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LPC5514JBD100E

NXP Semiconductors

LPC5514JBD100E by NXP Semiconductors

NXP Semiconductors' LPC5514JBD100E is a 32-bit microcontroller with 100 terminals, operating at up to 32 MHz. Featuring 10-Ch 16-Bit ADCs and PWM channels, it's ideal for applications requiring I2C, CAN, SPI connectivity and peripherals like RTC and DMA(33). With a wide temperature range (-40 to 105 °C), this Cortex-M33 CPU family chip offers extensive on-chip ROM programmability (131072 words) and ample RAM (81920 bytes).

Median Price

$6.180

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 80 parts In-Stock

1+ parts

$4.850

100+ parts

$2.680

1k+ parts

$2.570

10k+ parts

-

80

$4.850

$2.680

$2.570

-

Newark

USA . 30 parts In-Stock

1+ parts

$6.180

100+ parts

$3.800

1k+ parts

$3.440

10k+ parts

-

30

$6.180

$3.800

$3.440

-

Chip1Stop

Japan . 90 parts In-Stock

1+ parts

$6.310

100+ parts

$4.800

1k+ parts

$3.960

10k+ parts

$3.300

90

$6.310

$4.800

$3.960

$3.300

Mouser Electronics

USA . 296 parts In-Stock

1+ parts

$6.330

100+ parts

$3.670

1k+ parts

$3.640

10k+ parts

$3.580

296

$6.330

$3.670

$3.640

$3.580

Element14

Singapore . 90 parts In-Stock

1+ parts

$9.950

100+ parts

$6.460

1k+ parts

$5.590

10k+ parts

-

90

$9.950

$6.460

$5.590

-

Verical

USA . 9,990 parts In-Stock

1+ parts

-

100+ parts

$3.238

1k+ parts

-

10k+ parts

-

9,990

-

$3.238

-

-

DigiKey

USA . 206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.360

10k+ parts

-

206

-

-

$3.360

-

Flip Electronics (Authorized)

USA . 206 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

206

-

-

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$4.243

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$4.243

-

-

-

Digiode

USA . 2,685 parts In-Stock

1+ parts

$5.634

100+ parts

-

1k+ parts

-

10k+ parts

-

2,685

$5.634

-

-

-

Vyrian

USA . 7,464 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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7,464

-

-

-

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Flip Electronics

USA . 6,056 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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6,056

-

-

-

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Anansix

USA . 1,399 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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1,399

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 311 parts In-Stock

1+ parts

$5.337

100+ parts

-

1k+ parts

-

10k+ parts

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311

$5.337

-

-

-

Ampacity Inc.

Singapore . 146 parts In-Stock

1+ parts

$6.200

100+ parts

-

1k+ parts

-

10k+ parts

-

146

$6.200

-

-

-

Continental Prestige Electronics

USA . 90 parts In-Stock

1+ parts

$7.470

100+ parts

$4.280

1k+ parts

-

10k+ parts

-

90

$7.470

$4.280

-

-

Microchip USA

USA . 1,379 parts In-Stock

1+ parts

$20.272

100+ parts

-

1k+ parts

-

10k+ parts

-

1,379

$20.272

-

-

-

Aztec Data Supply Inc.

USA . 1,850 parts In-Stock

1+ parts

$63.190

100+ parts

-

1k+ parts

-

10k+ parts

-

1,850

$63.190

-

-

-

Corohmni

South Africa . 323 parts In-Stock

1+ parts

$79.875

100+ parts

-

1k+ parts

-

10k+ parts

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323

$79.875

-

-

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UNI Independent Distributors

Spain . 5,309 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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5,309

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Argo Parts USA

USA . 3,146 parts In-Stock

1+ parts

-

100+ parts

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3,146

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$4.158

1k+ parts

$4.031

10k+ parts

$3.946

2,000

-

$4.158

$4.031

$3.946

Overview

Unleash the power of innovation with the LPC5514JBD100E by NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unparalleled performance and reliability for a wide range of applications. From IoT devices to industrial automation, this cutting-edge product delivers exceptional value and benefits to customers seeking top-notch quality and advanced features. Elevate your projects to new heights with the LPC5514JBD100E and experience the difference that only NXP Semiconductors can provide.

