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LPC54S016JBD100E

NXP Semiconductors

LPC54S016JBD100E by NXP Semiconductors

MICROCONTROLLER, RISC; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE; ROM Programmability: FLASH;

Median Price

$6.611

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,990 parts In-Stock

1+ parts

-

100+ parts

$6.611

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9,990

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$6.611

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Flip Electronics (Authorized)

USA . 630 parts In-Stock

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630

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Distributors (In-Stock)

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Digiode

USA . 873 parts In-Stock

1+ parts

$9.928

100+ parts

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873

$9.928

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Vyrian

USA . 8,654 parts In-Stock

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8,654

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ComSIT USA

USA . 4,923 parts In-Stock

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4,923

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ComSIT Distribution GmbH

Germany . 3,692 parts In-Stock

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3,692

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Anansix

USA . 2,073 parts In-Stock

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2,073

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Flip Electronics

USA . 451 parts In-Stock

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451

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,731 parts In-Stock

1+ parts

$9.405

100+ parts

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2,731

$9.405

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Vigor

Singapore . 6,073 parts In-Stock

1+ parts

$10.470

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6,073

$10.470

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Microchip USA

USA . 1,550 parts In-Stock

1+ parts

$37.240

100+ parts

$36.710

1k+ parts

$36.440

10k+ parts

$36.180

1,550

$37.240

$36.710

$36.440

$36.180

QUARKTWIN TECHNOLOGY LTD

USA . 24,260 parts In-Stock

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24,260

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UNI Independent Distributors

Spain . 4,687 parts In-Stock

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4,687

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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iodParts Technologies Inc.

India . 900 parts In-Stock

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900

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Perfect Parts

USA . 302 parts In-Stock

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302

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Technical Specifications

Microcontrollers LPC54S016JBD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

0

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

368640

ROM Programmability:

FLASH

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

CAN(2),ETHERNET, I2C(10), I2S(2), SPI(11), UART(10), USB(2)

Peripherals:

BOD, DMA(30),POR, RTC, TIMER(9), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54S016JBD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

5A992.C

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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