Loading...

LPC54605J512BD100E

NXP Semiconductors

LPC54605J512BD100E by NXP Semiconductors

NXP Semiconductors' LPC54605J512BD100E microcontroller features a 32-bit Cortex-M4 CPU, 12-Ch 12-Bit ADC, and 16K Data EEPROM. Ideal for industrial applications with a temperature range of -40 to 105 °C, it offers connectivity options like I2C, SPI, and USB along with 64 I/O lines for versatile usage.

Median Price

$5.952

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 9,990 parts In-Stock

1+ parts

-

100+ parts

$6.063

1k+ parts

-

10k+ parts

-

9,990

-

$6.063

-

-

Rochester

USA . 6,830 parts In-Stock

1+ parts

-

100+ parts

$5.840

1k+ parts

$5.230

10k+ parts

$4.920

6,830

-

$5.840

$5.230

$4.920

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$4.727

100+ parts

-

1k+ parts

-

10k+ parts

-

10

$4.727

-

-

-

Digiode

USA . 2,490 parts In-Stock

1+ parts

$5.596

100+ parts

-

1k+ parts

-

10k+ parts

-

2,490

$5.596

-

-

-

Flip Electronics

USA . 11,520 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11,520

-

-

-

-

Vyrian

USA . 5,219 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,219

-

-

-

-

Anansix

USA . 1,692 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,692

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Netroflash

USA . 500 parts In-Stock

1+ parts

$4.727

100+ parts

$4.633

1k+ parts

-

10k+ parts

-

500

$4.727

$4.633

-

-

Continental Prestige Electronics

USA . 353 parts In-Stock

1+ parts

$4.727

100+ parts

-

1k+ parts

-

10k+ parts

$4.633

353

$4.727

-

-

$4.633

Semicontronic

India . 11,245 parts In-Stock

1+ parts

$5.010

100+ parts

$4.885

1k+ parts

$4.860

10k+ parts

-

11,245

$5.010

$4.885

$4.860

-

Corphita

USA . 769 parts In-Stock

1+ parts

$5.301

100+ parts

-

1k+ parts

-

10k+ parts

-

769

$5.301

-

-

-

AZTECH Wire

Italy . 707 parts In-Stock

1+ parts

$9.900

100+ parts

-

1k+ parts

-

10k+ parts

-

707

$9.900

-

-

-

Ampacity Inc.

Singapore . 11,112 parts In-Stock

1+ parts

$10.900

100+ parts

-

1k+ parts

-

10k+ parts

-

11,112

$10.900

-

-

-

Aztec Data Supply Inc.

USA . 1,143 parts In-Stock

1+ parts

$17.050

100+ parts

-

1k+ parts

-

10k+ parts

-

1,143

$17.050

-

-

-

Microchip USA

USA . 1,525 parts In-Stock

1+ parts

$22.915

100+ parts

-

1k+ parts

-

10k+ parts

-

1,525

$22.915

-

-

-

Corohmni

South Africa . 1,089 parts In-Stock

1+ parts

$52.328

100+ parts

-

1k+ parts

-

10k+ parts

-

1,089

$52.328

-

-

-

Futuretech Components

Singapore . 700 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

700

-

-

-

-

Argo Parts USA

USA . 686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

686

-

-

-

-

UNI Independent Distributors

Spain . 230 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

230

-

-

-

-

Overview

Unleash the power of innovation with the LPC54605J512BD100E by NXP Semiconductors. This microcontroller offers unmatched quality and reliability, backed by the reputable manufacturer NXP Semiconductors. Ideal for a wide range of applications, this product provides customers with superior value, benefits, and advantages. From its advanced technology to its versatile connectivity options, the LPC54605J512BD100E is the key to taking your projects to the next level. Experience seamless performance and endless possibilities with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is lightweight and durable, making the microcontroller easy to handle and suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly of the microcontroller onto circuit boards, saving time and space.

Maximum Supply Voltage: 3.6 V

The high maximum supply voltage allows for flexible power options and compatibility with a wide range of systems.

Address Bus Width: 14

A wider address bus allows for a larger memory address space, enabling the microcontroller to handle more complex tasks and data.

Package Shape: SQUARE

The square package shape ensures even distribution of components, providing stability and reliability in the microcontroller's design.

Bit Size: 32

With a 32-bit architecture, the microcontroller can process data and instructions more efficiently, leading to improved performance and speed.

No. of Terminals: 100

Having a higher number of terminals allows for more connections and I/O flexibility, enabling the microcontroller to interface with multiple devices.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

This package style provides a compact and space-saving design, making it ideal for applications where size is a critical factor.

Minimum Supply Voltage: 1.71 V

The low minimum supply voltage helps in saving power and extends the battery life of the devices in which the microcontroller is used.

Maximum Operating Temperature: 105 °C

The high maximum operating temperature allows the microcontroller to function reliably in harsh environmental conditions without overheating.