Feature Benefit Bullets

Surface Mount: YES

Easy to assemble onto printed circuit boards, saving time and effort during manufacturing.

Maximum Supply Voltage: 3.6 V

Allows for flexibility in power supply options and compatibility with a range of external components.

Package Shape: SQUARE

Saves space on PCB and allows for efficient layout designs.

Bit Size: 32

Provides high processing power and capability for running complex algorithms and applications.

No. of Terminals: 100

Offers ample connectivity options for interfacing with external devices and peripherals.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

Enables compact and slim device designs, suitable for space-constrained applications.

Minimum Supply Voltage: 1.8 V

Supports low-power operation and energy-efficient designs.

Maximum Operating Temperature: 105 °C

Provides robust performance even in high-temperature environments.

CPU Family: CORTEX-M33

Features modern architecture with advanced capabilities for processing tasks efficiently.

Minimum Operating Temperature: -40 °C

Ensures reliable operation in extreme cold conditions.

Terminal Finish: TIN

Offers good electrical conductivity and durability for long-term use.

ADC Channels: YES

Enables analog-to-digital conversion for interfacing with sensors and inputs.

DMA Channels: YES

Facilitates efficient data transfer and processing, enhancing overall system performance.

Terminal Position: QUAD

Provides a stable and secure connection for terminals on the PCB.

ROM Words: 131072

Offers ample storage capacity for program storage and data handling.

Width: 14 mm

Compact size for fitting into small form factor devices.

Peripherals: BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Comprehensive set of peripherals for enhanced functionality and application support.

Maximum Clock Frequency: 32 MHz

High clock speed for quick data processing and response times.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering and assembly processes during manufacturing.

Peak Reflow Temperature °C: 260

Withstands high-temperature reflow processes for board assembly.

Length: 14 mm

Compact size for space-constrained designs.

Peripheral IC Type: MICROCONTROLLER, RISC

Utilizes a RISC architecture for efficient and streamlined operations.

RAM Bytes: 81920

Offers ample memory for data storage and manipulation.

Terminal Form: GULL WING

Secure terminal form factor for reliable connections on the PCB.

Analog To Digital Convertors: 10-Ch 16-Bit

High-resolution ADCs for accurate analog signal processing.

Nominal Supply Voltage: 3 V

Common supply voltage for easy integration with existing systems.

PWM Channels: YES

Supports pulse-width modulation for precise control of output signals.

Connectivity: I2C, I2S, CAN, SPI, UART, USART, USB

Versatile connectivity options for interfacing with a wide range of devices and protocols.

ROM Programmability: FLASH

Allows for flexible programming and updating of firmware.

Terminal Pitch: 0.5 mm

Fine pitch for dense PCB layouts and high terminal density.

Moisture Sensitivity Level (MSL): 3

Suitable for reflow soldering processes with moderate moisture resistance.

Speed: 150 rpm

Fast processing speed for quick response times in applications.

On Chip Program ROM Width: 8

Efficient use of on-chip ROM for storing program code.

No. of I/O Lines: 64

Sufficient I/O lines for interfacing with external devices and peripherals.

Technical Specifications

Microcontrollers LPC5514JBD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M33

Maximum Clock Frequency:

32 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

81920

ROM Words:

131072

ROM Programmability:

FLASH

Speed:

150 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.8 V

Nominal Supply Voltage:

3 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

I2C, I2S, CAN, SPI, UART, USART, USB

Peripherals:

BOD, COMPARATOR, DMA(33), CRC, POR, PWM, RTC, TIMER(9), WDT

Analog To Digital Convertors:

10-Ch 16-Bit

Trade Compliance

LPC5514JBD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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