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IP4234CZ6

NXP Semiconductors

IP4234CZ6 by NXP Semiconductors

IP4234CZ6 by NXP Semiconductors is a single transient suppression device with a max non-repetitive peak reverse power dissipation of 100W. It features a min breakdown voltage of 6V and max breakdown voltage of 9V, making it ideal for protecting electronic circuits from voltage spikes in various applications.

Median Price

$0.600

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 4,939 parts In-Stock

1+ parts

$0.600

100+ parts

$0.300

1k+ parts

$0.120

10k+ parts

$0.090

4,939

$0.600

$0.300

$0.120

$0.090

Chip Stock

USA . 195,500 parts In-Stock

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195,500

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Semi Source

USA . 3,894 parts In-Stock

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3,894

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Digiode

USA . 3,656 parts In-Stock

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3,656

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Vyrian

USA . 3,289 parts In-Stock

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3,289

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Inventory MP

USA . 3,000 parts In-Stock

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3,000

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Greenchips

USA . 2,962 parts In-Stock

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2,962

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SIE Connect GmbH - GreenChips

Germany . 2,962 parts In-Stock

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2,962

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Dan-Mar Components

USA . 2,554 parts In-Stock

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2,554

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Anansix

USA . 2,475 parts In-Stock

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2,475

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Microfarads

USA . 2,218 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,483 parts In-Stock

1+ parts

$0.090

100+ parts

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1,483

$0.090

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Corohmni

South Africa . 67 parts In-Stock

1+ parts

$0.112

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67

$0.112

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Ampacity Inc.

Singapore . 590 parts In-Stock

1+ parts

$1.010

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590

$1.010

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One Stop Electronics

USA . 1,543 parts In-Stock

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$2.010

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1,543

$2.010

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Semicontronic

India . 698 parts In-Stock

1+ parts

$3.010

100+ parts

$2.935

1k+ parts

$2.920

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698

$3.010

$2.935

$2.920

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AZTECH Wire

Italy . 12,628 parts In-Stock

1+ parts

$12.119

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12,628

$12.119

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Kepictronics

USA . 39,819 parts In-Stock

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A-Z Elektronik GmbH

Germany . 11,882 parts In-Stock

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ChipstoGo Electronic ltd

UK . 8,999 parts In-Stock

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Corphita

USA . 3,945 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Futuretech Components

Singapore . 3,000 parts In-Stock

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UNI Independent Distributors

Spain . 2,981 parts In-Stock

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Lixinc

USA . 2,427 parts In-Stock

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Argo Parts USA

USA . 2,011 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,921 parts In-Stock

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Supply Digital

USA . 1,628 parts In-Stock

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1,628

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Infinite Electronics LLP (Excess)

. 1,006 parts In-Stock

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1,006

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Continental Prestige Electronics

USA . 207 parts In-Stock

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207

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Formix International (Excess)

India . 85 parts In-Stock

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85

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Overview

Experience superior surge protection with the IP4234CZ6 by NXP Semiconductors. As a leader in semiconductor technology, NXP ensures top-quality transient suppression devices for a wide range of applications. With its high power dissipation capability and durable plastic/epoxy body, this single-configured device offers reliable protection against voltage spikes. Say goodbye to downtime and costly repairs with the IP4234CZ6 - your go-to solution for safeguarding your electronics.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, perfect for applications where weight and durability are important factors.

Configuration: SINGLE

The single configuration simplifies the design and installation process, making it easier to incorporate into circuits.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs during production.

Maximum Non Repetitive Peak Reverse Power Dissipation: 100 W

With a high peak power dissipation value, this device can effectively handle transient surges and protect sensitive components in a circuit.

Package Shape: RECTANGULAR

The rectangular shape provides a compact and space-saving design, ideal for applications where board space is limited.

No. of Terminals: 6

The six terminals offer flexibility in connecting the device within a circuit, allowing for versatile integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style reduces the overall footprint of the device, making it suitable for compact electronic devices.

Terminal Finish: Tin (Sn)

The tin terminal finish provides excellent solderability and corrosion resistance, ensuring a reliable connection in various operating conditions.

Terminal Position: DUAL

The dual terminal position offers flexibility in mounting and orientation, allowing for ease of installation in different applications.

Minimum Breakdown Voltage: 6 V

The minimum breakdown voltage of 6V ensures effective protection against voltage spikes and overvoltage conditions, enhancing the reliability of the circuit.

Maximum Time At Peak Reflow Temperature (s): 30

With a maximum reflow time of 30 seconds at peak temperature, the device can withstand the soldering process without compromising its performance.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C ensures proper soldering and reliability during assembly processes.

Maximum Breakdown Voltage: 9 V

The maximum breakdown voltage of 9V provides an additional safety margin, offering robust protection against voltage fluctuations.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The trans voltage suppressor diode design efficiently clamps voltage spikes and protects sensitive components in the circuit.

Technology: AVALANCHE

The avalanche technology allows for quick response and high energy handling capability, ensuring effective transient suppression in the circuit.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and mounting, enhancing the reliability and ease of assembly.

Polarity: UNIDIRECTIONAL

The unidirectional polarity of the device ensures consistent and reliable voltage clamping in one direction, providing effective protection in specific applications.

Diode Element Material: SILICON

The use of silicon diode element material offers high performance and stability, making the device a reliable choice for transient suppression applications.

Technical Specifications

Transient Suppression Devices IP4234CZ6 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Additional Features:

LOW CAPACITANCE

Maximum Breakdown Voltage:

9 V

Minimum Breakdown Voltage:

6 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

100 W

No. of Elements:

1

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity:

UNIDIRECTIONAL

Qualification:

Not Qualified

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

Tin (Sn)

Terminal Form:

Terminal Position:

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

IP4234CZ6 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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