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HEF4512BP

NXP Semiconductors

HEF4512BP by NXP Semiconductors

MULTIPLEXER; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 16; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$4.838

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

American Microsemiconductor Inc.

USA . 66 parts In-Stock

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$5.550

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Digiode

USA . 4,708 parts In-Stock

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Vyrian

USA . 3,234 parts In-Stock

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Anansix

USA . 1,975 parts In-Stock

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ECAB

Sweden . 344 parts In-Stock

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344

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Carlin Systems, Inc.

USA . 236 parts In-Stock

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J2 Sourcing AB

Sweden . 94 parts In-Stock

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ComSIT Distribution GmbH

Germany . 55 parts In-Stock

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Component Sense

UK . 39 parts In-Stock

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$4.125

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$4.125

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$4.125

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$4.125

$4.125

Kronex Distribution GmbH

USA . 26 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 25 parts In-Stock

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Sinequanon

UK . 25 parts In-Stock

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Huijzer Components

Netherlands . 25 parts In-Stock

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MRC Electronics

USA . 24 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 16 parts In-Stock

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LittleDiode

UK . 1 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 891 parts In-Stock

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$0.730

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891

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Northwest PG Solutions

USA . 2,131 parts In-Stock

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$0.803

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One Stop Electronics

USA . 1,052 parts In-Stock

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$62.000

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UNI Independent Distributors

Spain . 5,352 parts In-Stock

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Corphita

USA . 1,741 parts In-Stock

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Perfect Parts

USA . 535 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 239 parts In-Stock

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Glotronic Ltd.

UK . 171 parts In-Stock

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Assy Fe

Spain . 4 parts In-Stock

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Technical Specifications

Multiplexer & Demultiplexer HEF4512BP attributes and parameters. Explore more Multiplexer & Demultiplexer devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T16

Length:

21.6 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

No. of Functions:

1

No. of Inputs:

8

No. of Outputs:

1

No. of Terminals:

16

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

300 ns

Propagation Delay (tpd):

200 ns

Qualification:

Not Qualified

Maximum Seated Height:

4.7 mm

Sub-Category:

Multiplexer/Demultiplexers

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4512BP Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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