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LPC2292FBD144,551

NXP Semiconductors

LPC2292FBD144,551 by NXP Semiconductors

NXP Semiconductors' LPC2292FBD144,551 is a 32-bit microcontroller with 24-bit address bus width and 32 external data bus width. It operates at up to 50 MHz clock frequency, suitable for industrial applications requiring PWM channels and ADC channels. The package style is flatpack, low profile, fine pitch with a terminal pitch of 0.5 mm.

Median Price

$9.450

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 700 parts In-Stock

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$9.450

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Vyrian

USA . 6,001 parts In-Stock

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Digiode

USA . 4,178 parts In-Stock

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Anansix

USA . 2,606 parts In-Stock

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Sternenhof Electronics

Switzerland . 50 parts In-Stock

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One Stop Electronics

USA . 540 parts In-Stock

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$10.000

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AZTECH Wire

Italy . 504 parts In-Stock

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$11.978

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Ampacity Inc.

Singapore . 902 parts In-Stock

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$14.000

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Microchip USA

USA . 183 parts In-Stock

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$28.450

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UNI Independent Distributors

Spain . 5,726 parts In-Stock

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Corphita

USA . 2,916 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$9.261

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$8.977

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$8.788

2,000

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$9.261

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$8.788

Overview

Elevate your projects with the LPC2292FBD144,551 by NXP Semiconductors, a premium microcontroller designed for optimal performance and reliability. Crafted with precision and expertise, NXP Semiconductors delivers top-notch quality for a wide range of applications. From industrial automation to consumer electronics, this versatile microcontroller offers unparalleled value, benefits, and advantages for customers seeking cutting-edge technology. Upgrade your devices with the LPC2292FBD144,551 and experience seamless operation like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

The surface mount feature allows for easy and efficient assembly onto circuit boards, saving time and labor costs.

Maximum Supply Voltage: 1.95 V

The high maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

Address Bus Width: 24

A wider address bus allows for a larger memory address space, enabling the microcontroller to handle more complex tasks and data storage.

Package Shape: SQUARE

The square package shape helps in efficient space utilization on circuit boards, especially in compact designs.

Bit Size: 32

The 32-bit architecture provides higher processing power and efficiency in handling data and instructions compared to lower bit sizes.

No. of Terminals: 144

The high number of terminals offer ample connectivity options for interfacing with external devices and peripherals.

Package Style: FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch style of the package allows for dense packing of components on the board, saving space and enhancing thermal management.

Minimum Supply Voltage: 1.65 V

The low minimum supply voltage ensures efficient power consumption and compatibility with low-power applications.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature makes the microcontroller suitable for industrial environments with varying temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable performance even in extreme cold conditions.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and corrosion resistance for long-term reliability.

ADC Channels: YES

The presence of ADC channels allows for analog-to-digital conversion, enabling the microcontroller to interface with analog sensors and devices.

Terminal Position: QUAD

The quad terminal position provides stable and secure connectivity on the circuit board, reducing the risk of signal interference or disconnection.

Maximum Seated Height: 1.6 mm

The low maximum seated height allows for slim and compact designs, ideal for space-constrained applications.

Width: 20 mm

The compact width of the microcontroller facilitates easy integration into small electronic devices and circuit designs.

External Data Bus Width: 32

The wide external data bus width of 32 bits enables rapid data transfer between the microcontroller and external memory or peripherals.

Maximum Clock Frequency: 50 MHz

The high maximum clock frequency of 50 MHz allows for fast execution of instructions and efficient processing of data in real-time applications.

Length: 20 mm

The compact length of the microcontroller contributes to space-saving designs and easy integration into electronic systems.

Temperature Grade: INDUSTRIAL

The industrial-grade temperature rating ensures reliable operation in harsh industrial environments with extended temperature ranges.

Peripheral IC Type: MICROCONTROLLER, RISC

Being a RISC-based microcontroller, it offers high performance and efficiency in executing instructions, making it suitable for complex applications.

Technology: CMOS

The CMOS technology used in the microcontroller ensures low power consumption, high noise immunity, and fast switching speeds.

Terminal Form: GULL WING

The gull wing terminal form provides secure mechanical and electrical connections, ensuring reliable functionality in various operating conditions.

Nominal Supply Voltage: 1.8 V

The nominal supply voltage of 1.8 V offers a balance between power efficiency and performance, suitable for a wide range of applications.

PWM Channels: YES

The presence of PWM channels enables precise control of pulse-width modulation signals, essential for tasks such as motor control and power management.

ROM Programmability: FLASH

The use of Flash ROM allows for easy programmability and reprogramming of the microcontroller, facilitating rapid prototyping and firmware updates.

Terminal Pitch: 0.5 mm

The fine terminal pitch of 0.5 mm allows for high-density mounting on circuit boards, enabling compact and space-efficient designs.

Speed: 60 rpm

The high speed of 60 rpm enables the microcontroller to execute instructions and process data quickly, supporting real-time applications with demanding performance requirements.

No. of I/O Lines: 112

The ample number of I/O lines provide extensive connectivity options for interfacing with external devices, sensors, and peripherals, enhancing the versatility of the microcontroller.

Technical Specifications

Microcontrollers LPC2292FBD144,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3V SUPPLY

Address Bus Width:

24

Bit Size:

32

Maximum Clock Frequency:

50 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

32

JESD-30 Code:

S-PQFP-G144

JESD-609 Code:

e3

Length:

20 mm

No. of I/O Lines:

112

No. of Terminals:

144

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Qualification:

Not Qualified

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

20 mm

Peripheral IC Type:

Trade Compliance

LPC2292FBD144,551 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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