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IP4221CZ6-S,115

NXP Semiconductors

IP4221CZ6-S,115 by NXP Semiconductors

NXP Semiconductors' IP4221CZ6-S,115 is a Zener diode with 7.5V breakdown voltage and 9V max breakdown voltage. It is a single-config transient suppression device in chip carrier package for unidirectional polarity protection applications. The diode is surface mountable with 6 terminals and made of silicon material, suitable for various electronic circuits requiring voltage regulation.

Median Price

$0.375

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,900 parts In-Stock

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$0.375

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$0.188

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$0.075

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$0.375

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Chip Stock

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Cyclops Electronics Ltd

UK . 25,000 parts In-Stock

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Vyrian

USA . 7,589 parts In-Stock

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Digiode

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Microfarads

USA . 1,767 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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Anansix

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Sensible Micro Corp

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Corohmni

South Africa . 372 parts In-Stock

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$0.030

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Aztec Data Supply Inc.

USA . 129 parts In-Stock

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$0.048

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One Stop Electronics

USA . 620 parts In-Stock

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$1.010

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Ampacity Inc.

Singapore . 930 parts In-Stock

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$3.010

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AZTECH Wire

Italy . 9,866 parts In-Stock

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UNI Independent Distributors

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Continental Prestige Electronics

USA . 5,276 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,844 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

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Supply Digital

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Argo Parts USA

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Perfect Parts

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Aranea Global

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Overview

Discover the superior quality and reliability of the IP4221CZ6-S,115 by NXP Semiconductors, a leading manufacturer in the industry. This Transient Suppression Device offers unmatched protection against voltage spikes, ensuring the smooth operation of your electronic devices. With its advanced Zener diode technology and unidirectional polarity, this chip carrier package is perfect for a wide range of applications. Trust NXP Semiconductors to deliver top-notch performance and peace of mind with the IP4221CZ6-S,115.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, providing good protection against external elements.

Config: SINGLE

The single configuration simplifies installation and reduces the chances of errors during setup.

Surface Mount: YES

Being surface mountable allows for easy and secure mounting on circuit boards, making it ideal for compact electronic applications.

Nominal Breakdown Voltage: 7.5 V

The nominal breakdown voltage ensures effective suppression of transient voltage spikes within the specified range.

Package Shape: RECTANGULAR

The rectangular shape provides easy integration into circuit layouts and ensures a space-efficient design.

No. of Terminals: 6

Having 6 terminals allows for versatile connectivity options and better control over the circuit configuration.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers secure mounting and protection for the diode element, enhancing the product's reliability.

Terminal Finish: TIN

The tin terminal finish provides good conductivity and corrosion resistance, ensuring stable performance over time.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy access and soldering during assembly, simplifying the installation process.

Minimum Breakdown Voltage: 6 V

The minimum breakdown voltage ensures reliable protection against voltage surges below this threshold, safeguarding sensitive components.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures proper soldering and prevents overheating of the device during assembly.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C allows for efficient soldering without damaging the diode element or the package.

Maximum Breakdown Voltage: 9 V

The maximum breakdown voltage of 9 V provides additional protection against high voltage spikes, enhancing the product's reliability.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The Trans Voltage Suppressor Diode type ensures effective clamping of transient voltages and prevents damage to connected devices.

Technology: ZENER

The Zener technology offers stable and precise voltage regulation, making the product suitable for a wide range of electronic applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and reduces the risk of short circuits, enhancing the reliability of the product.

Polarity: UNIDIRECTIONAL

The unidirectional polarity ensures that the device only conducts in one direction, providing efficient protection against voltage transients.

Diode Element Material: SILICON

The use of silicon as the diode element material ensures high reliability, low leakage current, and consistent performance over a wide temperature range.

Technical Specifications

Transient Suppression Devices IP4221CZ6-S,115 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Additional Features:

ULTRA LOW CAPACITANCE

Maximum Breakdown Voltage:

9 V

Minimum Breakdown Voltage:

6 V

Nominal Breakdown Voltage:

7.5 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N6

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Sub-Category:

Transient Suppressors

Surface Mount:

YES

Technology:

ZENER

Terminal Finish:

TIN

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

IP4221CZ6-S,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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