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IP4242CZ6,115

NXP Semiconductors

IP4242CZ6,115 by NXP Semiconductors

The NXP Semiconductors IP4242CZ6,115 is a unidirectional TRANS VOLTAGE SUPPRESSOR DIODE with 6-9V breakdown voltage. It comes in a CHIP CARRIER package and uses AVALANCHE technology. Ideal for transient suppression applications requiring compact surface mount devices.

Median Price

$0.052

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 74,030 parts In-Stock

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-

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$0.054

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$0.045

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$0.040

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$0.054

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$0.040

Verical

USA . 60,000 parts In-Stock

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$0.050

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$0.050

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Nova Conductors

Japan . 32 parts In-Stock

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$0.019

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Digiode

USA . 2,063 parts In-Stock

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DigiKey Marketplace

USA . 144,030 parts In-Stock

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Vyrian

USA . 8,252 parts In-Stock

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Anansix

USA . 507 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 50 parts In-Stock

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Ampacity Inc.

Singapore . 136,988 parts In-Stock

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Continental Prestige Electronics

USA . 146,186 parts In-Stock

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Argo Parts USA

USA . 4,652 parts In-Stock

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Corphita

USA . 394 parts In-Stock

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AZTECH Wire

Italy . 1,015 parts In-Stock

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$12.720

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UNI Independent Distributors

Spain . 5,528 parts In-Stock

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Netroflash

USA . 1,000 parts In-Stock

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Perfect Parts

USA . 112 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 50 parts In-Stock

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Glotronic Ltd.

UK . 40 parts In-Stock

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Overview

Unlock the power of protection with the IP4242CZ6,115 from NXP Semiconductors. As a leading manufacturer in the industry, NXP delivers top-quality transient suppression devices that provide reliable safeguarding for your electronic systems. Ideal for a variety of applications, this product offers unbeatable value by ensuring optimal performance and longevity. Trust in NXP to keep your devices safe and secure with the IP4242CZ6,115.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides durability and protection for the internal components of the transient suppression device.

Config: SINGLE

The single configuration simplifies installation and maintenance of the transient suppression device, making it user-friendly.

Surface Mount: YES

The surface mount capability allows for easy assembly onto circuit boards, saving time and effort during the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape is space-efficient and enables the transient suppression device to fit into compact electronic devices.

No. of Terminals: 6

Having 6 terminals provides flexibility in connecting the transient suppression device within a circuit, accommodating different design requirements.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of trans voltage suppressor diodes ensures efficient transient voltage suppression, protecting sensitive electronics from voltage spikes and surges.

Technology: AVALANCHE

The avalanche technology allows for rapid response to transient voltage events, providing quick and effective protection for connected devices.

Polarity: UNIDIRECTIONAL

Unidirectional polarity ensures that the transient suppression device only conducts voltage spikes in one direction, enhancing its reliability and performance.

Diode Element Material: SILICON

The use of silicon as the diode element material enhances the efficiency and durability of the transient suppression device, ensuring long-lasting protection for electronic components.

Technical Specifications

Transient Suppression Devices IP4242CZ6,115 attributes and parameters. Explore more Transient Suppression Devices devices from NXP Semiconductors

Specs

Maximum Breakdown Voltage:

9 V

Minimum Breakdown Voltage:

6 V

Config:

SINGLE

Diode Element Material:

SILICON

JEDEC-95 Code:

MO-252

JESD-30 Code:

R-PBCC-N6

No. of Elements:

1

No. of Terminals:

6

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

UNIDIRECTIONAL

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

IP4242CZ6,115 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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