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LPC2468FET208,551

NXP Semiconductors

LPC2468FET208,551 by NXP Semiconductors

NXP Semiconductors' LPC2468FET208,551 microcontroller features 32-bit data RAM, 24-bit address bus, and operates at a max frequency of 25 MHz. Ideal for industrial applications requiring CAN, I2C, and UART connectivity with low power mode support.

Median Price

$14.362

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 10 parts In-Stock

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Chip Stock

USA . 85,000 parts In-Stock

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Vyrian

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Digiode

USA . 1,068 parts In-Stock

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Anansix

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Flip Electronics

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Sunrise Surplus Inc.

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Distributors (Availability)

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AZTECH Wire

Italy . 261 parts In-Stock

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$9.693

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Continental Prestige Electronics

USA . 3,383 parts In-Stock

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$14.074

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Advanced Electronics

New Zealand . 700 parts In-Stock

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$16.660

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$15.327

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One Stop Electronics

USA . 1,434 parts In-Stock

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Semicontronic

India . 2,718 parts In-Stock

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Ampacity Inc.

Singapore . 225 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,860 parts In-Stock

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Microchip USA

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Perfect Parts

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Corphita

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Corohmni

South Africa . 1,669 parts In-Stock

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Argo Parts USA

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Overview

Experience the next level of innovation with the LPC2468FET208,551 microcontroller by NXP Semiconductors. Designed for industrial-grade applications, this powerful microcontroller offers unparalleled performance and reliability. With a wide range of peripherals including BOD, DMA, SDMMC, PWM, and more, this versatile device is perfect for a variety of projects. Trust in NXP Semiconductors' reputation for quality and unlock the full potential of your designs with the LPC2468FET208,551. Elevate your creations and exceed expectations with this cutting-edge microcontroller.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and thermal resistance for long-lasting performance.

Surface Mount: YES

Allows for easy installation on printed circuit boards for efficient assembly.

Maximum Supply Voltage: 3.6 V

Supports a wide range of voltage inputs for versatile applications.

On Chip Data RAM Width: 32

Allows for efficient data processing and storage capabilities.

Address Bus Width: 24

Enables access to a large memory space for complex algorithms and programs.

Package Shape: SQUARE

Facilitates space-saving design and efficient PCB layout.

Bit Size: 32

Offers high computational power and efficient data manipulation.

DAC Channels: YES

Enables analog signal output for various applications such as audio or sensor interfacing.

Power Supplies (V): 3.3

Runs on a standard voltage level for compatibility with power sources.

No. of Terminals: 208

Provides ample connectivity options for interfacing with external components.

Package Style (Meter): GRID ARRAY, THIN PROFILE, FINE PITCH

Enhances thermal performance and signal integrity in a compact package.

Minimum Supply Voltage: 3 V

Supports low power operation while maintaining stable performance.

Maximum Operating Temperature: 85 °C

Ensures reliable operation in a wide range of environmental conditions.

CPU Family: ARM7

Based on a proven architecture for reliable and efficient processing capabilities.

No. of External Interrupts: 4

Allows for responsive handling of external events for real-time applications.

Minimum Operating Temperature: -40 °C

Designed to operate in extreme cold environments for robust performance.

Terminal Finish: TIN SILVER COPPER

Provides a reliable electrical connection and corrosion resistance for long-term use.

ADC Channels: YES

Facilitates analog signal input for data acquisition and sensor interfacing.

DMA Channels: YES

Enables efficient data transfer between peripherals for optimized performance.

Terminal Position: BOTTOM

Simplifies PCB layout and allows for easy accessibility during assembly.

ROM Words: 32768

Provides ample memory space for storing program code and data.

Technical Specifications

Microcontrollers LPC2468FET208,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

24

Bit Size:

32

Boundary Scan:

YES

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

32

Format:

FIXED POINT

Integrated Cache:

NO

JESD-30 Code:

S-PBGA-B208

JESD-609 Code:

e1

Length:

15 mm

Low Power Mode:

YES

Moisture Sensitivity Level (MSL):

2

No. of DMA Channels:

1

No. of External Interrupts:

4

No. of I/O Lines:

160

No. of Serial I/Os:

4

No. of Terminals:

208

No. of Timers:

4

On Chip Data RAM Width:

32

On Chip Program ROM Width:

128

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

BGA208,17X17,32

Package Shape:

Package Style (Meter):

GRID ARRAY, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

65536

RAM Words:

16384

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1.2 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN SILVER COPPER

Terminal Form:

Terminal Pitch:

.8 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Width:

15 mm

Peripheral IC Type:

Data EEPROM Size:

0

Connectivity:

CAN(2), I2C(3), I2S, SSP(2), UART(4)

Peripherals:

BOD, DMA, SDMMC, PWM(2), TIMER(4), WDT

Analog To Digital Convertors:

8-Ch 10-Bit

Digital To Analog Convertors:

1-Ch 10-Bit

Trade Compliance

LPC2468FET208,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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