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LPC2103FHN48,551

NXP Semiconductors

LPC2103FHN48,551 by NXP Semiconductors

NXP Semiconductors' LPC2103FHN48,551 is a 32-bit ARM7 microcontroller with 1.65-1.95V supply voltage range and 25MHz clock frequency for industrial applications. Featuring 8192 bytes of RAM, FLASH ROM programmability, and 32 I/O lines, it's ideal for high-speed data processing in compact designs with its small form factor (6x6mm) and low power consumption.

Median Price

$1.404

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 25 parts In-Stock

1+ parts

$1.404

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25

$1.404

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Vyrian

USA . 6,854 parts In-Stock

1+ parts

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6,854

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Anansix

USA . 2,502 parts In-Stock

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Digiode

USA . 1,427 parts In-Stock

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1,427

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Distributors (Availability)

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Argo Parts USA

USA . 3,503 parts In-Stock

1+ parts

$1.404

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3,503

$1.404

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Continental Prestige Electronics

USA . 3,482 parts In-Stock

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$1.404

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$1.376

3,482

$1.404

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$1.376

Netroflash

USA . 50 parts In-Stock

1+ parts

$1.404

100+ parts

$1.376

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50

$1.404

$1.376

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Microchip USA

USA . 183 parts In-Stock

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$7.121

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183

$7.121

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AZTECH Wire

Italy . 773 parts In-Stock

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$17.401

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773

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Ampacity Inc.

Singapore . 1,031 parts In-Stock

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$22.000

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$22.000

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One Stop Electronics

USA . 1,198 parts In-Stock

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$28.000

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Component Stockers USA

USA . 326 parts In-Stock

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$99.990

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326

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Corphita

USA . 1,228 parts In-Stock

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1,228

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UNI Independent Distributors

Spain . 473 parts In-Stock

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Overview

Discover the innovative LPC2103FHN48,551 by NXP Semiconductors, a top-tier microcontroller that guarantees unmatched quality and reliability. Designed for various applications in industries such as automotive, consumer electronics, and industrial automation, this product offers exceptional value with its advanced features and cutting-edge technology. Experience seamless performance and enhanced functionality with the LPC2103FHN48,551, setting new standards in the world of microcontrollers. Elevate your projects to new heights with this superior product from a trusted manufacturer like NXP Semiconductors.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and lightweight, making the microcontroller suitable for a variety of applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving time and cost in production.

Maximum Supply Voltage: 1.95 V

Low maximum supply voltage helps in minimizing power consumption and reducing heat dissipation.

Package Shape: SQUARE

Square package shape saves space on the PCB and allows for efficient component placement.

Bit Size: 32

32-bit architecture provides high computational power and performance for advanced applications.

Power Supplies (V): 1.8,3.3

Multiple power supply options cater to different voltage requirements and offer flexibility in system design.

No. of Terminals: 48

A higher number of terminals allow for more connectivity options and integration of peripherals.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Various package styles offer versatility in mounting options and thermal management for optimal performance.

Minimum Supply Voltage: 1.65 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 85 °C

High operating temperature range allows the microcontroller to function reliably in industrial environments.

CPU Family: ARM7

ARM architecture is known for its energy efficiency and high processing capabilities, making the microcontroller suitable for power-sensitive applications.

Minimum Operating Temperature: -40 °C

Wide temperature range ensures the microcontroller can operate in harsh environments without performance degradation.

ADC Channels: YES

Analog-to-digital converter channels enable the microcontroller to interface with sensors and other analog devices.

Terminal Position: QUAD

Quad terminal position enhances connectivity and ease of soldering during assembly.

ROM Words: 32768

Large ROM capacity allows for storing programs and data, enabling the microcontroller to run complex applications.

Maximum Seated Height: 1 mm

Low seated height facilitates compact PCB designs and reduces the overall profile of the device.

Width: 6 mm

Narrow width saves space on the PCB and allows for efficient board layout.

Maximum Clock Frequency: 25 MHz

High clock frequency provides fast processing speed, making the microcontroller suitable for real-time applications.

Maximum Time At Peak Reflow Temperature (s): 30

Efficient reflow process with a short time at peak temperature ensures reliable solder connection during assembly.

Peak Reflow Temperature °C: 260

High peak reflow temperature ensures proper solder melting and joint formation for secure connections.

Length: 6 mm

Compact length conserves space on the PCB and allows for tight integration in small form factor devices.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliable operation in rugged environments with temperature fluctuations.

Peripheral IC Type: MICROCONTROLLER, RISC

RISC architecture provides efficient and streamlined operation for faster processing and reduced power consumption.

RAM Bytes: 8192

Sufficient RAM capacity enables the microcontroller to hold data and program instructions for smooth operation.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, enhancing the overall efficiency of the microcontroller.

Terminal Form: NO LEAD

No lead terminal form is environmentally friendly and promotes RoHS compliance in electronic designs.

Nominal Supply Voltage: 1.8 V

Stable nominal supply voltage ensures consistent performance and reliable operation of the microcontroller.

PWM Channels: YES

Pulse-width modulation channels enable precise control of connected devices such as motors, LEDs, and other peripherals.

ROM Programmability: FLASH

Flash ROM programmability allows for easy and quick updates to the microcontroller firmware, facilitating maintenance and upgrades.

Terminal Pitch: 0.4 mm

Fine terminal pitch allows for high-density PCB layouts and miniaturization of electronic devices.

Moisture Sensitivity Level (MSL): 2

MSL level 2 indicates that the microcontroller is moisture resistant, ensuring reliable performance in various environments.

Speed: 70 rpm

High-speed processing capability makes the microcontroller suitable for applications that require quick data processing and response times.

No. of I/O Lines: 32

A high number of I/O lines provide flexibility in interfacing with external devices and peripherals for versatile functionality.

Technical Specifications

Microcontrollers LPC2103FHN48,551 attributes and parameters. Explore more Microcontrollers devices from NXP Semiconductors

Specs

ADC Channels:

YES

Additional Features:

ALSO REQUIRES 3.3 V SUPPLY

Address Bus Width:

0

Bit Size:

32

CPU Family:

ARM7

Maximum Clock Frequency:

25 MHz

DAC Channels:

NO

DMA Channels:

NO

External Data Bus Width:

0

JESD-30 Code:

S-PQCC-N48

JESD-609 Code:

e4

Length:

6 mm

Moisture Sensitivity Level (MSL):

2

No. of I/O Lines:

32

No. of Terminals:

48

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

PWM Channels:

YES

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8,3.3

Qualification:

Not Qualified

RAM Bytes:

8192

ROM Words:

32768

ROM Programmability:

FLASH

Maximum Seated Height:

1 mm

Speed:

70 rpm

Sub-Category:

Microcontrollers

Maximum Supply Voltage:

1.95 V

Minimum Supply Voltage:

1.65 V

Nominal Supply Voltage:

1.8 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

6 mm

Peripheral IC Type:

Trade Compliance

LPC2103FHN48,551 Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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