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IP4256CZ6-F,115

NXP Semiconductors

IP4256CZ6-F,115 by NXP Semiconductors

IP4256CZ6-F,115 from NXP Semiconductors is a surface mount data line filter with 6 terminals. It operates b/w -40 °C and 85 °C, featuring a durable plastic package with tin terminal finish. Ideal for protecting sensitive electronics from noise and interference.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Chip Stock

USA . 179,000 parts In-Stock

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Vyrian

USA . 3,794 parts In-Stock

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Digiode

USA . 1,832 parts In-Stock

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Anansix

USA . 771 parts In-Stock

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Inventory MP

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Bristol Electronics

USA . 274 parts In-Stock

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274

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Advanced Electronics

New Zealand . 484 parts In-Stock

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$1.024

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$1.014

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$0.973

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484

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One Stop Electronics

USA . 187 parts In-Stock

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$2.400

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AZTECH Wire

Italy . 280 parts In-Stock

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$15.610

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Component Stockers USA

USA . 479 parts In-Stock

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$99.990

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Corphita

USA . 4,794 parts In-Stock

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UNI Independent Distributors

Spain . 3,688 parts In-Stock

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Overview

Unlock superior performance with the IP4256CZ6-F,115 from NXP Semiconductors, a leader in innovative technology. Designed for data line filtering, this robust solution ensures optimal signal integrity while protecting sensitive electronics from noise and interference. With a wide operating temperature range, it excels in diverse applications, making it ideal for automotive, industrial, and consumer electronics. Trust NXP’s commitment to quality and elevate your projects today!

Feature Benefit Bullets

No. of Terminals: 6

With 6 terminals, this data line filter provides versatility in connection options, facilitating ease of integration into various designs.

Filter Type: DATA LINE FILTER

As a data line filter, it effectively reduces electromagnetic interference, ensuring reliable signal transmission and increased performance.

Maximum Operating Temperature: 85 °C

The ability to operate at a maximum temperature of 85 °C ensures that this product can withstand elevated thermal environments typical in various applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this filter is suitable for extreme environments, making it ideal for outdoor or harsh conditions.

Terminal Finish: Tin (Sn)

The use of tin for the terminal finish enhances corrosion resistance and ensures reliable electrical connections over time.

Mounting Type: SURFACE MOUNT

Being a surface mount device allows for simplified assembly processes, enabling compact designs and saving board space.

Package Material: PLASTIC

The use of durable plastic packaging provides excellent protection against physical damage while keeping the product lightweight and easy to handle.

Technical Specifications

Data Line Filters IP4256CZ6-F,115 attributes and parameters. Explore more Data Line Filters devices from NXP Semiconductors

Specs

Filter Type:

JESD-609 Code:

e3

Mounting Type:

SURFACE MOUNT

No. of Terminals:

6

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Material:

PLASTIC

Sub-Category:

Data Line Filters

Terminal Finish:

Tin (Sn)

Trade Compliance

IP4256CZ6-F,115 Filters trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8504.50.80.00

SB

8504.50.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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