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HEF4515BT,652

NXP Semiconductors

HEF4515BT,652 by NXP Semiconductors

OTHER DECODER/DRIVER; Temperature Grade: INDUSTRIAL; Terminal Form: GULL WING; No. of Terminals: 24; Package Code: SOP; Package Shape: RECTANGULAR;

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,223 parts In-Stock

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Vyrian

USA . 2,640 parts In-Stock

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Anansix

USA . 97 parts In-Stock

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97

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Distributors (Availability)

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Northwest PG Solutions

USA . 680 parts In-Stock

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$2.475

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680

$2.475

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AZTECH Wire

Italy . 791 parts In-Stock

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$14.870

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791

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Advanced Electronics

New Zealand . 800 parts In-Stock

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$22.211

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$21.989

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$21.100

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800

$22.211

$21.989

$21.100

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One Stop Electronics

USA . 1,128 parts In-Stock

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$26.000

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Microchip USA

USA . 181 parts In-Stock

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$34.011

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181

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Component Stockers USA

USA . 543 parts In-Stock

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$99.990

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UNI Independent Distributors

Spain . 6,077 parts In-Stock

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Corphita

USA . 4,772 parts In-Stock

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Native Components

USA . 539 parts In-Stock

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$2.182

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Technical Specifications

Decoder & Drivers HEF4515BT,652 attributes and parameters. Explore more Decoder & Drivers devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e4

Length:

15.4 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

550 ns

Propagation Delay (tpd):

520 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Decoder/Drivers

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

HEF4515BT,652 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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