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LPC2361FBD100,551

NXP Semiconductors

LPC2361FBD100,551 by NXP Semiconductors

MICROCONTROLLER, RISC; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 100; Package Code: LFQFP; Package Shape: SQUARE;

Median Price

$10.978

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 69 parts In-Stock

1+ parts

$14.060

100+ parts

$9.561

1k+ parts

$8.860

10k+ parts

$8.671

69

$14.060

$9.561

$8.860

$8.671

Mouser Electronics

USA . 30 parts In-Stock

1+ parts

$15.600

100+ parts

$10.030

1k+ parts

$9.350

10k+ parts

-

30

$15.600

$10.030

$9.350

-

Verical

USA . 9,990 parts In-Stock

1+ parts

-

100+ parts

$7.897

1k+ parts

-

10k+ parts

-

9,990

-

$7.897

-

-

Rochester

USA . 108 parts In-Stock

1+ parts

-

100+ parts

$7.600

1k+ parts

$6.800

10k+ parts

$6.400

108

-

$7.600

$6.800

$6.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 432 parts In-Stock

1+ parts

$7.296

100+ parts

-

1k+ parts

-

10k+ parts

-

432

$7.296

-

-

-

Vyrian

USA . 6,737 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,737

-

-

-

-

Anansix

USA . 346 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

346

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 437 parts In-Stock

1+ parts

$6.912

100+ parts

-

1k+ parts

-

10k+ parts

-

437

$6.912

-

-

-

Vigor

Singapore . 56 parts In-Stock

1+ parts

$13.100

100+ parts

-

1k+ parts

-

10k+ parts

-

56

$13.100

-

-

-

Microchip USA

USA . 2,473 parts In-Stock

1+ parts

$39.256

100+ parts

-

1k+ parts

-

10k+ parts

-

2,473

$39.256

-

-

-

Advanced Electronics

New Zealand . 1,000 parts In-Stock

1+ parts

$51.527

100+ parts

$46.890

1k+ parts

$42.252

10k+ parts

-

1,000

$51.527

$46.890

$42.252

-

UNI Independent Distributors

Spain . 5,613 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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5,613

-

-

-

-

Perfect Parts

USA . 504 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

504

-

-

-

-

Technical Specifications

Microcontrollers LPC2361FBD100,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

YES

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G100

JESD-609 Code:

e3

Length:

14 mm

Moisture Sensitivity Level (MSL):

3

No. of I/O Lines:

70

No. of Terminals:

100

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP100,.63SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

34816

ROM Words:

65536

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

72 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

100 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

14 mm

Peripheral IC Type:

Trade Compliance

LPC2361FBD100,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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