minimizing signal interference.

ROM Words: 131072

Large ROM memory capacity for storing program instructions, data, and firmware for various applications.

Width: 10 mm

Compact width size for space-constrained designs and PCB layouts.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Rich set of peripherals for enhanced functionality, including power management, communication, and timing features.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast processing and execution of instructions in time-critical applications.

Maximum Time At Peak Reflow Temperature (s): 30

Optimal reflow process time for efficient and reliable soldering during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high reflow temperatures for soldering without compromising component integrity.

Length: 10 mm

Compact length size for space-efficient board designs and integration into small devices.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture for improved performance, power efficiency, and real-time operation.

RAM Bytes: 81920

Sufficient RAM capacity for data storage, buffering, and multitasking in diverse embedded applications.

Terminal Form: GULL WING

Gull-wing terminal form factor for secure mounting and reliable solder joints on the PCB.

Analog To Digital Convertors: 10-Ch 16-Bit

High-resolution ADCs for accurate analog signal conversion and processing in sensor-based applications.

Nominal Supply Voltage: 3 V

Standard supply voltage for compatibility with common power sources and electronic components.

PWM Channels: YES

Provides Pulse-Width Modulation channels for precise control of motors, actuators, and other analog devices.

Connectivity: I2C, I2S, CAN, SPI, UART, USART, USB

Diverse connectivity options for communication with external devices, networks, and interfaces.

ROM Programmability: FLASH

Flash ROM for program storage, flexibility, and reprogramming capabilities in field-upgradeable applications.

Terminal Pitch: 0.5 mm

Fine terminal pitch for compact PCB layout and high-density interconnections in modern electronic designs.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate sensitivity to moisture, requiring standard handling and storage precautions.

Speed: 150 rpm

Operates at a speed of 150 rotations per minute, suitable for various motor control and timing applications.

On Chip Program ROM Width: 8

On-chip ROM with 8-bit width for efficient program storage and retrieval during execution.

No. of I/O Lines: 36

Sufficient number of input/output lines for interfacing with external sensors, actuators, and peripherals in the system.

Technical Specifications

Microcontrollers LPC55S14JBD64K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

36

No. of Terminals:

64

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC55S14JBD64K Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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