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LPC2146FBD64,151

NXP Semiconductors

LPC2146FBD64,151 by NXP Semiconductors

NXP Semiconductors' LPC2146FBD64,151 is a 32-bit ARM7 microcontroller with 262144 ROM words and 40960 RAM bytes. Operating at up to 25 MHz, it features DAC and ADC channels for industrial applications requiring high-speed processing and precision analog-to-digital conversion within a compact FLATPACK package.

Median Price

$23.460

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 100 parts In-Stock

1+ parts

$23.460

100+ parts

$15.970

1k+ parts

$14.360

10k+ parts

-

100

$23.460

$15.970

$14.360

-

Verical

USA . 100 parts In-Stock

1+ parts

$23.460

100+ parts

$15.970

1k+ parts

$14.360

10k+ parts

-

100

$23.460

$15.970

$14.360

-

DigiKey

USA . 274 parts In-Stock

1+ parts

$24.760

100+ parts

$18.641

1k+ parts

$16.510

10k+ parts

-

274

$24.760

$18.641

$16.510

-

Mouser Electronics

USA . 473 parts In-Stock

1+ parts

$26.100

100+ parts

$18.170

1k+ parts

$17.480

10k+ parts

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473

$26.100

$18.170

$17.480

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Rochester

USA . 50 parts In-Stock

1+ parts

-

100+ parts

$14.120

1k+ parts

$12.630

10k+ parts

$11.890

50

-

$14.120

$12.630

$11.890

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,905 parts In-Stock

1+ parts

$12.170

100+ parts

-

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3,905

$12.170

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Vyrian

USA . 10,574 parts In-Stock

1+ parts

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10,574

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Anansix

USA . 2,043 parts In-Stock

1+ parts

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2,043

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

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700

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IBS Electronics

USA . 328 parts In-Stock

1+ parts

-

100+ parts

$18.822

1k+ parts

$19.242

10k+ parts

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328

-

$18.822

$19.242

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NAC Semi

USA . 320 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$20.520

10k+ parts

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320

-

-

$20.520

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Schukat

Germany . 70 parts In-Stock

1+ parts

-

100+ parts

$8.890

1k+ parts

-

10k+ parts

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70

-

$8.890

-

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Fibra_Brandt Electronic GMBH

Germany . 15 parts In-Stock

1+ parts

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15

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Bristol Electronics

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 296 parts In-Stock

1+ parts

$10.890

100+ parts

-

1k+ parts

-

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296

$10.890

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-

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Corphita

USA . 2,989 parts In-Stock

1+ parts

$11.529

100+ parts

-

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10k+ parts

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2,989

$11.529

-

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Component Stockers USA

USA . 840 parts In-Stock

1+ parts

$14.060

100+ parts

$14.020

1k+ parts

-

10k+ parts

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840

$14.060

$14.020

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Vigor

Singapore . 593 parts In-Stock

1+ parts

$20.500

100+ parts

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593

$20.500

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Corohmni

South Africa . 681 parts In-Stock

1+ parts

$22.360

100+ parts

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681

$22.360

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Modulus Dynamics

Lithuania . 3,223 parts In-Stock

1+ parts

$24.954

100+ parts

$24.954

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$24.954

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3,223

$24.954

$24.954

$24.954

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Microchip USA

USA . 2,441 parts In-Stock

1+ parts

$55.060

100+ parts

$54.100

1k+ parts

$53.630

10k+ parts

$53.150

2,441

$55.060

$54.100

$53.630

$53.150

Perfect Parts

USA . 5,934 parts In-Stock

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5,934

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UNI Independent Distributors

Spain . 5,642 parts In-Stock

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5,642

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Authorized Procurement Solutions

USA . 3,500 parts In-Stock

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3,500

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Argo Parts USA

USA . 2,553 parts In-Stock

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2,553

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Continental Prestige Electronics

USA . 2,081 parts In-Stock

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2,081

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Kepictronics

USA . 151 parts In-Stock

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151

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Aranea Global

USA . 50 parts In-Stock

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50

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Overview

Elevate your electronic projects with the LPC2146FBD64,151 microcontroller from NXP Semiconductors. Crafted with precision and expertise, this microcontroller offers unparalleled quality and reliability for a wide range of applications. With advanced features like DAC channels, ADC channels, and PWM channels, this product allows for seamless integration and efficient performance. Experience the value and benefits of NXP Semiconductors' cutting-edge technology in every project you undertake. Trust in the LPC2146FBD64,151 to deliver exceptional results and take your creations to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the microcontroller, making it suitable for various applications.

