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ICM7555CD

NXP Semiconductors

ICM7555CD by NXP Semiconductors

ICM7555CD by NXP Semiconductors is a CMOS analog waveform generator with a max output frequency of 0.5 GHz and operates b/w 3-16 V. It features an 8-terminal gull-wing package, suitable for compact applications. Ideal for pulse generation in commercial electronics.

Median Price

$0.741

Lifecycle Status

Suppliers In-Stock

30

In-Stock Inventory

1k+

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Freelance Electronics

USA . 390 parts In-Stock

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$0.331

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$0.397

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Component Electronics Inc.

Canada . 70 parts In-Stock

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$0.870

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Electronics Depot

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Sensible Micro Corp

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Vyrian

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Digiode

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Sunrise Surplus Inc.

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PC Components Company LLC

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LIBRA Elektronik GmbH

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ComSIT Distribution GmbH

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Mentor Electronics Marketing, LLC

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Bristol Electronics

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Inventory MP

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Connector Distribution Corp

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Right Parts Inc.

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Infinite Electronics LLP

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J2 Sourcing AB

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Global Solutions Electronics Company

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One Stop Electronics

USA . 1,515 parts In-Stock

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Kepictronics

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Futuretech Components

Singapore . 810 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the potential of your designs with the ICM7555CD from NXP Semiconductors, a trusted leader in innovative analog solutions. This high-performance waveform generator delivers unparalleled stability and efficiency, ideal for diverse applications from timers to oscillators. With its compact design and robust features, you can achieve precise control while saving space and energy. Elevate your projects with NXP’s commitment to quality and reliability – experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight materials ensure longevity and reliability in various applications.

Surface Mount: YES

Supports modern manufacturing processes, ensuring a smaller footprint and easier placement on PCBs.

Package Shape: RECTANGULAR

Optimized for space-saving designs in compact electronic devices.

Nominal Supply Voltage (Vsup): 5 V

Standard voltage that simplifies integration with common digital systems.

Maximum Output Frequency: 0.5 GHz

High frequency output capability makes it suitable for advanced communication applications.

Power Supplies (V): 5/15

Versatility in supply voltage options allows for wide-ranging applications.

No. of Terminals: 8

Adequate number of terminals to support multiple connections while maintaining simplicity.

Package Style (Meter): SMALL OUTLINE

Compact design facilitates integration into space-constrained electronic devices.

Maximum Operating Temperature: 70 °C

Ensures reliable operation in various commercial environments without thermal issues.

Minimum Operating Temperature: 0 °C

Wide operating temperature range enhances usability in different climatic conditions.

Terminal Position: DUAL

Dual terminal positioning allows for flexible PCB layout options.

Maximum Seated Height: 1.75 mm

Low profile design contributes to compact overall product design.

Width: 3.9 mm

Narrow width supports tighter packing of components on the PCB.

Other IC type: PULSE

Supports pulse generation applications, making it suitable for a variety of signal processing tasks.

Minimum Supply Voltage (Vsup): 3 V

Allows flexible design choices with low-voltage operation for energy-efficient applications.

Maximum Time At Peak Reflow Temperature: 40 s

Extended duration tolerance ensures reliable soldering during assembly processes.

Peak Reflow Temperature: 260 °C

High reflow temperature tolerance supports compatibility with a wide range of PCB manufacturing processes.

Length: 4.9 mm

Compact length contributes to designs where space is a premium.

Temperature Grade: COMMERCIAL

Suitable for a wide range of commercial applications; reliable performance in non-industrial settings.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-powered devices.

Terminal Form: GULL WING

Gull wing terminals facilitate automated PCB assembly processes and improve solder joint reliability.

Terminal Pitch: 1.27 mm

Standard pitch size allows compatibility with most PCB layouts and component placements.

Maximum Supply Voltage (Vsup): 16 V

High maximum supply voltage provides flexibility in design for various power requirements.

Technical Specifications

Analog Waveform Generation ICM7555CD attributes and parameters. Explore more Analog Waveform Generation devices from NXP Semiconductors

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G8

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Frequency:

.5 GHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Analog Waveform Generation Functions

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width (mm):

3.9 mm

Trade Compliance

ICM7555CD Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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