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LPC54S018JET180E

NXP Semiconductors

LPC54S018JET180E by NXP Semiconductors

NXP Semiconductors' LPC54S018JET180E is a 32-bit microcontroller with Cortex-M4 CPU, 368640 RAM bytes, and 16K data EEPROM size. It features 12 ADC channels, CAN, Ethernet, I2C(10), SPI(11), UART(10) connectivity options. Ideal for applications requiring high-speed processing at up to 25 MHz clock frequency in a compact square package with 180 terminals.

Median Price

$11.550

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Element14

Singapore . 189 parts In-Stock

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$11.550

100+ parts

$8.640

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$7.230

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189

$11.550

$8.640

$7.230

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Distributors (In-Stock)

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Digiode

USA . 3,294 parts In-Stock

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$10.972

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$10.972

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Vyrian

USA . 8,941 parts In-Stock

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Chip Stock

USA . 1,125 parts In-Stock

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Anansix

USA . 598 parts In-Stock

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598

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Nova Conductors

Japan . 10 parts In-Stock

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10

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Distributors (Availability)

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Continental Prestige Electronics

USA . 189 parts In-Stock

1+ parts

$6.430

100+ parts

$4.410

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189

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$4.410

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AZTECH Wire

Italy . 573 parts In-Stock

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$7.809

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Vigor

Singapore . 189 parts In-Stock

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$8.740

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189

$8.740

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Semicontronic

India . 189 parts In-Stock

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$9.820

100+ parts

$9.574

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$9.525

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189

$9.820

$9.574

$9.525

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Corphita

USA . 758 parts In-Stock

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$10.395

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Aztec Data Supply Inc.

USA . 2,082 parts In-Stock

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$16.320

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Ampacity Inc.

Singapore . 189 parts In-Stock

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$21.370

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189

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Corohmni

South Africa . 922 parts In-Stock

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$26.322

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QUARKTWIN TECHNOLOGY LTD

USA . 18,043 parts In-Stock

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Microchip USA

USA . 4,764 parts In-Stock

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UNI Independent Distributors

Spain . 3,115 parts In-Stock

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Argo Parts USA

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Perfect Parts

USA . 423 parts In-Stock

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your projects with the LPC54S018JET180E microcontroller from NXP Semiconductors. With its cutting-edge technology and high-quality manufacturing, this device offers unmatched performance and reliability. Ideal for a wide range of applications, this microcontroller provides customers with exceptional value, benefits, and advantages. Upgrade your designs today with the LPC54S018JET180E and experience innovation at its finest.

Feature Benefit Bullets

Surface Mount: YES

Surface mount capability makes it easy to solder onto PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle a higher supply voltage, providing flexibility in different applications.

Package Shape: SQUARE

Square package shape helps in easy placement and alignment on the PCB.

Bit Size: 32

32-bit processing capability allows for complex calculations and high-speed operation.

No. of Terminals: 180

Large number of terminals enable connectivity to multiple components and peripherals.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Grid array package style with thin profile and fine pitch enhances signal integrity and reduces signal loss.

Minimum Supply Voltage: 2.7 V

Can operate at low supply voltage, conserving power and improving efficiency.

Maximum Operating Temperature: 105 °C

High operating temperature range allows for use in harsh environmental conditions.

CPU Family: CORTEX-M4

Cortex-M4 architecture offers high performance and efficiency.

Minimum Operating Temperature: -40 °C

Low operating temperature capability makes it suitable for industrial and automotive applications.

ADC Channels: YES

Analog to digital converter channels enable the microcontroller to read analog sensor inputs.

DMA Channels: YES

Direct memory access channels improve data transfer speed and efficiency.

Terminal Position: BOTTOM

Bottom terminal position simplifies PCB layout and routing.

Width: 12 mm

Compact width size saves space on the PCB.

Data EEPROM Size: 16K

Large EEPROM size allows for storing significant amounts of data.

Peripherals: BOD, DMA(30), POR, RTC, TIMER(9), WDT

A wide range of peripherals enhance the microcontroller's functionality and versatility.

Maximum Clock Frequency: 25 MHz

High clock frequency enables fast processing speeds and real-time operation.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance ensures reliability during manufacturing processes.

Length: 12 mm

Compact length size saves space on the PCB.

Peripheral IC Type: MICROCONTROLLER, RISC

Microcontroller with RISC architecture offers high performance and power efficiency.

RAM Bytes: 368640

Large RAM size allows for running multiple applications and storing temporary data.

Terminal Form: BALL

Ball terminal form enables easy soldering and robust connections.

Analog To Digital Convertors: 12-Ch 12-Bit

12-channel 12-bit ADCs provide high-resolution analog input readings.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage ensures consistent performance.

PWM Channels: YES

PWM channels enable precise control of motors and other actuators.

Connectivity: CAN(2), ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2)

Various connectivity options allow for integration with different communication protocols and peripherals.

ROM Programmability: FLASH

Flash programmability enables easy updating of firmware and applications.

Terminal Pitch: 0.8 mm

Narrow terminal pitch enhances signal integrity and reduces crosstalk.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates that the microcontroller can withstand standard humidity exposure levels.

Speed: 180 rpm

High speed capability enables quick data processing and response times.

On Chip Program ROM Width: 8

On-chip ROM width of 8 bits allows for efficient program execution.

No. of I/O Lines: 145

Large number of I/O lines provide versatile connectivity options for external devices and peripherals.

Technical Specifications

Microcontrollers LPC54S018JET180E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

12 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

145

No. of Terminals:

180

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

368640

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

2.7 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Width:

12 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2)

Peripherals:

BOD, DMA(30),POR, RTC, TIMER(9), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54S018JET180E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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