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HEF4082BP,652

NXP Semiconductors

HEF4082BP,652 by NXP Semiconductors

AND GATE; Temperature Grade: INDUSTRIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 14; Package Code: DIP; Package Shape: RECTANGULAR;

Median Price

$0.734

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,396 parts In-Stock

1+ parts

-

100+ parts

$0.721

1k+ parts

$0.599

10k+ parts

$0.534

5,396

-

$0.721

$0.599

$0.534

Verical

USA . 2,371 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.748

10k+ parts

$0.667

2,371

-

-

$0.748

$0.667

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,439 parts In-Stock

1+ parts

$0.288

100+ parts

-

1k+ parts

-

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-

2,439

$0.288

-

-

-

Vyrian

USA . 3,614 parts In-Stock

1+ parts

-

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-

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3,614

-

-

-

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Anansix

USA . 454 parts In-Stock

1+ parts

-

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454

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LIBRA Elektronik GmbH

Germany . 43 parts In-Stock

1+ parts

-

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43

-

-

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,535 parts In-Stock

1+ parts

$0.273

100+ parts

-

1k+ parts

-

10k+ parts

-

1,535

$0.273

-

-

-

Component Stockers USA

USA . 7,770 parts In-Stock

1+ parts

$0.310

100+ parts

$0.290

1k+ parts

$0.260

10k+ parts

-

7,770

$0.310

$0.290

$0.260

-

Microchip USA

USA . 131 parts In-Stock

1+ parts

$0.431

100+ parts

-

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131

$0.431

-

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AZTECH Wire

Italy . 628 parts In-Stock

1+ parts

$18.710

100+ parts

-

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628

$18.710

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Perfect Parts

USA . 15,680 parts In-Stock

1+ parts

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15,680

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UNI Independent Distributors

Spain . 2,940 parts In-Stock

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2,940

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Northwest PG Solutions

USA . 912 parts In-Stock

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912

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Native Components

USA . 344 parts In-Stock

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344

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Technical Specifications

Logic Gates HEF4082BP,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

No. of Functions:

2

No. of Inputs:

4

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

125 ns

Propagation Delay (tpd):

125 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4082BP,652 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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