CPU Family: CORTEX-M4

The CORTEX-M4 CPU family offers high performance and energy efficiency, making it suitable for a wide range of embedded applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures the microcontroller can operate in cold environments or during temperature fluctuations.

ADC Channels: YES

The presence of ADC channels enables the microcontroller to convert analog signals to digital data, enhancing its versatility in sensor applications.

DMA Channels: YES

DMA channels help in offloading data transfer tasks from the CPU, improving system efficiency and enabling faster data processing.

Terminal Position: QUAD

The quad terminal position allows for easy and secure mounting of the microcontroller onto the PCB, ensuring stable connections.

ROM Words: 524288

A large ROM size of 524288 words provides ample storage for program instructions, data, and firmware, allowing for complex software applications.

Maximum Seated Height: 1.6 mm

The low maximum seated height ensures the microcontroller can be used in compact designs without space constraints.

Width: 14 mm

The compact width of 14 mm allows for the microcontroller to be easily integrated into tight spaces or small form-factor devices.

Data EEPROM Size: 16K

The 16K data EEPROM size provides non-volatile memory storage for critical data and settings, ensuring data integrity even during power loss.

External Data Bus Width: 16

With a wider external data bus width of 16 bits, the microcontroller can handle larger data transfers more efficiently.

Peripherals: BOD, DMA(30), MMC, POR, RTC, SD, TIMER(10), WDT

The variety of peripherals such as Brown-Out Detection, DMA, Memory Management Controller, Real-Time Clock, Secure Digital Interface, Timers, and Watchdog Timer enhance the functionality and connectivity of the microcontroller.

Maximum Clock Frequency: 25 MHz

The high maximum clock frequency of 25 MHz allows for fast processing speeds, enabling the microcontroller to handle time-sensitive tasks effectively.

Peak Reflow Temperature °C: 260

The high peak reflow temperature ensures the microcontroller can withstand the reflow soldering process during PCB assembly without damage.

Length: 14 mm

The compact length of 14 mm contributes to the overall small footprint of the microcontroller, making it ideal for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade allows the microcontroller to operate reliably in harsh industrial environments with extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a microcontroller with Reduced Instruction Set Computing (RISC) architecture, it offers efficient data processing and lower power consumption for embedded systems.

RAM Bytes: 204800

The large RAM size of 204800 bytes provides ample temporary storage for data processing, multitasking, and execution of software applications.

Technology: CMOS

The use of CMOS technology ensures low power consumption, high noise immunity, and fast switching speeds in the microcontroller's design.

Terminal Form: GULL WING

The gull wing terminal form provides strong and reliable connections between the microcontroller and the PCB, ensuring secure mounting.

Analog To Digital Convertors: 12-Ch 12-Bit

With 12 analog to digital converters of 12-bit resolution, the microcontroller can accurately sample and convert analog signals for precise measurements.

Nominal Supply Voltage: 3.3 V

Having a stable nominal supply voltage of 3.3 V ensures consistent operation of the microcontroller and its peripherals within the specified voltage range.

PWM Channels: YES

The presence of PWM channels allows the microcontroller to generate precise and adjustable pulse-width modulated signals for controlling devices like motors and LEDs.

Connectivity: I2C, I2S, SPI, USART, USB

The microcontroller supports various connectivity options such as I2C, I2S, SPI, USART, and USB, enabling communication with external devices and peripherals.

ROM Programmability: FLASH

The flash programmable ROM allows for easy and efficient programming of the microcontroller with firmware updates and application code during development.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm provides high-density I/O connections, making the microcontroller suitable for compact and miniaturized designs.

Moisture Sensitivity Level (MSL): 3

The MSL rating of 3 indicates that the microcontroller is moderately moisture sensitive and should be handled and stored with care during assembly processes.

Speed: 180 rpm

The high speed of 180 rpm allows the microcontroller to process data and execute instructions rapidly, enhancing overall system performance.

On Chip Program ROM Width: 8

The on-chip program ROM width of 8 bits provides storage for boot code and essential program instructions, enabling quick system startup and operation.

No. of I/O Lines: 64

With 64 I/O lines, the microcontroller offers versatile interfacing options for connecting to external sensors, actuators, and communication devices.

Technical Specifications

Microcontrollers LPC54605J512BD100E attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

14

Bit Size:

32

CPU Family:

CORTEX-M4

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

YES

External Data Bus Width:

16

JESD-30 Code:

S-PQFP-G100

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

64

No. of Terminals:

100

On Chip Program ROM Width:

8

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

RAM Bytes:

204800

ROM Words:

524288

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

180 rpm

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

14 mm

Peripheral IC Type:

Data EEPROM Size:

16K

Connectivity:

I2C, I2S, SPI, USART, USB

Peripherals:

BOD, DMA(30), MMC, POR, RTC, SD, TIMER(10), WDT

Analog To Digital Convertors:

12-Ch 12-Bit

Trade Compliance

LPC54605J512BD100E Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20