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HEF4023BP,652

NXP Semiconductors

HEF4023BP,652 by NXP Semiconductors

HEF4023BP,652 by NXP Semiconductors is a CMOS logic gate with 3 functions and 3 inputs. It has a propagation delay of 135 ns and operates at a nominal voltage of 5V. This IC is commonly used in industrial applications due to its temperature grade and through-hole terminal form.

Median Price

$0.309

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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Digiode

USA . 3,944 parts In-Stock

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Vyrian

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ACDS - Activité Composants Distribution Service

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Ampacity Inc.

Singapore . 14 parts In-Stock

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Corphita

USA . 1,724 parts In-Stock

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Corohmni

South Africa . 708 parts In-Stock

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AZTECH Wire

Italy . 753 parts In-Stock

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Microchip USA

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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Aztec Data Supply Inc.

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QUARKTWIN TECHNOLOGY LTD

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Overview

Discover the HEF4023BP,652 by NXP Semiconductors - a cutting-edge logic gates solution that offers unmatched quality and performance. Manufactured by the renowned NXP Semiconductors, this product is built to deliver exceptional reliability and precision in various applications. With its three functions and three inputs, it brings versatility and flexibility to your projects. Designed with customer satisfaction in mind, the HEF4023BP,652 provides unbeatable value, benefits, and advantages. Experience seamless integration, fast propagation delay, and a wide operating temperature range of -40°C to 85°C. Unlock new possibilities with this high-quality logic gates solution.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides high durability and protection for the logic gates, making them resistant to external elements and ensuring a longer lifespan.

Propagation Delay At Nominal Supply:

135 ns - With a low propagation delay, this product can quickly process input signals, resulting in efficient and timely logic gate operations.

No. of Functions:

3 - Having multiple functions allows for versatile use of this logic gate product, making it suitable for various applications and reducing the need for additional components.

No. of Inputs:

3 - With three inputs, this logic gate can handle multiple input signals simultaneously, enabling complex logical operations and increasing its flexibility.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for easy integration and placement within electronic circuits, optimizing space utilization and facilitating assembly.

Nominal Supply Voltage / Vsup (V):

5 - Operating at a standard supply voltage of 5V, this logic gate product is compatible with commonly used power sources, ensuring compatibility and ease of use.

Load Capacitance (CL):

50 pF - The specified load capacitance ensures that this logic gate can handle a certain amount of external capacitance, ensuring reliable signal transmission and minimizing signal distortion.

Power Supplies (V):

5/15 - This product can operate with dual power supplies of 5V or 15V, providing flexibility in system design and integration with different power configurations.

No. of Terminals:

14 - With 14 terminals, this logic gate offers sufficient connectivity options, allowing for easy interconnection with other components in electronic circuits.

Package Style (Meter):

IN-LINE - The in-line package style makes this logic gate product easy to install and connect in linear circuit configurations, simplifying assembly and enhancing circuit layout flexibility.

Maximum I (ol):

0.36 Amp - With a maximum output current of 0.36 Amps, this logic gate is capable of driving various loads, providing versatility and compatibility with different circuit requirements.

Propagation Delay (tpd):

135 ns - The specified propagation delay ensures that this logic gate can process input signals within a reasonable time frame, enabling efficient data processing and accurate logical operations.

Maximum Operating Temperature:

85 °C - This high maximum operating temperature allows the logic gates to withstand demanding environments, ensuring reliable operation even in extreme temperature conditions.

Minimum Operating Temperature:

40 °C - The specified minimum operating temperature ensures that this logic gate can function reliably even in cold environments, expanding its range of possible applications.

Terminal Finish:

NICKEL PALLADIUM GOLD - The nickel palladium gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections, enhancing the durability and longevity of the logic gates.

Terminal Position:

DUAL - The dual terminal position offers flexibility in circuit board design, allowing for various orientation options and facilitating convenient integration into different electronic systems.

Maximum Seated Height:

4.2 mm - With a low maximum seated height, this logic gate product minimizes interference with neighboring components and enables compact circuit designs.

Width:

7.62 mm - The specified width of this logic gate allows for efficient space utilization within electronic circuits, optimizing layout and reducing the overall size of the system.

Minimum Supply Voltage (Vsup):

3 V - This logic gate product can operate at a minimum supply voltage of 3V, providing compatibility with low-voltage circuitry and enabling energy-efficient designs.

Length:

19.025 mm - The length of this logic gate ensures compatibility with standard package sizes, enabling easy integration into existing circuit boards and reducing the need for modifications.

Temperature Grade:

INDUSTRIAL - With an industrial temperature grade, this logic gate is suitable for use in a wide range of industrial applications, providing reliable performance in demanding environments.

Technology:

CMOS - The CMOS (Complementary Metal-Oxide-Semiconductor) technology used in this logic gate offers low power consumption, high noise immunity, and compatibility with a wide range of circuit designs.

Terminal Form:

THROUGH-HOLE - The through-hole terminal form allows for easy soldering and secure mechanical attachment, ensuring reliable electrical connections and facilitating efficient assembly.

Terminal Pitch:

2.54 mm - The specified terminal pitch allows for easy integration into standard breadboards and PCBs, ensuring compatibility with commonly used electronic components and facilitating prototyping.

Maximum Supply Voltage (Vsup):

15 V - With a maximum supply voltage of 15V, this logic gate is capable of handling higher voltage systems, providing compatibility with a wider range of circuit configurations.

Technical Specifications

Logic Gates HEF4023BP,652 attributes and parameters. Explore more Logic Gates devices from NXP Semiconductors

Specs

Family:

4000/14000/40000

JESD-30 Code:

R-PDIP-T14

JESD-609 Code:

e4

Length:

19.025 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.36 Amp

No. of Functions:

3

No. of Inputs:

3

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP14,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5/15

Propagation Delay At Nominal Supply:

135 ns

Propagation Delay (tpd):

135 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

4.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

15 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

HEF4023BP,652 Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

NXP Semiconductors

NXP is a leading semiconductor company that creates cutting-edge technology to power secure connections in a smarter world. Founded in 2006, they have grown to become one of the top five global semiconductor companies and serve their customers in over 70 countries around the world.

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Management team

Executive Director, President, CEO

Kurt Sievers

Executive VP, CFO

Bill Betz

Executive VP, Chief Sales Officer

Ron Martino

Manufacturer fab locations 7

Fab name Location Fab Initiation Wafer Capacity

ICN8

Fabrication

Fab Initiation

1996

Netherlands

Nijmegen

Wafer Capacity

55,000

1996

55,000

ATMC (Austin Tech & Mfg Center)

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

30,000

1995

30,000

N/A

Fabrication

Fab Initiation

1989

Germany

Boeblingen

Wafer Capacity

1989

CHD

Fabrication

Fab Initiation

1993

USA

Chandler

Wafer Capacity

30,000

1993

30,000

OHTC

Fabrication

Fab Initiation

1991

USA

Austin

Wafer Capacity

24,000

1991

24,000

New Expansion Fab

Fabrication

Fab Initiation

2026

USA

Austin

Wafer Capacity

2026

ECHO

Fabrication

Fab Initiation

2020

USA

Chandler

Wafer Capacity

10,000

2020

10,000

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