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LPC5516JBD100K

NXP Semiconductors

LPC5516JBD100K by NXP Semiconductors

NXP Semiconductors' LPC5516JBD100K is a 32-bit microcontroller with 262144 ROM words and 98304 RAM bytes. It features 10-Ch 16-Bit ADC channels, 33 DMA channels, and peripherals like BOD, CRC, PWM. Ideal for applications requiring connectivity via I2C, CAN, SPI, UART, USB at a max clock frequency of 32 MHz.

Median Price

$7.280

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 408 parts In-Stock

1+ parts

$7.280

100+ parts

$4.740

1k+ parts

$3.910

10k+ parts

-

408

$7.280

$4.740

$3.910

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DigiKey

USA . 180 parts In-Stock

1+ parts

$7.280

100+ parts

$4.732

1k+ parts

$4.288

10k+ parts

$4.232

180

$7.280

$4.732

$4.288

$4.232

Verical

USA . 9,900 parts In-Stock

1+ parts

-

100+ parts

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$3.782

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9,900

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$3.782

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EBV Elektronik

Germany . 1,800 parts In-Stock

1+ parts

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1,800

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Avnet

USA . 90 parts In-Stock

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90

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Distributors (In-Stock)

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Nova Conductors

Japan . 600 parts In-Stock

1+ parts

$4.365

100+ parts

-

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600

$4.365

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Digiode

USA . 2,017 parts In-Stock

1+ parts

$4.588

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2,017

$4.588

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Vyrian

USA . 6,019 parts In-Stock

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6,019

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Anansix

USA . 2,728 parts In-Stock

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2,728

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 721 parts In-Stock

1+ parts

$3.760

100+ parts

$3.666

1k+ parts

$3.647

10k+ parts

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721

$3.760

$3.666

$3.647

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Corphita

USA . 1,548 parts In-Stock

1+ parts

$4.347

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1,548

$4.347

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Argo Parts USA

USA . 4,263 parts In-Stock

1+ parts

$4.365

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4,263

$4.365

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Continental Prestige Electronics

USA . 1,192 parts In-Stock

1+ parts

$4.365

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$4.278

1,192

$4.365

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$4.278

Ampacity Inc.

Singapore . 841 parts In-Stock

1+ parts

$8.180

100+ parts

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841

$8.180

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Microchip USA

USA . 9,746 parts In-Stock

1+ parts

$29.404

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9,746

$29.404

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Corohmni

South Africa . 296 parts In-Stock

1+ parts

$34.168

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296

$34.168

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Aztec Data Supply Inc.

USA . 2,028 parts In-Stock

1+ parts

$43.700

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2,028

$43.700

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UNI Independent Distributors

Spain . 4,168 parts In-Stock

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4,168

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Glotronic Ltd.

UK . 720 parts In-Stock

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720

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Infinite Electronics LLP (Excess)

. 503 parts In-Stock

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503

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GreenTree Electronics

Israel . 500 parts In-Stock

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500

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Overview

Experience unmatched performance and reliability with the LPC5516JBD100K microcontroller from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality products that are perfect for a wide range of applications. Whether you're working on IoT devices, industrial control systems, or automotive electronics, this microcontroller offers exceptional value, benefits, and advantages to meet your needs. Trust NXP to provide innovative solutions that drive your projects forward.

Feature Benefit Bullets

Surface Mount: YES

Allows for easy and quick assembly onto a printed circuit board, making it suitable for mass production.

Maximum Supply Voltage: 3.6 V

Provides a wide range of supply voltage tolerance, increasing flexibility in power supply options.

Package Shape: SQUARE

Square shape is compact and efficient, saving space on the PCB.

Bit Size: 32

High bit size allows for complex calculations and processing capabilities.

No. of Terminals: 100

Ample number of terminals provide versatility in connectivity options.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style offers a low profile design with fine pitch terminals, enabling compact and sleek product design.

Minimum Supply Voltage: 1.8 V

Low minimum supply voltage allows for energy efficiency and extended battery life in portable devices.

Maximum Operating Temperature: 105 °C

High operating temperature range ensures product reliability in various environmental conditions.

CPU Family: CORTEX-M33

Utilizes advanced Cortex-M33 architecture for high performance and energy efficiency.

Minimum Operating Temperature: -40 °C

Wide range of operating temperature makes this microcontroller suitable for both industrial and automotive applications.

ADC Channels: YES

Integrated ADC channels enable analog signal processing, essential for sensor interfacing.

DMA Channels: YES

DMA channels improve data transfer efficiency and offload CPU for multitasking capabilities.

Terminal Finish: TIN

TIN finish provides good solderability and conductivity for reliable connections.

ROM Words: 262144

Large ROM size allows for storing program instructions and data, enabling complex applications.

Width: 14 mm

Compact width makes it suitable for space-constrained applications.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Wide range of integrated peripherals enhance functionality and connectivity options.

Maximum Clock Frequency: 32 MHz

High clock frequency allows for fast operation and real-time processing of data.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperature for 30 seconds, ensuring reliable soldering during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature tolerance ensures robustness during manufacturing processes.

Length: 14 mm

Compact length makes it suitable for various form factor designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes RISC architecture for efficient and streamlined data processing.

RAM Bytes: 98304

Ample RAM size allows for efficient data storage and manipulation.

Terminal Form: GULL WING

Gull wing terminals provide mechanical strength and reliability during assembly.

Analog To Digital Convertors: 10-Ch 16-Bit

10-channel 16-bit ADC converters provide high-resolution analog to digital conversion for accurate sensor data processing.

Nominal Supply Voltage: 3 V

Optimal nominal supply voltage for stable operation and performance.

PWM Channels: YES

Integrated PWM channels enable precise control of analog signals, essential for motor and power management.

Connectivity: I2C, I2S, CAN, SPI, UART, USART, USB

A wide range of connectivity options for seamless integration with various external devices and communication protocols.

ROM Programmability: FLASH

Flash programmable ROM allows for easy and flexible firmware updates and customization.

Terminal Pitch: 0.5 mm

Fine terminal pitch enables high-density packaging for compact designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates moderate sensitivity to moisture, suitable for standard soldering processes.

Speed: 150 rpm

High processing speed for real-time applications and data handling.

On Chip Program ROM Width: 8

8-bit on-chip program ROM width for efficient instruction execution and program storage.

No. of I/O Lines: 64

Ample I/O lines for versatile interfacing and connectivity with external devices and peripherals.

Technical Specifications

Microcontrollers LPC5516JBD100K attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

98304

ROM Words:

262144

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC5516JBD100K Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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