Surface Mount: YES

Allows for easier and more efficient PCB assembly, reducing production costs and time.

Maximum Supply Voltage: 3.6 V

Can handle higher supply voltages, offering flexibility in power supply options.

Bit Size: 32

High bit size enables processing and handling of complex data and instructions efficiently.

DAC Channels: YES

Ability to output analog signals, enabling interfacing with sensors and other analog devices.

Power Supplies (V): 3.3

Operates on a common supply voltage, simplifying power management in the system.

No. of Terminals: 64

Sufficient number of terminals for interfacing with external components and peripherals.

Minimum Supply Voltage: 3 V

Can operate at lower supply voltages, making it suitable for battery-powered applications.

Maximum Operating Temperature: 85 °C

Can withstand higher temperatures, suitable for industrial environments with varying temperature conditions.

CPU Family: ARM7

Part of a well-established CPU family known for its performance and efficiency.

Minimum Operating Temperature: -40 °C

Capable of operating in cold environments without compromising performance.

Terminal Finish: TIN

Provides good conductivity and corrosion resistance for reliable connections.

ADC Channels: YES

Ability to convert analog signals to digital data, necessary for many sensing applications.

ROM Words: 262144

Large ROM size allows for storing a significant amount of program and data information.

Maximum Seated Height: 1.6 mm

Low profile design saves space and allows for compact product designs.

Width: 10 mm

Compact width dimension for space-constrained applications.

Maximum Clock Frequency: 25 MHz

High clock frequency for fast processing and operation.

Maximum Time At Peak Reflow Temperature (s): 30

Ensures proper soldering during assembly process within a specified time.

Peak Reflow Temperature °C: 260

Suitable reflow temperature for soldering processes without damage to the microcontroller.

Length: 10 mm

Compact length dimension, contributing to the overall small footprint of the product.

Temperature Grade: INDUSTRIAL

Designed to operate reliably in industrial environments with demanding conditions.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture for efficient and streamlined processing of instructions.

RAM Bytes: 40960

Sufficient RAM capacity for storage and manipulation of data during operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminals provide reliable and secure connections to the PCB.

Maximum Supply Current: 90 mA

Low supply current requirement for energy-efficient operation.

Nominal Supply Voltage: 3.3 V

Stable supply voltage for consistent performance of the microcontroller.

PWM Channels: YES

Capability to generate PWM signals for controlling various functions like motor speed or LED brightness.

ROM Programmability: FLASH

Flash ROM allows for easy programming and updating of firmware in the microcontroller.

Terminal Pitch: 0.5 mm

Fine pitch terminals for increased density and miniaturization of the PCB layout.

Speed: 60 rpm

Operates at a moderate speed suitable for various real-time applications.

No. of I/O Lines: 45

Sufficient number of I/O lines for connecting to external devices and peripherals.

Technical Specifications

Microcontrollers LPC2146FBD64,151 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

YES

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e3

Length:

10 mm

Moisture Sensitivity Level (MSL):

1

No. of I/O Lines:

45

No. of Terminals:

64

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

QFP64,.47SQ,20

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

RAM Bytes:

40960

ROM Words:

262144

ROM Programmability:

FLASH

Maximum Seated Height:

1.6 mm

Speed:

60 rpm

Sub-Category:

Microcontrollers

Maximum Supply Current:

90 mA

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

10 mm

Peripheral IC Type:

Trade Compliance

LPC2146FBD64,151 Peripheral ICs trade compliance attributes, and parameters.

ECCN

3A991.A.2

ECCN Governance

EAR

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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